US5504035A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
Assignee: LSI Corp
•
Filing: 1993-08-12
•
Granted: 1996-04-02
•
Expires: 2013-08-12
Abstract
Abstract A process of interconnecting a semiconductor device to a substrate wherein solder balls on the semiconductor device are fused with one side of an embedded noble metal foil within a through hole in an interposer structure. Solder balls on the substrate are fused with the metal foil within the structure window on the other side of the metal foil.
Inventors
- 👤 Michael D. Rostoker
- 👤 Nicholas F. Pasch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 23:15
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70433; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10F; H10F77/00; H10F77/40; H10F77/407; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2203/00; H05K2203/16; H05K2203/167; H05K3/303; H05K3/3489; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
191 words
A method of forming a structure for interposing between a semiconductor die having a ring-shaped pattern of solder balls on a surface thereof and a substrate having a ring-shaped pattern of solder balls on a surface thereof, comprising the steps of: forming a planar structure having through holes extending through the planar structure from one face to an opposite face for forming solder joints to conductive elements made of noble metal foil embedded within the planar structure and extending into said through holes, wherein said conductive elements delineate each of said through holes into a first portion and a second portion; placing the planar structure between a semiconductor die and a substrate, wherein first solder balls are on the semiconductor die and second solder balls are on the substrate; and forming solder joints by the first solder balls and the second solder balls within said through holes to said conductive elements, wherein each of the first solder balls fuses to one side of the noble metal foil in the first portion and each of the second solder balls fuses to another side of the noble metal foil in the second portion.
Claim 2
Independent Claim
191 words
A method of forming a structure for interposing between a semiconductor die having a ring-shaped pattern of solder balls on a surface thereof and a substrate having a ring-shaped pattern of solder balls on a surface thereof, comprising the steps of: forming a planar structure having through holes extending through the planar structure from one face to an opposite face for forming solder joints to conductive elements made of noble metal foil embedded within the planar structure and extending into said through holes, wherein said conductive elements delineate each of said through holes into a first portion and a second portion; placing the planar structure between a semiconductor die and a substrate, wherein first solder balls are on the semiconductor die and second solder balls are on the substrate; and forming solder joints by the first solder balls and the second solder balls within said through holes to said conductive elements, wherein each of the first solder balls fuses to one side of the noble metal foil in the first portion and each of the second solder balls fuses to another side of the noble metal foil in the second portion.
Claim 3
Dependent Claim
27 words
The method of claim 1, further comprising the step of forming a plurality of spaced-apart grooves ("kerfs") in at least one face of the preformed planar structure.
Claim 4
Dependent Claim
27 words
The method of claim 1, further comprising the step of forming a gap in the planar structure, extending from one face thereof to an opposite face thereof.
Claim 5
Independent Claim
161 words
A method of interconnecting a semiconductor assembly, comprising the steps of: placing a semiconductor device having first solder balls disposed in a ting shaped pattern on a face thereof onto a substrate having corresponding second solder balls disposed in a ting-shaped pattern on a face thereof with a preformed planar structure therebetween, said preformed planar structure having corresponding through holes extending therethrough; embedding conductive elements made of noble metal foil within the preformed planar structure and extending into said through holes, wherein said conductive elements delineate each of the through holes into a first portion and a second portion; and forming solder joints by the first solder balls and the second solder balls within said through holes to said conductive elements, wherein each of the first solder balls fuses to one side of the noble metal foil in the first portion and each of the second solder balls fuses to another side of the noble metal foil in the second portion.
Claim 6
Independent Claim
161 words
A method of interconnecting a semiconductor assembly, comprising the steps of: placing a semiconductor device having first solder balls disposed in a ting shaped pattern on a face thereof onto a substrate having corresponding second solder balls disposed in a ting-shaped pattern on a face thereof with a preformed planar structure therebetween, said preformed planar structure having corresponding through holes extending therethrough; embedding conductive elements made of noble metal foil within the preformed planar structure and extending into said through holes, wherein said conductive elements delineate each of the through holes into a first portion and a second portion; and forming solder joints by the first solder balls and the second solder balls within said through holes to said conductive elements, wherein each of the first solder balls fuses to one side of the noble metal foil in the first portion and each of the second solder balls fuses to another side of the noble metal foil in the second portion.
Claim 7
Dependent Claim
27 words
The method of claim 4, further comprising the step of forming a plurality of spaced-apart grooves ("kerfs") in at least one face of the preformed planar structure.
Claim 8
Dependent Claim
28 words
The method of claim 4, further comprising the step of forming a gap in the preformed planar structure, extending from one face thereof to an opposite face thereof.
References Cited (Backward Citations)
US3388301A
Cited
US3429040A
Cited
US3624462A
Cited
US3871014A
Cited
US3835531A
Cited
US3811186A
Cited
US4190855A
Cited
US4553036A
Cited
US4355463A
Cited
JPS5759996A
Cited
US4425501A
Cited
JPS57210638A
Cited
JPS5843554A
Cited
JPS58128754A
Cited
US4636631A
Cited
US4664309A
Cited
JPS6049638A
Cited
US4478915A
Cited
US4545610A
Cited
JPS61145838A
Cited
US4970575A
Cited
JPS61168926A
Cited
JPS61244035A
Cited
US4783722A
Cited
JPS61142750A
Cited
US4825284A
Cited
US4733096A
Cited
WO1987004010A1
Cited
US4700473A
Cited
US4700276A
Cited
US4827118A
Cited
JPS6352432A
Cited
US4830264A
Cited
US4811082A
Cited
JPS63174337A
Cited
US4893172A
Cited
JPS63239827A
Cited
JPS63268418A
Cited
JPS6473753A
Cited
JPS6482646A
Cited
US4944916A
Cited
JPH01155633A
Cited
US4926241A
Cited
US5039628A
Cited
US4970577A
Cited
JPH0296343A
Cited
US5077633A
Cited
US5111279A
Cited
US5168346A
Cited
US5006673A
Cited
JPH0430544A
Cited
US5149958A
Cited
US5059553A
Cited
JPH04312933A
Cited
US5258648A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-02 | 1999-10-02 | 2000-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-02 | 2003-10-02 | 2004-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-02 | 2007-10-02 | 2008-04-02 | $7700.00 | Window Closed / Lapsed |