US6005778A — Chip stacking and capacitor mounting arrangement …

Claim 1

Independent Claim 175 words

Component stacking arrangement comprising: a die mounting surface; a first die secured to said die mounting surface; a first plurality of thin wires extending from a plurality of first bonding pads on said first die to a second plurality of bonding pads external to said first die; spacer means located within an area at least partially bounded by said first plurality of bonding pads, said spacer means secured at a first surface of said first die, said spacer means having an outer tier and a central tier with said tiers having electrically interconnected conductive surfaces; at least a first conductor electrically connecting said conductive surface of said outer tier to a first voltage; and a component having a conductive backside, said component secured at said conductive backside to said spacer means, with said spacer means having a thickness such that a surface of said component facing said first die is spaced further from said first die than a highest point of said first plurality of thin wires and a highest point of said first conductor.

Claim 2

Dependent Claim 175 words

Component stacking arrangement comprising: a die mounting surface; a first die secured to said die mounting surface; a first plurality of thin wires extending from a plurality of first bonding pads on said first die to a second plurality of bonding pads external to said first die; spacer means located within an area at least partially bounded by said first plurality of bonding pads, said spacer means secured at a first surface of said first die, said spacer means having an outer tier and a central tier with said tiers having electrically interconnected conductive surfaces; at least a first conductor electrically connecting said conductive surface of said outer tier to a first voltage; and a component having a conductive backside, said component secured at said conductive backside to said spacer means, with said spacer means having a thickness such that a surface of said component facing said first die is spaced further from said first die than a highest point of said first plurality of thin wires and a highest point of said first conductor.

Claim 3

Dependent Claim 24 words

Component stacking arrangement of claim 1, wherein said spacer means comprises silicon and said conductive surfaces comprise a metal suitable for wire bond connections.

Claim 4

Dependent Claim 93 words

Component stacking arrangement of claim 2, wherein said component is a second die, further comprising: a second spacer means secured to a surface of said second die; said second spacer means having a conductive surface: capacitor means having a first conductive face and a second conductive face, said first conductive face secured to said conductive surface of said second spacer by a conductive material; means for electrically connecting said conductive surface of said second spacer means to said first voltage; and means for electrically connecting said second conductive face to a second voltage.

Claim 5

Dependent Claim 142 words

Component stacking arrangement of claim 2 wherein said component is a second die, further comprising: a second spacer means secured to a surface of said second die; said second spacer means having a conductive surface: a dielectric layer secured to said conductive surface of said second spacer means; an electrically conductive layer secured to said dielectric layer; an opening extending through said electrically conductive layer and through said dielectric to expose said electrically conductive surface of said second spacer means; capacitor means having a first conductive end and a second conductive end, said first conductive end secured to said conductive surface by a conductive material, said second conductive end secured to said conductive layer by a conductive material; means for electrically connecting said conductive surface of said second spacer means; and means for electrically connecting said conductive layer to a second voltage.

Claim 6

Dependent Claim 28 words

Component stacking arrangement of claim 4 wherein said dielectric layer and said conductive layer are bonded together before being applied to said conductive surface of said central tier.

Claim 7

Dependent Claim 16 words

Component stacking arrangement of claim 1 wherein said spacer means is formed by wafer level processes.

Claim 8

Dependent Claim 26 words

Component stacking arrangement of claim 1 wherein said spacer means comprises a material selected from the group consisting of silicon carbide, aluminum nitride and copper tungsten.

Claim 9

Dependent Claim 14 words

Component stacking arrangement of claim 1 wherein said first conductor comprises wire bond means.

Claim 10

Dependent Claim 15 words

Stacking arrangement of claim 1 wherein said first voltage is located on said first die.

Claim 11

Dependent Claim 16 words

Stacking arrangement of claim 1 wherein said first voltage is located external to said first die.

Claim 12

Dependent Claim 146 words

Component stacking arrangement, comprising: a chip mounting surface; a first chip attached to said surface; a multiplicity of thin wires connecting bonding pads on said first chip to bonding pads external to said first chip; a spacer means having a first and second tier having electrically conducting and electrically connected first and second surfaces, said first tier to be of planar dimensions fitting within a space defined by said bonding pads on said first chip and said second tier smaller in planar dimension than said first tier; conductor means extending from said first tier to a first voltage; and a second chip secured to said second surface on said spacer means, with said spacer means being of such thickness as to allow clearance for the highest reach of said multiplicity of thin wires and said conductor means from the lowest most surface of said second chip.

Claim 13

Dependent Claim 146 words

Component stacking arrangement, comprising: a chip mounting surface; a first chip attached to said surface; a multiplicity of thin wires connecting bonding pads on said first chip to bonding pads external to said first chip; a spacer means having a first and second tier having electrically conducting and electrically connected first and second surfaces, said first tier to be of planar dimensions fitting within a space defined by said bonding pads on said first chip and said second tier smaller in planar dimension than said first tier; conductor means extending from said first tier to a first voltage; and a second chip secured to said second surface on said spacer means, with said spacer means being of such thickness as to allow clearance for the highest reach of said multiplicity of thin wires and said conductor means from the lowest most surface of said second chip.

Claim 14

Dependent Claim 26 words

Component stacking arrangement of claim 11, where said spacer means comprises silicon and said conductive surfaces comprise a metal and are suitable for wire bond connections.

Claim 15

Dependent Claim 29 words

The integrated circuit component stacking arrangement of claim 11, where said spacer means comprises a material selected from the group consisting of silicon carbide, aluminum nitride, and copper tungsten.

Claim 16

Dependent Claim 39 words

The component stacking arrangement of claim 11 further comprising: a second spacer means having a conductive surface said second spacer means secured to the surface of said second chip; and a capacitor means mounted on said second spacer means.

Claim 17

Dependent Claim 48 words

Component stacking arrangement of claim 14 wherein said capacitor means comprises: a planar capacitor having first and second conductive faces with said first conductive face secured to said conductive surface of said second spacer means; and wire bond means for connecting said second face to a second voltage.

Claim 18

Dependent Claim 119 words

Stacking arrangement of claim 14 further comprising: means for electrically connecting said second spacer means conductive surface to said first voltage; a dielectric layer attached to said second spacer means conductive surface; an electrically conductive layer attached to said dielectric layer; an opening extending through said electrically conductive layer and said dielectric layer exposing said second spacer means conductive surface; said capacitor means having first and second conductive ends, with said first conductive end attached to said electrically conductive layer by an electrically conductive means and said second conductive end attached to said second spacer means conductive surface through said opening by an electrically conductive means; and means for electrically connecting said electrically conductive layer to a second voltage.

Claim 19

Dependent Claim 28 words

Component stacking arrangement of claim 16 wherein said dielectric layer and said conductive layer are bonded together before being applied to said conductive surface of said central tier.

Claim 20

Dependent Claim 114 words

Component stacking arrangement comprising: a die mounting surface; a first die secured to said die mounting surface; a first plurality of thin wires extending from a plurality of bonding pads on said first die; first spacer means having a conductive surface, said first spacer means located within an area partially bounded by said plurality of bonding pads and having an extended portion; first conductor means extending from said conductive surface of said extended portion to a first voltage; and a second component having a conductive backside, said second component secured to said conductive surface at said conductive backside with said extended portion extending beyond a perimeter of said second component in a first direction.

Claim 21

Dependent Claim 114 words

Component stacking arrangement comprising: a die mounting surface; a first die secured to said die mounting surface; a first plurality of thin wires extending from a plurality of bonding pads on said first die; first spacer means having a conductive surface, said first spacer means located within an area partially bounded by said plurality of bonding pads and having an extended portion; first conductor means extending from said conductive surface of said extended portion to a first voltage; and a second component having a conductive backside, said second component secured to said conductive surface at said conductive backside with said extended portion extending beyond a perimeter of said second component in a first direction.

Claim 22

Dependent Claim 24 words

Stacking arrangement of claim 18 wherein said first spacer means comprises silicon and said conductive surface comprises a metal suitable for wire bond connections.

Claim 23

Dependent Claim 26 words

Stacking arrangement of claim 18 wherein said first spacer means comprises a nonconductive material and said conductive surface comprises a metal suitable for wire bond connections.

Claim 24

Dependent Claim 26 words

Stacking arrangement of claim 18 wherein said first spacer means comprises a conductive material and said conductive surface comprises a metal suitable for wire bond connections.

Claim 25

Dependent Claim 13 words

Component stacking arrangement of claim 18 wherein said component is a second die.

Claim 26

Dependent Claim 12 words

Component stacking arrangement of claim 18 wherein said component is a capacitor.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2002-12-20	2003-06-21	2003-12-21	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2006-12-20	2007-06-21	2007-12-21	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2010-12-20	2011-06-21	2011-12-21	$7700.00	Window Closed / Lapsed

Chip stacking and capacitor mounting arrangement including spacers

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