US4913769A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for preparing superconductive wiring board
Assignee: Hitachi Ltd
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Filing: 1988-08-04
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Granted: 1990-04-03
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Expires: 2008-08-04
Abstract
Abstract The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder. In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question. The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
Inventors
- 👤 Naoya Kanda
- 👤 Takayoshi Sowa
- 👤 Tetsuya Yamazaki
- 👤 Hiroaki Okudaira
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 16:48
CPC Classifications
H; H10; H10N; H10N60/00; H10N60/01; H10N60/0268; H10N60/0661; Y; Y10; Y10S; Y10S505/00; Y10S505/80; Y10S505/815; Y10S505/816; Y10S505/818; Y10S505/82
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
121 words
A process for preparing a superconductive wiring board comprising insulation layers and wiring layers composed of a superconductive material containing Cu, comprising steps of: forming a first layer containing a first insulation layer and a first superconductive wiring layer; forming on said first layer an over-etching preventing layer made of a thin metallic film composed of a group Ib element at portions corresponding to predetermined etching portions of a second insulation layer; forming said second insulation layer; and etching the predetermined portions of said second insulation layer so that the etching in the direction of depth reaches said thin metallic film and stops thereat to thereby increase the deterioration in characteristics of said superconductive wiring layer from touching an etching solution.
Claim 2
Dependent Claim
121 words
A process for preparing a superconductive wiring board comprising insulation layers and wiring layers composed of a superconductive material containing Cu, comprising steps of: forming a first layer containing a first insulation layer and a first superconductive wiring layer; forming on said first layer an over-etching preventing layer made of a thin metallic film composed of a group Ib element at portions corresponding to predetermined etching portions of a second insulation layer; forming said second insulation layer; and etching the predetermined portions of said second insulation layer so that the etching in the direction of depth reaches said thin metallic film and stops thereat to thereby increase the deterioration in characteristics of said superconductive wiring layer from touching an etching solution.
Claim 3
Dependent Claim
29 words
A process for preparing a superconductive wiring board according to claim 1, wherein said insulation layers comprise an inorganic material soluble in an acid and having high electrical resistance.
Claim 4
Dependent Claim
55 words
A process for preparing a superconductive wiring board according to claim 1, wherein said over-etching preventing layer is made of a thin metallic film composed of Cu or Ag, and said process further comprises oxidizing said over-etching preventing layer and subjecting the resulting oxide to selective etching to conduct patterning of said over-etching preventing layer.
Claim 5
Dependent Claim
32 words
A process for preparing a superconductive wiring board according to claim 1, wherein an alkaline etching solution of a group Ib element is used to conduct patterning of said over-etching preventing layer.
Claim 6
Dependent Claim
118 words
A process for preparing a superconductive wiring board according to claim 3, wherein said over-etching preventing layer is made of a thin metallic film composed of Cu, and said process further comprises forming, thereon, a thin film comprising at least one member selected from among elements constituting a superconductive material except for Cu, or a thin film comprising a superconductive material having a composition deficient in Cu or a precursor thereof, and oxidizing said thin film layer including said over-etching preventing layer to convert said thin film layer into a superconductive material, thereby preventing deterioration of characteristics due to slippage of the superconductive material composition by virtue of the presence of said over-etching preventing layer between wiring layers.
Claim 7
Dependent Claim
117 words
A process for preparing a superconductive wiring board according to claim 4, wherein said over-etching preventing layer is made of a thin metallic film composed of Cu, and said process further comprises forming, thereon, a thin film comprising at least one member selected from elements constituting a superconductive material except for Cu, or a thin film comprising a superconductive material having a composition deficient in Cu or a precursor thereof, and oxidizing said thin film layer including said over-etching preventing layer to convert said thin film layer into a superconductive material, thereby preventing deterioration of characteristics due to slippage of the superconductive material composition by virtue of the presence of said over-etching preventing layer between wiring layers.
Claim 8
Dependent Claim
29 words
A process for preparing a superconductive wiring board according to claim 1, wherein said insulation layers comprise at least one member selected from among groups Ia and IIa elements
Claim 9
Dependent Claim
48 words
A process for preparing a superconductive wiring board according to claim 1, wherein said over-etching preventing layer is later oxidized to convert said over-etching preventing layer into a superconductive material by a reaction, thereby preventing the breaking of wire attributed to slippage of the upper and lower layers.
References Cited (Backward Citations)
US4075756A
Cited
US4589961A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-02 | 1993-10-02 | 1994-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-02 | 1997-10-02 | 1998-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-02 | 2001-10-02 | 2002-04-03 | $7700.00 | Window Closed / Lapsed |