Die attach adhesive compositions

Claim 2

A process for attaching a semiconductor device to a substrate comprising: (a) providing a substrate; (b) dispensing, on at least a portion of said substrate, a thermally reworkable die attach adhesive composition, said composition comprising (i) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (ii) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium, at a temperature which is sufficiently high to convert the die attach adhesive composition into a liquid thereby producing an adhesive-attached substrate; (c) attaching the semiconductor device on the surface of the thermally reworkable die attach adhesive on the adhesive-attached substrate while the adhesive is in a liquid, thereby bonding the semiconductor device to the substrate; and, (d) cooling the die attach adhesive to a temperature which is sufficiently low to solidify the resin thereby providing an assembly.

Claim 3

The process of claim 1 wherein the crosslinked resin is heated at a temperature within the range of from about 100° C. to about 250° C.

Claim 4

The process of claim 1 wherein the 2,5-dialkyl substituted furan-containing polymer is produced by reacting carbon monoxide with at least one olefinically unstaturated compound.

Claim 5

The process of claim 1 wherein the dienophile is a cyclic derivative of maleic anhydride.

Claim 6

The process of claim 1 further comprising the step of (e) heating the assembly at a temperature within the range of 70° C. to 200° C. for a period of up to 4 hours.

Claim 7

The process of claim 1 further comprising the step of (e) heating the assembly at a temperature within the range of 150° C. to 300° C. for a period of up to 4 hours.

Claim 8

The process of claim 1 further comprising the steps of: (e) heating the thermally reworkable die attach adhesive composition of the assembly at a temperature which is sufficiently high to convert the die attach adhesive composition into a liquid thereby providing a liquid die attach adhesive composition, (f) removing the semiconductor device from the liquid die attach adhesive composition; (g) optionally, dispensing a fresh thermally reworkable die attach adhesive composition comprising (i) a thermally reworkable crosslinked resin produced by reacting a dienophile having a functionality greater than one and a 2,5-dialkyl substituted furan-containing polymer, and (ii) at least one thermally or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium, (h) optionally, providing another semiconductor device on the surface of the liquid die attach adhesive, thereby bonding another semiconductor device on the die attach adhesive; and (i) cooling the liquid die attach adhesive to a temperature which is sufficiently low to solidify the resin thereby providing a reworked assembly.

Claim 9

The process of claim 7 wherein the crosslinked resin is heated at a temperature within the range of from about 100° C. to about 250° C.

Claim 10

The process of claim 7 wherein the 2,5-dialkyl substituted furan-containing polymer is produced by furanizing a copolymer of carbon monoxide and at least one olefinically unsaturated compound.

Claim 11

The process of claim 9 wherein the dienophile is a cyclic derivative of maleic anhydride.