US5120665A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
Assignee: ZGI II Inc
•
Filing: 1991-03-19
•
Granted: 1992-06-09
•
Expires: 2011-03-19
Abstract
Abstract A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
Inventors
- 👤 Isao Tsukagoshi
- 👤 Yutaka Yamaguchi
- 👤 Atsuo Nakajima
- 👤 Yasushi Goto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H10; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W72/00; H10W72/20; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0221; H05K2201/0233; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/11; H05K2203/1163; H10W70/099; H10W70/67; H10W70/68; H10W70/681; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/073; H10W72/074; H10W72/29; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/9415; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
115 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and curing the composition under pressure to obtain electrical connection.
Claim 2
Dependent Claim
115 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and curing the composition under pressure to obtain electrical connection.
Claim 3
Dependent Claim
131 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and (D) rigid particles having an average particles size smaller than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and curing the composition under pressure to obtain electrical connection.
Claim 4
Dependent Claim
131 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and (D) rigid particles having an average particles size smaller than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and curing the composition under pressure to obtain electrical connection.
Claim 5
Dependent Claim
52 words
The process for connecting circuits according to claim 1, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
Claim 6
Dependent Claim
19 words
The process for connecting circuits according to claim 3, wherein said predetermined temperature is 40° C. to 250° C.
Claim 7
Dependent Claim
19 words
The process for connecting circuits according to claim 4, wherein said predetermined temperature is 100° C. to 170° C.
Claim 8
Dependent Claim
45 words
The process for connecting circuits according to claim 1, wherein said coated particles are pressure activation coated particles in which the coating film is broken by applying pressure, and wherein said curing the composition includes applying sufficient pressure so as to break the coating film.
Claim 9
Dependent Claim
52 words
The process for connecting circuits according to claim 2, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
Claim 10
Dependent Claim
19 words
The process for connecting circuits according to claim 7, wherein said predetermined temperature is 40° C. to 250° C.
Claim 11
Dependent Claim
19 words
The process for connecting circuits according to claim 8, wherein said predetermined temperature is 100° C. to 170° C.
Claim 12
Dependent Claim
52 words
The process for connecting circuits according to claim 2, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
Claim 13
Dependent Claim
108 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing, and curing the composition under pressure to obtain electrical connection.
Claim 14
Dependent Claim
108 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing, and curing the composition under pressure to obtain electrical connection.
Claim 15
Dependent Claim
125 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and (D) the rigid particles having an average particle size smaller than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing, and curing the composition under pressure to obtain electrical connection.
Claim 16
Dependent Claim
125 words
A process for connecting circuits, which comprises placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and (D) the rigid particles having an average particle size smaller than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B), conducting electric current passing test for both circuits while pressing, and curing the composition under pressure to obtain electrical connection.
References Cited (Backward Citations)
JPS51101469A
Cited
US4423435A
Cited
GB2089126A
Cited
FR2505543A1
Cited
EP0110307A2
Cited
US4731282A
Cited
US4654752A
Cited
US4680226A
Cited
EP0205686A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-09 | 1995-12-09 | 1996-06-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-09 | 1999-12-09 | 2000-06-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-09 | 2003-12-09 | 2004-06-09 | $7700.00 | Window Closed / Lapsed |