Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
418 words
A semiconductor device comprising: a silicon substrate of a first electrically conductive type; an embedded collector layer of a second electrically conductive type opposite to said first electrically conductive type formed in said substrate, said embedded collector layer including first and second portions having predetermined surface areas, wherein said first portion of said embedded collector layer forms a PN junction with said substrate; a transistor structure disposed above said substrate including, a first collector region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said second portion of said embedded collector layer, a second collector region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said first collector region having an impurity density lower than that of said first collector region, a base region of said first electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said second collector region, and a first emitter region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said base region, wherein said first collector region, said second collector region, said base region, and said emitter region comprise a single crystalline silicon layer; an insulating layer provided on said substrate and surrounding said transistor structure; a first polycrystalline collector lead region formed in said insulating layer comprising said second electrically conductive type, said first collector lead region including first and second portions, wherein said first portion of said first collector lead region contacts said first collector region; a second polycrystalline collector lead region formed in said insulating layer comprising said second electrically conductive type, said second collector lead region including first and second portions, wherein said first portion of said second collector lead region contacts said second portion of said first collector lead region, and said second portion of said second collector lead region is exposed through said insulating layer so as to permit further electrical contacts therewith; and a polycrystalline base lead region of said first electrically conductive type, said base lead region including first and second portions, wherein said first portion of said base lead region contacts said base region, and said second portion of said base lead region is exposed through said insulating layer so as to permit further electrical contacts therewith.
Claim 2
Dependent Claim
418 words
A semiconductor device comprising: a silicon substrate of a first electrically conductive type; an embedded collector layer of a second electrically conductive type opposite to said first electrically conductive type formed in said substrate, said embedded collector layer including first and second portions having predetermined surface areas, wherein said first portion of said embedded collector layer forms a PN junction with said substrate; a transistor structure disposed above said substrate including, a first collector region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said second portion of said embedded collector layer, a second collector region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said first collector region having an impurity density lower than that of said first collector region, a base region of said first electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said second collector region, and a first emitter region of said second electrically conductive type having a surface area substantially the same as said predetermined surface area of said first portion formed on said base region, wherein said first collector region, said second collector region, said base region, and said emitter region comprise a single crystalline silicon layer; an insulating layer provided on said substrate and surrounding said transistor structure; a first polycrystalline collector lead region formed in said insulating layer comprising said second electrically conductive type, said first collector lead region including first and second portions, wherein said first portion of said first collector lead region contacts said first collector region; a second polycrystalline collector lead region formed in said insulating layer comprising said second electrically conductive type, said second collector lead region including first and second portions, wherein said first portion of said second collector lead region contacts said second portion of said first collector lead region, and said second portion of said second collector lead region is exposed through said insulating layer so as to permit further electrical contacts therewith; and a polycrystalline base lead region of said first electrically conductive type, said base lead region including first and second portions, wherein said first portion of said base lead region contacts said base region, and said second portion of said base lead region is exposed through said insulating layer so as to permit further electrical contacts therewith.
Claim 3
Dependent Claim
15 words
A semiconductor device as defined in claim 1, wherein the polycrystalline regions comprise polycrystalline silicon.
Claim 4
Dependent Claim
15 words
A semiconductor device as defined in claim 1, wherein the polycrystalline regions comprise polycrystalline silicide.
Claim 5
Dependent Claim
55 words
A semiconductor device as defined in claim 1, further comprising a second emitter region formed in said transistor structure between said base region and said first emitter region so as to form a bi-directional transistor structure, said second emitter region being of said second electrically conductive type, wherein said bi-directional transistor structure exhibits bi-directional properties.