Lead frame

Abstract

Abstract PURPOSE:To make air bubbles generated in case of bonding with solder or conductive paste escape and prevent the solder and paste flow by providing through holes at the tip of a lead. CONSTITUTION:The electrodes 4a, 4b of a circuit substrate 2 are bonded with solder or conductive paste 5a, 5b to a lead frame 1 in which through holes 3a, 3b are formed at the tips of leads 7a, 7b. Then, sealing resin 6 is mounted as a sheath by a transfer molding method to seal part of the substrate 2 or the leads. Thus, since air bubbles generated in case of bonding escape and the flow of solder or conductive paste 5a, 5b is prevented by the through holes 3a, 3b, it can prevent a bonding strength from deteriorating and a contacting resistance from increasing due to the air bubbles.

Inventors

• 👤 Toshio Komiyama
• 👤 込山　利男

Bibliographic Details