US5530278A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip having a dam to prevent contamination of photosensitive structures thereon
Assignee: Xerox Corp
•
Filing: 1995-04-24
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Granted: 1996-06-25
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Expires: 2015-04-24
Abstract
Abstract In dicing of semiconductor chips from a wafer and mounting of the chips in an apparatus, techniques ensure the integrity of bonding pads and wire bonds in the dicing of individual chips and the connection of wire bonds to the chips. The wire bonds in the undiced chips are each connected to a probe pad disposed in an inter-chip area on the wafer, and this probe pad is used to accept probe pins which may otherwise damage the bonding pads on the chips themselves. In the dicing step, the probe pads are obliterated by the cutting blade. A polyimide dam disposes adjacent the bonding pads restricts the migration of liquid encapsulant securing the wire bonds to the bonding pads.
Inventors
- 👤 Josef E. Jedicka
- 👤 Brian T. Ormond
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:16
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/131; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/5363; H10W72/90; H10W72/951
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
101 words
A semiconductor chip, comprising: an imaging structure, disposed on a first surface of the chip; a bonding pad, disposed on the first surface of the chip; a filter layer, in contact with the first surface of the chip; and a dam in contact with the filter layer, disposed between the imaging structure and the bonding pad, adapted to prevent flow of fluid encapsulant from the bonding pad to the imaging structure; a first portion of the filter layer covering the imaging structure of the chip and a second portion of the filter layer extending from the dam to the bonding pad.
Claim 2
Dependent Claim
101 words
A semiconductor chip, comprising: an imaging structure, disposed on a first surface of the chip; a bonding pad, disposed on the first surface of the chip; a filter layer, in contact with the first surface of the chip; and a dam in contact with the filter layer, disposed between the imaging structure and the bonding pad, adapted to prevent flow of fluid encapsulant from the bonding pad to the imaging structure; a first portion of the filter layer covering the imaging structure of the chip and a second portion of the filter layer extending from the dam to the bonding pad.
Claim 3
Dependent Claim
18 words
The chip of claim 1, the imaging structure and the bonding pad being formed on a silicon substrate.
Claim 4
Dependent Claim
9 words
The chip of claim 1, the dam including polyimide.
Claim 5
Dependent Claim
14 words
The chip of claim 1, further comprising a wire bond contacting the bonding pad.
Claim 6
Dependent Claim
24 words
The chip of claim 4, further comprising an encapsulant, in the form of a hardened fluid, encapsulating the wire bond and the bonding pad.
Claim 7
Dependent Claim
48 words
The chip of claim 1, the semiconductor chip comprising a plurality of imaging structures arranged in a linear array, a plurality of bonding pads arranged in a linear array, and wherein the dam extends between the linear array of imaging structures and the linear array of bonding pads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-25 | 1999-12-25 | 2000-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-25 | 2003-12-25 | 2004-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-25 | 2007-12-25 | 2008-06-25 | $7700.00 | Window Closed / Lapsed |