US5021866A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit apparatus
Assignee: Toshiba Corp
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Filing: 1988-09-28
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Granted: 1991-06-04
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Expires: 2008-09-28
Abstract
Abstract A semiconductor integrated circuit device including first and second transmission leads formed on both sides of a resin film on which a semiconductor integrated circuit chip is mounted. These leads are connected at portions immediately close to the high-speed input terminals of the chip by through-hole leads. This chip-to-lead configuration according to the present invention is significantly effective for a GaAs logic integrated circuit or the like that processes high-speed input signals.
Inventors
- 👤 Toshio Sudo
- 👤 Kazutaka Saito
- 👤 Chiaki Takubo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
150 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second sides; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film and having termini disposed in alignment with the semiconductor terminal portions; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and being the same shape as its corresponding first transmission lead and substantially completely overlapping its corresponding first transmission lead; and through-hole leads passing through said insulating film and through the termini of corresponding first and second transmission leads and formed at respective terminal portions of said integrated circuit chip and connecting corresponding ones of said first and second transmission leads to one another and to said respectively integrated circuit terminal portions.
Claim 2
Dependent Claim
150 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second sides; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film and having termini disposed in alignment with the semiconductor terminal portions; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and being the same shape as its corresponding first transmission lead and substantially completely overlapping its corresponding first transmission lead; and through-hole leads passing through said insulating film and through the termini of corresponding first and second transmission leads and formed at respective terminal portions of said integrated circuit chip and connecting corresponding ones of said first and second transmission leads to one another and to said respectively integrated circuit terminal portions.
Claim 3
Dependent Claim
17 words
A semiconductor integrated circuit device according to claim 1 wherein said insulating film is a resin film.
Claim 4
Dependent Claim
29 words
A semiconductor integrated circuit device according to claim 1, further comprising ground conductor film formed within said insulating film between said first transmission leads and said second transmission leads.
Claim 5
Dependent Claim
22 words
A semiconductor integrated circuit device according to claim 3, further comprising a second insulating film in contact with said second transmission leads.
Claim 6
Dependent Claim
48 words
A semiconductor integrated circuit device according to claim 1, further comprising pairs of ground conductor films one film of each pair being formed on said first side of said insulating film and the other film of each pair being formed on said second side of said insulating film.
Claim 7
Dependent Claim
31 words
A semiconductor integrated circuit device according to claim 5, wherein a pair of said ground conductor films are connected to one another by a through-hole lead passing through said insulating film.
Claim 8
Dependent Claim
19 words
A semiconductor integrated circuit device according to claim 5, further comprising ground conductor films formed within said resin film.
Claim 9
Dependent Claim
22 words
A semiconductor integrated circuit device according to claim 7, further comprising a second insulating film in contact with said second transmission leads.
Claim 10
Dependent Claim
21 words
A semiconductor integrated circuit device according to claim 4, wherein said semiconductor integrated circuit chip is a GaAs logic integrated circuit.
Claim 11
Dependent Claim
20 words
A semiconductor integrated circuit device according to claim 1, wherein said semiconductor integrated circuit chip is a GaAs integrated circuit.
Claim 12
Dependent Claim
28 words
A semiconductor integrated circuit device according to claim 1, wherein said first and second transmission leads are connected to high-speed signal input terminals of said semiconductor integrated circuit.
Claim 13
Dependent Claim
22 words
A semiconductor integrated circuit device according to claim 1, further comprising a second insulating film in contact with said second transmission leads.
Claim 14
Dependent Claim
96 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second sides; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and substantially completely overlapping its corresponding first transmission lead; and through hole leads passing through said insulating film and connecting corresponding ones of said first and second transmission leads.
Claim 15
Dependent Claim
96 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second sides; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and substantially completely overlapping its corresponding first transmission lead; and through hole leads passing through said insulating film and connecting corresponding ones of said first and second transmission leads.
Claim 16
Dependent Claim
113 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second dies; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and being the same shape as, and substantially completely facing its corresponding first transmission lead; and through hole leads passing through said insulating film and connecting corresponding ones of said first and second transmission leads and being connected to corresponding terminal portions of said integrated circuit.
Claim 17
Dependent Claim
113 words
A semiconductor integrated circuit apparatus, comprising: an insulating film having first and second dies; a semiconductor integrated circuit chip having terminal portions and being disposed in parallel alignment with the film; first transmission leads formed on said first side of said insulating film; second transmission leads formed on said second side of said insulating film, each of said second transmission leads having a corresponding first transmission lead and being the same shape as, and substantially completely facing its corresponding first transmission lead; and through hole leads passing through said insulating film and connecting corresponding ones of said first and second transmission leads and being connected to corresponding terminal portions of said integrated circuit.
References Cited (Backward Citations)
US3895435A
Cited
US4123730A
Cited
WO1981003396A1
Cited
US4494083A
Cited
JPS5892101A
Cited
US4551746A
Cited
US4751482A
Cited
US4827327A
Cited
EP0198698A2
Cited
US4835598A
Cited
JPS6230342A
Cited
US4710798A
Cited
US4799128A
Cited
US4879588A
Cited
JPS63209152A
Cited
US4930002A
Cited
US4922325A
Cited
US4899118A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-03 | 1994-12-03 | 1995-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-03 | 1998-12-03 | 1999-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-03 | 2002-12-03 | 2003-06-04 | $7700.00 | Window Closed / Lapsed |