Lead frame structure having non-removable dam bars for semiconductor package

Claim 2

A lead frame structure for a semiconductor package, comprising: a plurality of leads; a plurality of dam bars, each extending from one of the plurality leads toward an adjacent lead so that a gap is provided between said each dam bar and the adjacent lead; and an insulating adhesive disposed between said each dam bar and the adjacent lead and completely filling the first gap, wherein each of the leads have a first dam bar of the plurality of dam bars extending from one side of said lead, and a second dam bar of the plurality of dam bars extending from another side of said lead, the first and second dam bars substantially aligned with each other, wherein the first dam bar of one lead extends immediately adjacent and substantially parallel to the second dam bar of another lead.

Claim 3

The structure of claim 1, wherein the insulating adhesive is formed of one of an insulating film, an insulating paste, and an epoxy resin.

Claim 4

The structure of claim 2, wherein the insulating film is a polyamide.

Claim 5

A lead frame structure for a semiconductor package, comprising: first and second leads disposed in juxtaposition; a pair of first dam bars extending from one portion of the first lead in opposite directions towards adjacent leads and forming a first gap between an end portion of one of the first dam bars and the second lead; a pair of second dam bars extending from a portion of the second lead in opposite directions towards adjacent leads and forming a second gap between an end portion of one of the second dam bars and the first lead, a third gap being formed between the one of the first dam bars and the one of the second dam bars; and an insulating adhesive disposed between the first and second leads and completely filing the first, second and third gaps, wherein the pair of first dam bars are aligned substantially with each other, the pair of second dam bars are aligned substantially with each other, and the pair of first dam bars and the pair of second dam bars are substantially parallel to each other.

Claim 6

A lead frame structure for a semiconductor package, comprising: first and second leads disposed in juxtaposition; a pair of first dam bars extending from one portion of the first lead in opposite directions towards adjacent leads and forming a first gap between an end portion of one of the first dam bars and the second lead; a pair of second dam bars extending from a portion of the second lead in opposite directions towards adjacent leads and forming a second gap between an end portion of one of the second dam bars and the first lead, a third gap being formed between the one of the first dam bars and the one of the second dam bars; and an insulating adhesive disposed between the first and second leads and completely filing the first, second and third gaps, wherein the pair of first dam bars are aligned substantially with each other, the pair of second dam bars are aligned substantially with each other, and the pair of first dam bars and the pair of second dam bars are substantially parallel to each other.

Claim 7

The structure of claim 4, wherein the insulating adhesive is formed of one of an insulating film, an insulating paste, and an epoxy resin.

Claim 8

The structure of claim 5, wherein the insulating film is a polyamide.

Claim 9

A lead frame structure for a semiconductor package comprising: first and second plurality of leads disposed in juxtaposition and in an alternating pattern; a plurality of dam bars extending from opposite sides of said first plurality of leads, gaps formed between the second leads and the dam bars, the second plurality of leads being without any dam bars; and an adhesive disposed between the first and second leads and filling the gaps.

Claim 10

A lead frame structure for a semiconductor package comprising: first and second plurality of leads disposed in juxtaposition and in an alternating pattern; a plurality of dam bars extending from opposite sides of said first plurality of leads, gaps formed between the second leads and the dam bars, the second plurality of leads being without any dam bars; and an adhesive disposed between the first and second leads and filling the gaps.

Claim 11

The structure of claim 7, wherein the dam bars are substantially aligned with each other.

Claim 12

The structure of claim 1, wherein each of the first and second dam bars are substantially perpendicular to said lead.

Claim 13

The structure of claim 1, wherein all of ends of the dam bars which contact the insulating adhesive have a substantially rectangular end.

Claim 14

The structure of claim 7, wherein the adhesive completely fills each of the gaps between one dam bar and adjacent second lead and prevents passing of a molding material between the first and second leads.

Claim 15

The structure of claim 1, wherein the plurality of dam bars are non-removable after a molding process of the semiconductor package.

Claim 16

The structure of claim 1, wherein the insulating adhesive fills any gap between said each dam bar and the adjacent lead.

Claim 17

The structure of claim 4, wherein the pair of first dam bars are non-removable after a molding process of the semiconductor package.

Claim 18

The structure of claim 14, wherein the pair of second dam bars are also non-removable after the molding process.

Claim 19

The structure of claim 4, wherein the insulating adhesive fills any gap between said one of the first dam bars and the second lead and any gap between said one of the second dam bars and the first lead.

Claim 20

The structure of claim 7, wherein the plurality of dam bars are non-removable after a molding process of the semiconductor package.

Claim 21

The structure of claim 7, wherein the adhesive is formed with one of an insulating film, an insulating paste and an epoxy resin.

Claim 22

The structure of claim 7, wherein the adhesive includes polyamide.