US5559372A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin soldered semiconductor package
Assignee: SK Hynix Inc
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Filing: 1995-01-10
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Granted: 1996-09-24
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Expires: 2015-01-10
Abstract
Abstract A semiconductor package directly soldering the chip pad to the inner leads and a method for producing the package are disclosed. The chip pad is placed on the bottom surface of an inner lead extending from opposed sides of the chip pad. A plurality of inner lead holes are formed in the interconnection parts between the inner leads and the auxiliary leads. A solder resist film bonded to the lead frame has a plurality of solder resist holes communicating with the inner lead holes. In order to produce the package, a lead pattern is formed and the lead frame is etched using the lead pattern, so that the inner lead holes and the solder resist holes are formed and the inner leads come into direct contact with the chip pad. Thereafter, the chip pad is soldered to the inner leads.
Inventors
- 👤 Yong T. Kwon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W70/411; H10W70/415; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
92 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip pad, at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is a rectangular hole.
Claim 2
Dependent Claim
92 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip pad, at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is a rectangular hole.
Claim 3
Dependent Claim
91 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is a semicircular hole.
Claim 4
Dependent Claim
91 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is a semicircular hole.
Claim 5
Dependent Claim
95 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip pad, at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is smaller than said solder resistor hole.
Claim 6
Dependent Claim
95 words
A semiconductor package comprising: a chip pad placed on a bottom surface of an inner lead extending from a lead frame to opposed sides of said chip pad, at least one inner lead hole formed in said inner lead; and a solder resist film bonded to the top surface of said lead frame, said solder resist film having at least one hole communicating with said inner lead hole; wherein the chip pad is soldered to the lead frame at the inner lead hole, wherein said inner lead hole is smaller than said solder resistor hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-24 | 2000-03-25 | 2000-09-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-24 | 2004-03-25 | 2004-09-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-24 | 2008-03-25 | 2008-09-24 | $7700.00 | Window Closed / Lapsed |