Method for patterning metallo-organic percursor film and method for producing a patterned ceramic film and film products

Claim 1

A method for producing a patterned ceramic or metal film comprising: producing a metallo-organic decomposition film, said decomposition film being soluble under first solvent etching conditions, said decomposition film being capable of being rendered insoluble under said first solvent etching conditions by ion implantation, depositing a protective layer over said decomposition film, said protective layer being soluble under second solvent etching conditions and substantially insoluble under said first solvent etching conditions, said protective layer being capable of transmitting an ion beam sufficiently energetic to fully implant said decomposition film, depositing a metal blocking layer over said protective layer, said blocking layer being capable of blocking said ion beam, said blocking layer being soluble under said first solvent etching conditions, said blocking layer being substantially insoluble under third solvent etching conditions, depositing a photoresist layer over said blocking layer, exposing said photoresist layer to a photolithographic light source, with a photo mask interposed between said photoresist layer and said photolithographic light source, to produce a latent image, solvent etching said photoresist layer under said third solvent etching conditions to develop said latent image into a pattern in which portions of said blocking layer are covered by said photoresist and portions of said blocking layer are uncovered, solvent etching uncovered portions of said blocking layer under said first solvent etching conditions to produce a patterned blocking layer and uncover portions of said protective layer, removing remaining portions of said resist layer, ion implanting said patterned blocking layer, said uncovered portions of said protective layer and portions of said decomposition film underlying uncovered portions of said protective layer, solvent etching under said first etching conditions to remove remaining portions of said blocking layer, solvent etching under said second etching conditions to remove portions of said protective layer covered by said blocking layer during said ion implanting, solvent etching under said first etching conditions to remove portions of decomposition film covered by said blocking layer during said ion implanting, and annealing said ion implanted portions of said decomposition film in an oxidizing atmosphere to produce said patterned film.

Claim 2

A method for producing a patterned ceramic or metal film comprising: producing a metallo-organic decomposition film, said decomposition film being soluble under first solvent etching conditions, said decomposition film being capable of being rendered insoluble under said first solvent etching conditions by ion implantation, depositing a protective layer over said decomposition film, said protective layer being soluble under second solvent etching conditions and substantially insoluble under said first solvent etching conditions, said protective layer being capable of transmitting an ion beam sufficiently energetic to fully implant said decomposition film, depositing a metal blocking layer over said protective layer, said blocking layer being capable of blocking said ion beam, said blocking layer being soluble under said first solvent etching conditions, said blocking layer being substantially insoluble under third solvent etching conditions, depositing a photoresist layer over said blocking layer, exposing said photoresist layer to a photolithographic light source, with a photo mask interposed between said photoresist layer and said photolithographic light source, to produce a latent image, solvent etching said photoresist layer under said third solvent etching conditions to develop said latent image into a pattern in which portions of said blocking layer are covered by said photoresist and portions of said blocking layer are uncovered, solvent etching uncovered portions of said blocking layer under said first solvent etching conditions to produce a patterned blocking layer and uncover portions of said protective layer, removing remaining portions of said resist layer, ion implanting said patterned blocking layer, said uncovered portions of said protective layer and portions of said decomposition film underlying uncovered portions of said protective layer, solvent etching under said first etching conditions to remove remaining portions of said blocking layer, solvent etching under said second etching conditions to remove portions of said protective layer covered by said blocking layer during said ion implanting, solvent etching under said first etching conditions to remove portions of decomposition film covered by said blocking layer during said ion implanting, and annealing said ion implanted portions of said decomposition film in an oxidizing atmosphere to produce said patterned film.