EP0426000A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Non-aqueous process for delineating patterns on high temperature superconductor films
Assignee: Raytheon Co
•
Filing: 1990-10-24
•
Granted: —
•
Expires: 2010-10-24
Abstract
Abstract A method delineates a pattern upon a surface, such as a surface of HTS material, without exposing the surface to an aqueous based solution. The method includes the steps of forming a first layer over the surface, the first layer being comprised of a first photoresist selected to be impervious to water such as a type of poly-methacrylate resist. A second layer is formed over the first layer, the second layer being comprised of a second photoresist such as a conventional AZ-type positive photoresist. The first and the second layers are processed to remove portions of the first and the second layers to uncover a desired portion of the surface. Processing of the second photoresist layer with conventional aqueous-based solutions does not adversely affect the surface because of the intervening layer of water impervious photoresist. The surface is next processed by ion milling to delineate the surface or is processed by depositing a layer of metalization over at least the uncovered and previously delineated portion of the surface. Finally, there is performed a step of removing the first and second layers with a non-aqueous solvent, thereby also lifting off any metal deposited upon the second photoresist layer.
Inventors
- 👤 James M. Myrosznyk
- 👤 Michael Ray
- 👤 Craig A. Shott
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 12:38
CPC Classifications
H; H10; H10N; H10N60/00; H10N60/01; H10N60/0268; H10N60/0661
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
116 words
A method of processing a surface of a water-degradable material without exposing the surface to an aqueous solution, comprising the steps of: providing the surface of a water-degradable material; forming a first layer over the surface, the first layer being comprised of a first photoresist material selected to be substantially impervious to water; forming a second layer over the first layer, the second layer being comprised of a second photoresist material that is processed by aqueous-based technique; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface; processing the uncovered portion of the surface; and removing the first and second layers.
Claim 2
Independent Claim
116 words
A method of processing a surface of a water-degradable material without exposing the surface to an aqueous solution, comprising the steps of: providing the surface of a water-degradable material; forming a first layer over the surface, the first layer being comprised of a first photoresist material selected to be substantially impervious to water; forming a second layer over the first layer, the second layer being comprised of a second photoresist material that is processed by aqueous-based technique; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface; processing the uncovered portion of the surface; and removing the first and second layers.
Claim 3
Dependent Claim
30 words
A method as set forth in Claim 1 wherein the step of forming the first layer includes a step of forming a layer comprised of a type of polyfluoromethacrylate photoresist.
Claim 4
Dependent Claim
28 words
A method as set forth in Claim 1 wherein the step of forming the first layer includes a step of forming a layer comprised of polyflourobutyl methacrylate (FBM).
Claim 5
Dependent Claim
28 words
A method as set forth in Claim 1 wherein the step of forming the second layer includes a step of forming a layer comprised of AZ-type positive photoresist.
Claim 6
Dependent Claim
49 words
A method as set forth in Claim 1 wherein the step of processing includes the steps of: exposing the second layer; and wet developing the exposed second layer with an aqueous-based technique to remove a portion of the second layer to uncover an underlying portion of the first layer.
Claim 7
Dependent Claim
27 words
A method as set forth in Claim 5 wherein the step of exposing includes a step of U.V. exposure to create a pattern upon the second layer.
Claim 8
Dependent Claim
31 words
A method as set forth in Claim 5 wherein the step of processing further includes a step of removing with a non-aqueous technique the uncovered portion of the first photoresist layer.
Claim 9
Dependent Claim
27 words
A method as set forth in Claim 7 wherein the step of removing with a non-aqueous technique includes a step of dry developing with a UV-Ozone asher.
Claim 10
Dependent Claim
29 words
A method as set forth in Claim 7 wherein the step of removing with a non-aqueous technique includes a step of undercutting the first layer beneath the second layer.
Claim 11
Dependent Claim
26 words
A method as set forth in Claim 1 wherein the step of processing the surface includes a step of depositing a metallic layer upon the surface.
Claim 12
Dependent Claim
39 words
A method as set forth in Claim 10 wherein the step of depositing includes a step of sputter depositing, the step of sputter depositing further including an initial step of pre-sputter etching to remove organic contamination from the surface.
Claim 13
Dependent Claim
30 words
A method as set forth in Claim 1 wherein the step of processing the surface includes a step of ion milling the surface to delineate one or more structures thereon.
Claim 14
Dependent Claim
21 words
A method as set forth in Claim 1 wherein the step of removing includes a step of applying a non-aqueous solvent.
Claim 15
Dependent Claim
35 words
A method as set forth in Claim 1 wherein the step of forming the first layer includes a step of forming a layer comprised of polyflourobutyl methacrylate (FBM) to a depth of approximately 0.5 microns.
Claim 16
Independent Claim
350 words
A method of forming contact metalization upon a surface of a HTS material without exposing the surface to an aqueous solution, comprising the steps of: providing the surface: forming a water-impervious first layer over the surface, the first layer being comprised of a type of polyfluoromethacrylate photoresist; forming a second layer over the first layer, the second layer being comprised of AZ-type positive photoresist; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface, the step of processing including the steps of, U.V. exposing selected portions of the second layer; wet developing the second layer with an aqueous based solution to remove a portion of the second layer to uncover an underlying portion of the first layer; and removing with a non-aqueous technique the uncovered portion of the first layer to uncover an underlying portion of the surface; delineating the uncovered portion of the surface into a desired pattern; removing the first and second layers with a non-aqueous solvent; with a dark field metalization pattern, forming another water-impervious first layer over the surface, the first layer being comprised of a type of polyfluoromethacrylate photoresist; forming another second layer over the first layer, the second layer being comprised of AZ-type positive photoresist; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface, the step of processing including the steps of, U.V. exposing selected portions of the second layer; wet developing the second layer with an aqueous based solution to remove a portion of the second layer to uncover an underlying portion of the first layer; and removing with a non-aqueous technique the uncovered portion of the first layer to uncover an underlying portion of the surface, the step of removing with a non-aqueous technique including a step of undercutting the first layer beneath the second layer; sputtering a layer of metalization over at least the uncovered portion of the surface; and removing the first and second layers with a non-aqueous solvent.
Claim 17
Independent Claim
350 words
A method of forming contact metalization upon a surface of a HTS material without exposing the surface to an aqueous solution, comprising the steps of: providing the surface: forming a water-impervious first layer over the surface, the first layer being comprised of a type of polyfluoromethacrylate photoresist; forming a second layer over the first layer, the second layer being comprised of AZ-type positive photoresist; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface, the step of processing including the steps of, U.V. exposing selected portions of the second layer; wet developing the second layer with an aqueous based solution to remove a portion of the second layer to uncover an underlying portion of the first layer; and removing with a non-aqueous technique the uncovered portion of the first layer to uncover an underlying portion of the surface; delineating the uncovered portion of the surface into a desired pattern; removing the first and second layers with a non-aqueous solvent; with a dark field metalization pattern, forming another water-impervious first layer over the surface, the first layer being comprised of a type of polyfluoromethacrylate photoresist; forming another second layer over the first layer, the second layer being comprised of AZ-type positive photoresist; processing the first and the second layers to remove portions of the first and the second layers to uncover a desired portion of the surface, the step of processing including the steps of, U.V. exposing selected portions of the second layer; wet developing the second layer with an aqueous based solution to remove a portion of the second layer to uncover an underlying portion of the first layer; and removing with a non-aqueous technique the uncovered portion of the first layer to uncover an underlying portion of the surface, the step of removing with a non-aqueous technique including a step of undercutting the first layer beneath the second layer; sputtering a layer of metalization over at least the uncovered portion of the surface; and removing the first and second layers with a non-aqueous solvent.
Claim 18
Dependent Claim
24 words
A method as set forth in Claim 15 wherein the step of forming the first layer forms a layer comprised of polyflourobutyl methacrylate (FBM).
Claim 19
Dependent Claim
27 words
A method as set forth in Claim 7 wherein the step of removing with a non-aqueous technique includes a step of dry developing with an oxygen plasma.
Claim 20
Dependent Claim
21 words
A method as set forth in Claim 15 wherein the step of delineating includes a step of ion milling the surface.
Claim 21
Dependent Claim
19 words
A method as set forth in Claim 10 wherein the step of depositing deposits a layer comprised of silver.
Claim 22
Dependent Claim
19 words
A method as set forth in Claim 15 wherein the step of sputtering sputters a layer comprised of silver.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.