Patent US5127835A successfully refreshed from Google Patents.
US6759307B1
Expired / Lapsed
US
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Method to prevent die attach adhesive contamination in stacked chips
Assignee: Micron Technology Inc
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Filing: 2000-11-01
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Granted: 2004-07-06
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Expires: 2020-11-01
Abstract
Abstract The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device with an adhesive flow control dam located on an upper surface thereof. The dam is positioned between electrical contacts and a substrate attach site on the upper surface of the first semiconductor device. The dam is rendered of a sufficient height and shape to block applied adhesive from flowing over the electrical contacts of the first semiconductor device when a second substrate is mounted onto the upper surface of the first semiconductor device. The semiconductor device package may be encapsulated with the dam in place or with the dam removed. The adhesive flow control dam thus protects the electrical contacts of the first semiconductor device from contamination by excess adhesive, which can result in unusable electrical contacts.
Inventors
- 👤 Jicheng Yang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:46
CPC Classifications
H; H10; H10W; H10W90/00; H10W46/00; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/015; H10W72/01515; H10W72/071; H10W72/073; H10W72/07311; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/075; H10W72/30; H10W72/331; H10W72/332; H10W72/351; H10W72/353; H10W72/354; H10W72/381; H10W72/387; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/547; H10W72/5473; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/20; H10W90/22; H10W90/24; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/752; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
149 words
A method for preventing adhesive contamination of at least one electrical contact during manufacturing of a stacked semiconductor die package, comprising: providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact; applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam.
Claim 2
Independent Claim
149 words
A method for preventing adhesive contamination of at least one electrical contact during manufacturing of a stacked semiconductor die package, comprising: providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact; applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam.
Claim 3
Dependent Claim
17 words
The method of claim 1 , wherein said applying an adhesive comprises applying a thermally conductive adhesive.
Claim 4
Dependent Claim
16 words
The method of claim 2 , wherein said applying an adhesive comprises applying an Ag-filled polymer.
Claim 5
Dependent Claim
17 words
The method of claim 1 , wherein said applying an adhesive comprises applying an electrically conductive adhesive.
Claim 6
Dependent Claim
14 words
The method of claim 4 , wherein said electrically conductive adhesive comprises alumina-filled polymers.
Claim 7
Dependent Claim
69 words
The method of claim 1 , wherein said applying an adhesive comprises applying an adhesive having a coefficient of thermal expansion approximating a coefficient of thermal expansion of one of a coefficient of thermal expansion of said first semiconductor die, a coefficient of thermal expansion of said second semiconductor die, and an average of the coefficients of thermal expansion of said first semiconductor die and said second semiconductor die.
Claim 8
Dependent Claim
31 words
The method of claim 1 , wherein said applying an adhesive comprises applying an adhesive by one of screen printing, stenciling, stamping, rolling on, spraying on, needle dispensing, and syringe dispensing.
Claim 9
Dependent Claim
23 words
The method of claim 1 , wherein said applying an adhesive comprises dispensing an adhesive of a viscosity less than about 20,000 centipoise.
Claim 10
Dependent Claim
23 words
The method of claim 1 , wherein said applying an adhesive comprises stamping an adhesive of a viscosity less than about 8,000 centipoise.
Claim 11
Dependent Claim
24 words
The method of claim 1 , wherein said applying an adhesive comprises screen printing an adhesive of a viscosity less than about 30,000 centipoise.
Claim 12
Dependent Claim
32 words
The method of claim 1 , wherein said applying an adhesive comprises applying an adhesive of one of polyimide adhesives, polyamide adhesives, epoxy adhesives, cyanate ester adhesives, silicone adhesives and acrylic adhesives.
Claim 13
Dependent Claim
22 words
The method of claim 1 , wherein said applying an adhesive comprises applying an adhesive of one of gels, pastes, and solders.
Claim 14
Dependent Claim
29 words
The method of claim 1 , wherein said applying an adhesive comprises applying an adhesive to at least a portion of a mounting surface of said second semiconductor die.
Claim 15
Dependent Claim
32 words
The method of claim 1 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive flow control dam in situ on said first semiconductor die.
Claim 16
Dependent Claim
43 words
The method of claim 14 , wherein said forming said at least one adhesive flow control dam in situ comprises forming at least one adhesive flow control dam by a method selected from one of sputtering, CVD, PVD, photoimaging techniques, and combinations thereof.
Claim 17
Dependent Claim
44 words
The method of claim 1 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive flow control dam by a casting technique and attaching said at least one adhesive flow control dam to said first semiconductor die.
Claim 18
Dependent Claim
35 words
The method of claim 1 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive flow control dam of a material of one of polyimides, polyamides, and epoxies.
Claim 19
Dependent Claim
30 words
The method of claim 1 , wherein said providing at least one adhesive flow control dam comprises providing at least one adhesive flow control dam comprising a decoupling capacitor coupon.
Claim 20
Dependent Claim
31 words
The method of claim 1 , wherein said providing a first semiconductor die comprises providing a first semiconductor die having a larger size than a size of said second semiconductor die.
Claim 21
Dependent Claim
20 words
The method of claim 1 , wherein said providing a first semiconductor die comprises providing an integrated circuit semiconductor die.
Claim 22
Dependent Claim
36 words
The method of claim 1 , wherein said mounting of said second semiconductor die comprises placing at least a portion of said second semiconductor die in contact with said at least one adhesive flow control dam.
Claim 23
Dependent Claim
60 words
The method of claim 21 , wherein said placing at least a portion of said second semiconductor die in contact with said at least one adhesive flow control dam comprises pressing said at least a portion of said second semiconductor die against said at least one adhesive flow control dam, said at least one adhesive flow control dam being deformable.
Claim 24
Independent Claim
138 words
A method of manufacturing a stacked semiconductor die package comprising: providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact; applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam.
Claim 25
Independent Claim
138 words
A method of manufacturing a stacked semiconductor die package comprising: providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact; applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam.
Claim 26
Dependent Claim
17 words
The method of claim 23 , wherein said applying an adhesive comprises applying a thermally conductive adhesive.
Claim 27
Dependent Claim
18 words
The method of claim 24 , wherein said applying a thermally conductive adhesive comprises applying an Ag-filled polymer.
Claim 28
Dependent Claim
17 words
The method of claim 23 , wherein said applying an adhesive comprises applying an electrically conductive adhesive.
Claim 29
Dependent Claim
14 words
The method of claim 26 , wherein said electrically conductive adhesive comprises alumina-filled polymers.
Claim 30
Dependent Claim
69 words
The method of claim 23 , wherein said applying an adhesive comprises applying an adhesive having a coefficient of thermal expansion approximating a coefficient of thermal expansion of one of a coefficient of thermal expansion of said first semiconductor die, a coefficient of thermal expansion of said second semiconductor die, and an average of the coefficients of thermal expansion of said first semiconductor die and said second semiconductor die.
Claim 31
Dependent Claim
34 words
The method of claim 23 , wherein said applying an adhesive comprises applying an adhesive by a method of one of screen printing, stenciling, stamping, rolling on, spraying on, needle dispensing, and syringe dispensing.
Claim 32
Dependent Claim
23 words
The method of claim 23 , wherein said applying an adhesive comprises dispensing an adhesive of a viscosity less than about 20,000 centipoise.
Claim 33
Dependent Claim
23 words
The method of claim 23 , wherein said applying an adhesive comprises stamping an adhesive of a viscosity less than about 8,000 centipoise.
Claim 34
Dependent Claim
24 words
The method of claim 23 , wherein said applying an adhesive comprises screen printing an adhesive of a viscosity less than about 30,000 centipoise.
Claim 35
Dependent Claim
32 words
The method of claim 23 , wherein said applying an adhesive comprises applying an adhesive of one of polyimide adhesives, polyamide adhesives, epoxy adhesives, cyanate ester adhesives, silicone adhesives, and acrylic adhesives.
Claim 36
Dependent Claim
22 words
The method of claim 23 , wherein said applying an adhesive comprises applying an adhesive of one of gels, pastes, and solders.
Claim 37
Dependent Claim
28 words
The method of claim 23 , wherein said applying an adhesive comprises applying an adhesive to at least a portion of a surface of said second semiconductor die.
Claim 38
Dependent Claim
32 words
The method of claim 23 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive flow control dam in situ on said first semiconductor die.
Claim 39
Dependent Claim
42 words
The method of claim 36 , wherein said forming said at least one adhesive flow control dam in situ comprises forming at least one adhesive flow control dam by a method of one of sputtering, CVD, PVD, photoimaging techniques, and combinations thereof.
Claim 40
Dependent Claim
44 words
The method of claim 23 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive flow control dam by a casting technique and attaching said at least one adhesive flow control dam to said first semiconductor die.
Claim 41
Dependent Claim
34 words
The method of claim 23 , wherein said providing at least one adhesive flow control dam comprises forming at least one adhesive control dam of a material of one of polyimides, polyamides, and epoxies.
Claim 42
Dependent Claim
30 words
The method of claim 23 , wherein said providing at least one adhesive flow control dam comprises providing at least one adhesive flow control dam comprising a decoupling capacitor coupon.
Claim 43
Dependent Claim
31 words
The method of claim 23 , wherein said providing a first semiconductor die comprises providing a first semiconductor die having a larger size than a size of said second semiconductor die.
Claim 44
Dependent Claim
20 words
The method of claim 23 , wherein said providing a first semiconductor die comprises providing an integrated circuit semiconductor die.
Claim 45
Dependent Claim
27 words
The method of claim 23 , further comprising encapsulating at least a portion of a surface area of said first semiconductor die and said second semiconductor die.
Claim 46
Dependent Claim
38 words
The method of claim 43 , wherein said encapsulating at least a portion of a surface area of said first semiconductor die and said second semiconductor die further comprises encapsulating said at least one adhesive flow control dam.
Claim 47
Dependent Claim
58 words
The method of claim 44 , wherein said providing said at least one adhesive flow control dam comprises forming said at least one adhesive flow control dam from a composition of materials substantially similar to materials used for said encapsulating at least a portion of a surface area of said first semiconductor die and said second semiconductor die.
Claim 48
Dependent Claim
21 words
The method of claim 43 , further comprising removing said at least one adhesive flow control dam prior to said encapsulating.
Claim 49
Dependent Claim
48 words
The method of claim 23 , wherein said applying an adhesive comprises applying said adhesive such that at least a portion of said adhesive is disposed adjacent said at least one adhesive flow control dam and outside said at least one region for mounting a second semiconductor die.
Claim 50
Dependent Claim
17 words
The method of claim 47 , wherein said applying an adhesive comprises applying a thermally conductive adhesive.
Claim 51
Dependent Claim
36 words
The method of claim 23 , wherein said mounting of said second semiconductor die comprises placing at least a portion of said second semiconductor die in contact with said at least one adhesive flow control dam.
Claim 52
Dependent Claim
74 words
The method of claim 49 , wherein said placing at least a portion of said second semiconductor die in contact with said at least one adhesive flow control dam comprises pressing said at least a portion of said second semiconductor die against said at least one adhesive flow control dam, and wherein said providing said at least one adhesive flow control dam comprises providing at least one adhesive flow control dam which is deformable.
Claim 53
Dependent Claim
59 words
The method of claim 23 , further comprising wire bonding said at least one electrical contact, and wherein said providing at least one adhesive flow control dam comprises configuring said at least one adhesive flow control dam for preventing solder flow onto at least a portion of said second semiconductor die or an extension thereof during said wire bonding.
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