US5300815A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Technique of increasing bond pad density on a semiconductor die
Assignee: LSI Corp
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Filing: 1992-08-25
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Granted: 1994-04-05
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Expires: 2012-08-25
Abstract
Abstract A novel technique for increasing bond pad density is described whereby non-square bond pads are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith and are aligns to the approach angle of the conductive line to which it is connected. A variation on the inventive technique provides for alternating, interleaved, complementary wedge-shaped bond pads which provide for high bond pad density while accommodating a wide range of approach angles.
Inventors
- 👤 Michael D. Rostoker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 08:01
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70433; G06; G06F; G06F30/00; G06F30/30; G06F30/39; G06F30/392; H10D; H10D62/00; H10D62/10; H10D62/117; H10D89/00; H10D89/10; H10W70/00; H10W70/40; H10W70/411; H10W70/421; H10W70/435; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/931; H10W72/932; H10W72/951; H10W90/00; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10S; Y10S148/00; Y10S148/028
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
57 words
Method of forming non-square bond pad shapes for a semiconductor die, comprising: defining a contact footprint shape; defining a pivot point within the contact footprint shape; defining a swept contact area by sweeping the contact footprint shape through a range of angles about the pivot point; providing a bond pad shape which encloses the swept contact area.
Claim 2
Dependent Claim
57 words
Method of forming non-square bond pad shapes for a semiconductor die, comprising: defining a contact footprint shape; defining a pivot point within the contact footprint shape; defining a swept contact area by sweeping the contact footprint shape through a range of angles about the pivot point; providing a bond pad shape which encloses the swept contact area.
Claim 3
Dependent Claim
27 words
A method according to claim 1, further comprising; providing a safety zone around the swept contact area; wherein: the bond pad shape further encloses the safety zone.
Claim 4
Dependent Claim
13 words
A method according to claim 1 wherein: the bond pad shape is polygonal.
Claim 5
Dependent Claim
13 words
A method according to claim 1 wherein: the bond pad shape is curved.
Claim 6
Dependent Claim
35 words
A method according to claim 1, wherein: an anchor point in the bond pad shape is defined by the location of the pivot point in the swept contact area which the bond pad shape encloses.
Claim 7
Dependent Claim
77 words
Method of forming non-square bond pad shapes for a semiconductor die, comprising: defining a contact footprint shape; defining a pivot point within the contact footprint shape; defining a swept contact area by sweeping the contact footprint shape through a range of angles about the pivot point; providing a bond pad shape which encloses the swept contact area; wherein: the pivot point within the contact footprint shape is located substantially towards one end of the contact footprint shape.
Claim 8
Dependent Claim
77 words
Method of forming non-square bond pad shapes for a semiconductor die, comprising: defining a contact footprint shape; defining a pivot point within the contact footprint shape; defining a swept contact area by sweeping the contact footprint shape through a range of angles about the pivot point; providing a bond pad shape which encloses the swept contact area; wherein: the pivot point within the contact footprint shape is located substantially towards one end of the contact footprint shape.
Claim 9
Dependent Claim
26 words
Method according to claim 6, further comprising; providing a safety zone around the swept contact area; wherein: the bond pad shape further encloses the safety zone.
Claim 10
Dependent Claim
13 words
A method according to claim 6 wherein: the bond pad shape is polygonal.
Claim 11
Dependent Claim
13 words
A method according to claim 6 wherein: the bond pad shape is curved.
Claim 12
Dependent Claim
35 words
A method, according to claim 6, wherein: an anchor point in the bond pad shape is defined by the location of the pivot point in the swept contact area which the bond pad shape encloses.
References Cited (Backward Citations)
DE2942394A1
Cited
JPS59182551A
Cited
JPS60154652A
Cited
JPS61212050A
Cited
FR2616964A1
Cited
US5091825A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-04-04 | 1997-10-04 | 1998-04-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-04-04 | 2001-10-04 | 2002-04-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-04-04 | 2005-10-04 | 2006-04-05 | $7700.00 | Window Closed / Lapsed |