Replacing method of chip in hybrid integrated circuit

Abstract

Abstract PURPOSE: To ease the replacement and to avoid the damage on a substrate by a method wherein the reverse side of a substrate is placed on the panel heated up to 100W300°C to soften a resin layer before peeling as required to replace a semiconductor chip which is connected to the substrate by means of a resin bonding. CONSTITUTION: A plural number of conductor layers 2 made of gold or others are formed on a ceramic substrate 1, on which a semiconductor chip 4 is bonded using a thermosetting resin layer 2 of epoxy group or others. Then, the electrode provided on the chip 4 is connected to the conductor layer 2 through a lead wire 5 so that a hybrid integrated circuit can be consisted. When it becomes necessary to replace the chip 4, however, the following procedure must be taken. That is, the reverse side of the substrate 1 is placed on a heating panel 6 to heat up the substrate 1 to 100W 300°C so that the resin 3 can be softened to peel off the chip 4. By arranging such, the replacement becomes extremely easy and the chip 4 can not be damaged. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Minoru Terajima

Bibliographic Details