Patent US516698A successfully refreshed from Google Patents.
US5347162A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Preformed planar structures employing embedded conductors
Assignee: LSI Corp
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Filing: 1993-08-12
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Granted: 1994-09-13
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Expires: 2013-08-12
Abstract
Abstract An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of reflow solder joints between conductive bumps on the die and corresponding conductive bumps of the substrate. In one embodiment, conductive elements embedded in the preformed planar structures extend at least partially into the through holes, forming electrical connections with the corresponding solder joints. The conductive elements can be used to electrically connect one solder joint to another within the interposer, and/or may extend beyond an edge of the interposer to provide for electrical probing of or connection to the solder joints. In one embodiment, the conductive elements are extended outside of the preformed planar structure to form "pins" or leads of the flip-chip structure. In another embodiment, a foil is disposed across a through hole, so that otherwise electro-galvanically incompatible solder balls on the die and the substrate will not corrode each other.
Inventors
- 👤 Nicholas F. Pasch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:59
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70433; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W72/00; H10W72/30; H10W74/10; H10W74/15; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/16; H05K2203/167; H05K3/303; H05K3/3489; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
164 words
A flip-chip structure, comprising: a chip having first solder balls on a face thereof; a substrate having corresponding second solder balls on a face thereof; a separate and distinct preformed planar structure disposed between the chip and the substrate, having two opposite faces, one face in contact with the chip and the opposite face in contact with the substrate; through holes extending through the preformed planar structure from the one face to the opposite face; at least one conductive element embedded within the preformed planar structure and extending only partially into at least one corresponding through hole; and at least one solder joint consisting essentially of at least one first solder ball and at least one corresponding second solder ball fused within the through holes to each other and to at least one corresponding conductive element to form an electrical connection between the at least one first solder ball, the at least one second solder ball and the at least one corresponding conductive element.
Claim 2
Dependent Claim
164 words
A flip-chip structure, comprising: a chip having first solder balls on a face thereof; a substrate having corresponding second solder balls on a face thereof; a separate and distinct preformed planar structure disposed between the chip and the substrate, having two opposite faces, one face in contact with the chip and the opposite face in contact with the substrate; through holes extending through the preformed planar structure from the one face to the opposite face; at least one conductive element embedded within the preformed planar structure and extending only partially into at least one corresponding through hole; and at least one solder joint consisting essentially of at least one first solder ball and at least one corresponding second solder ball fused within the through holes to each other and to at least one corresponding conductive element to form an electrical connection between the at least one first solder ball, the at least one second solder ball and the at least one corresponding conductive element.
Claim 3
Dependent Claim
28 words
A flip-chip structure according to claim 1, further comprising: at least one external connection point on the preformed planar structure connected to at least one corresponding conductive element.
Claim 4
Dependent Claim
20 words
A flip-chip structure according to claim 2, wherein: the at least one external connection point connects to an external cable.
Claim 5
Dependent Claim
15 words
A flip-chip structure according to claim 3, wherein: the external cable is a ribbon cable.
Claim 6
Dependent Claim
31 words
A flip-chip structure according to claim 2, wherein: the at least one connection point is connected via external conductors to at least one external connection point of another preformed planar structure.
Claim 7
Dependent Claim
75 words
A flip-chip structure according to claim 1, wherein: the through holes extend continuously from the one face of the preformed planar structure to the opposite face of the preformed planar structure; and at least some of the through holes are angled such that openings of said angled through holes on the one face of the preformed planar structure occur at points not directly opposite corresponding openings on the opposite face of the preformed planar structure.
Claim 8
Dependent Claim
81 words
A flip-chip structure according to claim 2, wherein: the at least one conductive element is a noble metal foil; and the at least one solder joint is formed from the at least one first solder ball fused to one side of the noble metal foil in the first portion of the through hole and the at least one corresponding second solder ball fused to another side of the noble metal foil in the in second portion of the corresponding through hole.
Claim 9
Dependent Claim
28 words
A flip-chip structure according to claim 7, further comprising: at least one external connection point on the preformed planar structure connected to at least one corresponding conductive element.
Claim 10
Dependent Claim
20 words
A flip-chip structure according to claim 8, wherein: the at least one external connection point connects to an external cable.
Claim 11
Dependent Claim
15 words
A flip-chip structure according to claim 9, wherein: the external cable in a ribbon cable.
Claim 12
Dependent Claim
31 words
A flip-chip structure according to claim 8, wherein: the at least one connection point is connected via external conductors to at least one external connection point of another preformed planar structure.
Claim 13
Dependent Claim
46 words
A flip-chip structure, according to claim 1, wherein: a given conductive element extends transversely across an intermediate portion of the preformed planar structure so as to have a one end extending into a one through hole and an other end extending into an other through hole.
Claim 14
Dependent Claim
214 words
A flip-chip structure, comprising: a chip having first solder balls on a face thereof; a substrate having corresponding second solder balls on a face thereof; a separate and distinct preformed planar structure disposed between the chip and the substrate, having two opposite faces, one face in contact with the chip and the opposite face in contact with the substrate; through holes extending through the preformed planar structure from the one face to the opposite face; at least one conductive element embedded midway between the one face and the opposite face of the preformed planar structure and extending fully across at least one corresponding through hole, each conductive element dividing a corresponding through hole into a first through hole portion extending from the one face of the preformed planar structure to the conductive element and a second through hole portion extending from the opposite face of the preformed planar structure to the conductive element; and at least one solder joint consisting essentially of at least one first solder ball contacting a one surface of the conductive element and a second solder ball contacting an other, opposite surface of the conductive element, thereby forming an electrical path from the first solder ball to the conductive element and from the conductive element to the second solder ball.
Claim 15
Dependent Claim
214 words
A flip-chip structure, comprising: a chip having first solder balls on a face thereof; a substrate having corresponding second solder balls on a face thereof; a separate and distinct preformed planar structure disposed between the chip and the substrate, having two opposite faces, one face in contact with the chip and the opposite face in contact with the substrate; through holes extending through the preformed planar structure from the one face to the opposite face; at least one conductive element embedded midway between the one face and the opposite face of the preformed planar structure and extending fully across at least one corresponding through hole, each conductive element dividing a corresponding through hole into a first through hole portion extending from the one face of the preformed planar structure to the conductive element and a second through hole portion extending from the opposite face of the preformed planar structure to the conductive element; and at least one solder joint consisting essentially of at least one first solder ball contacting a one surface of the conductive element and a second solder ball contacting an other, opposite surface of the conductive element, thereby forming an electrical path from the first solder ball to the conductive element and from the conductive element to the second solder ball.
Claim 16
Dependent Claim
75 words
A flip-chip structure according to claim 13, wherein: for a given through hole divided by a conductive element, the first through hole portion is coaxially aligned with the second through hole portion; and a portion of the through holes are angled such that openings of said angled through holes on the one face of the preformed planar structure occur at points not directly opposite corresponding openings on the opposite face of the preformed planar structure.
Claim 17
Dependent Claim
46 words
A flip-chip structure, according to claim 13, wherein: a given conductive element extends transversely across an intermediate portion of the preformed planar structure so as to have a one end extending into a one through hole and an other end extending into an other through hole.
Claim 18
Dependent Claim
152 words
An interconnection structure for interposition between a chip and a substrate comprising: a preformed planar structure having two opposite faces, one face contacting a chip and an other face contacting a substrate; holes extending completely through the preformed planar structure from the one face to the other face, said holes having a first portion extending from the one face of the structure to an intermediate portion of the structure, and having a second portion extending from the other face of the structure to the intermediate portion of the structure, an intermediate portion of the holes being located between said first and second portions of the holes; conductive fingers disposed within the structure and extending across the intermediate portions of the holes so as to electrically contact first solder balls extending into the through holes from the chip and to electrically contact second solder balls extending into the through holes from the substrate.
Claim 19
Dependent Claim
152 words
An interconnection structure for interposition between a chip and a substrate comprising: a preformed planar structure having two opposite faces, one face contacting a chip and an other face contacting a substrate; holes extending completely through the preformed planar structure from the one face to the other face, said holes having a first portion extending from the one face of the structure to an intermediate portion of the structure, and having a second portion extending from the other face of the structure to the intermediate portion of the structure, an intermediate portion of the holes being located between said first and second portions of the holes; conductive fingers disposed within the structure and extending across the intermediate portions of the holes so as to electrically contact first solder balls extending into the through holes from the chip and to electrically contact second solder balls extending into the through holes from the substrate.
Claim 20
Dependent Claim
27 words
A flip-chip structure according to claim 16, further comprising: external connection points on the preformed planar structure, connected within the preformed planar structure, to the conductive fingers.
Claim 21
Dependent Claim
20 words
A flip-chip structure according to claim 17, wherein: the at least one external connection point connects to an external cable.
Claim 22
Dependent Claim
15 words
A flip-chip structure according to claim 18, wherein: the external cable is a ribbon cable.
Claim 23
Dependent Claim
31 words
A flip-chip structure according to claim 17, wherein: the at least one connection point is connected via external conductors to at least one external connection point of another preformed planar structure.
References Cited (Backward Citations)
US3388301A
Cited
US3429040A
Cited
US3624462A
Cited
US3871014A
Cited
US3835531A
Cited
US3811186A
Cited
US4190855A
Cited
US4553036A
Cited
US4355463A
Cited
JPS5759996A
Cited
US4425501A
Cited
JPS57210638A
Cited
US4636631A
Cited
US4664309A
Cited
JPS6049638A
Cited
US4478915A
Cited
US4545610A
Cited
JPS61145838A
Cited
US4970575A
Cited
JPS61168926A
Cited
JPS61177753A
Cited
US4783722A
Cited
JPS61142750A
Cited
US4825284A
Cited
US4733096A
Cited
WO1987004010A1
Cited
US4700276A
Cited
US4700473A
Cited
JPS6313353A
Cited
US4827118A
Cited
JPS6352432A
Cited
US4830264A
Cited
US4811082A
Cited
JPS63239827A
Cited
JPS63268418A
Cited
JPH01155633A
Cited
US4926241A
Cited
US5039628A
Cited
US4970577A
Cited
JPH0296343A
Cited
US5077633A
Cited
US5111279A
Cited
US5168346A
Cited
US5006673A
Cited
JPH043544A
Cited
US5149958A
Cited
US5059553A
Cited
JPH04312933A
Cited
US5258648A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-12 | 1998-03-14 | 1998-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-12 | 2002-03-14 | 2002-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-12 | 2006-03-14 | 2006-09-13 | $7700.00 | Window Closed / Lapsed |