Patent US6667556B2 successfully refreshed from Google Patents.
US6667556B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip adaptor package for bare die
Assignee: Round Rock Research LLC
•
Filing: 2002-11-22
•
Granted: 2003-12-23
•
Expires: 2022-11-22
Abstract
Abstract A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
Inventors
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/15; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/049; H05K3/36; H05K3/368; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 120
Claim 1
Independent Claim
274 words
A substrate having a plurality of circuits thereon for connecting a bare semiconductor die having a plurality of bond pads on a portion of a surface thereof to another substrate, the substrate using a plurality of bond wires to connect the plurality of bond pads on the bare semiconductor die and the plurality of circuits on the substrate, comprising: a substrate including at least a portion of a printed circuit board having a first die side surface for attaching the portion of the surface having the plurality of bond pads thereon of the bare semiconductor die thereto, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, at least one via extending therethrough for having a portion of the plurality of bond wires extending therethrough, and a plurality of circuit traces having at least one circuit trace thereof connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connecting to the plurality of bond wires, for connecting to the plurality of bond pads of the bare semiconductor die and for electrically connecting between the bare semiconductor die and the another substrate, at least a portion of the at least one circuit trace of the plurality of circuit traces extending into a portion of the printed circuit board; and at least a portion of a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting the substrate to the another substrate, the at least a portion of the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 2
Dependent Claim
274 words
A substrate having a plurality of circuits thereon for connecting a bare semiconductor die having a plurality of bond pads on a portion of a surface thereof to another substrate, the substrate using a plurality of bond wires to connect the plurality of bond pads on the bare semiconductor die and the plurality of circuits on the substrate, comprising: a substrate including at least a portion of a printed circuit board having a first die side surface for attaching the portion of the surface having the plurality of bond pads thereon of the bare semiconductor die thereto, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, at least one via extending therethrough for having a portion of the plurality of bond wires extending therethrough, and a plurality of circuit traces having at least one circuit trace thereof connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connecting to the plurality of bond wires, for connecting to the plurality of bond pads of the bare semiconductor die and for electrically connecting between the bare semiconductor die and the another substrate, at least a portion of the at least one circuit trace of the plurality of circuit traces extending into a portion of the printed circuit board; and at least a portion of a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting the substrate to the another substrate, the at least a portion of the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 3
Dependent Claim
18 words
The substrate of claim 1 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 4
Dependent Claim
17 words
The substrate of claim 1 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 5
Dependent Claim
34 words
The substrate of claim 1 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof extending substantially through the substrate.
Claim 6
Dependent Claim
38 words
The substrate of claim 1 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the substrate.
Claim 7
Dependent Claim
46 words
The substrate of claim 1 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the substrate and a portion thereof located in the substrate.
Claim 8
Dependent Claim
39 words
The substrate of claim 1 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the substrate.
Claim 9
Dependent Claim
47 words
The substrate of claim 1 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the substrate and a portion thereof located in the substrate.
Claim 10
Dependent Claim
14 words
The substrate of claim 1 , where the substrate comprises a printed circuit board.
Claim 11
Dependent Claim
23 words
The substrate of claim 1 , wherein a multilayer substrate includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 12
Dependent Claim
22 words
The substrate of claim 10 , wherein the plurality of bond pads is located on the second attachment surface of the substrate.
Claim 13
Dependent Claim
23 words
The substrate of claim 10 , further including a plurality of bond pads located on the first die side surface of the substrate.
Claim 14
Dependent Claim
302 words
A substrate having a plurality of circuits for connecting one or more bare semiconductor dice to another substrate, each bare semiconductor die of the one or more bare semiconductor dice having a plurality of bond pads on a portion of a surface thereof for connecting to said the another substrate, the substrate using a plurality of bond wires for connecting between the plurality of bond pads on each bare semiconductor die of the one or more bare semiconductor dice and the plurality of circuits on the substrate, comprising: a multilayer substrate having a first die side surface for attaching thereto a portion of the surfaces having the plurality of bond pads thereon of the one or more bare semiconductor dice, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, one or more vias extending therethrough for the plurality of bond wires to extend therethrough from the plurality of bond pads of the one or more bare semiconductor dice, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connecting the plurality of bond wires connected to the plurality of bond pads of the one or more bare semiconductor dice and for electrically connecting between the one or more bare semiconductor dice and the another substrate, at least a portion of at least one circuit trace of the plurality of circuit traces substantially extending through at least one layer of the multilayer substrate; and a plurality of electrical connectors located on the second attachment surface of the multilayer substrate for electrically connecting the multilayer substrate to the another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 15
Dependent Claim
302 words
A substrate having a plurality of circuits for connecting one or more bare semiconductor dice to another substrate, each bare semiconductor die of the one or more bare semiconductor dice having a plurality of bond pads on a portion of a surface thereof for connecting to said the another substrate, the substrate using a plurality of bond wires for connecting between the plurality of bond pads on each bare semiconductor die of the one or more bare semiconductor dice and the plurality of circuits on the substrate, comprising: a multilayer substrate having a first die side surface for attaching thereto a portion of the surfaces having the plurality of bond pads thereon of the one or more bare semiconductor dice, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, one or more vias extending therethrough for the plurality of bond wires to extend therethrough from the plurality of bond pads of the one or more bare semiconductor dice, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connecting the plurality of bond wires connected to the plurality of bond pads of the one or more bare semiconductor dice and for electrically connecting between the one or more bare semiconductor dice and the another substrate, at least a portion of at least one circuit trace of the plurality of circuit traces substantially extending through at least one layer of the multilayer substrate; and a plurality of electrical connectors located on the second attachment surface of the multilayer substrate for electrically connecting the multilayer substrate to the another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 16
Dependent Claim
18 words
The substrate of claim 13 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 17
Dependent Claim
17 words
The substrate of claim 13 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 18
Dependent Claim
34 words
The substrate of claim 13 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located in the multilayer substrate.
Claim 19
Dependent Claim
39 words
The substrate of claim 13 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the multilayer substrate.
Claim 20
Dependent Claim
48 words
The substrate of claim 13 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the multilayer substrate and a portion thereof located in the multilayer substrate.
Claim 21
Dependent Claim
40 words
The substrate of claim 13 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the multilayer substrate.
Claim 22
Dependent Claim
49 words
The substrate of claim 13 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the multilayer substrate and a portion thereof located in the multilayer substrate.
Claim 23
Dependent Claim
15 words
The substrate of claim 13 , wherein the multilayer substrate comprises a printed circuit board.
Claim 24
Dependent Claim
24 words
The substrate of claim 13 , wherein the multilayer substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 25
Dependent Claim
290 words
A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor dice to another substrate, each bare semiconductor die of the plurality of bare semiconductor dice having a plurality of bond pads on a portion of a surface thereof for connecting to the another substrate, the substrate using a plurality of bond wires for connecting between the plurality of bond pads on the plurality of bare semiconductor dice and a plurality of circuits on the substrate, comprising: a substrate having at least one layer, having a first die side surface for attaching thereto a portion of the surfaces having the plurality of bond pads thereon of the plurality of bare semiconductor dice, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, a plurality of vias extending therethrough for the plurality of bond wires to extend therethrough from the plurality of bond pads of the plurality of bare semiconductor dice, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connection to the plurality of bond wires connected to the plurality of bond pads of the plurality of bare semiconductor dice and for electrically connecting between the plurality of bare semiconductor dice and the another substrate, at least a portion of at least one circuit of the plurality of circuits substantially extending through the at least one layer; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting the substrate and-said-to the another substrate, the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 26
Dependent Claim
290 words
A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor dice to another substrate, each bare semiconductor die of the plurality of bare semiconductor dice having a plurality of bond pads on a portion of a surface thereof for connecting to the another substrate, the substrate using a plurality of bond wires for connecting between the plurality of bond pads on the plurality of bare semiconductor dice and a plurality of circuits on the substrate, comprising: a substrate having at least one layer, having a first die side surface for attaching thereto a portion of the surfaces having the plurality of bond pads thereon of the plurality of bare semiconductor dice, a second attachment surface having a plurality of bond pads located thereon for connecting the plurality of bond wires thereto, a plurality of vias extending therethrough for the plurality of bond wires to extend therethrough from the plurality of bond pads of the plurality of bare semiconductor dice, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of the plurality of bond pads of the second attachment surface for connection to the plurality of bond wires connected to the plurality of bond pads of the plurality of bare semiconductor dice and for electrically connecting between the plurality of bare semiconductor dice and the another substrate, at least a portion of at least one circuit of the plurality of circuits substantially extending through the at least one layer; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting the substrate and-said-to the another substrate, the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 27
Dependent Claim
18 words
The substrate of claim 23 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 28
Dependent Claim
17 words
The substrate of claim 23 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 29
Dependent Claim
33 words
The substrate of claim 23 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located in the substrate.
Claim 30
Dependent Claim
38 words
The substrate of claim 23 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the substrate.
Claim 31
Dependent Claim
46 words
The substrate of claim 23 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the second attachment surface of the substrate and a portion thereof located in the substrate.
Claim 32
Dependent Claim
39 words
The substrate of claim 23 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the substrate.
Claim 33
Dependent Claim
47 words
The substrate of claim 23 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the first die side surface of the substrate and a portion thereof located in the substrate.
Claim 34
Dependent Claim
14 words
The substrate of claim 23 , wherein the substrate comprises a printed circuit board.
Claim 35
Dependent Claim
23 words
The substrate of claim 23 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 36
Dependent Claim
213 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of the bare semiconductor die attached to a portion of the die side surface of the substrate, at least a portion of at least one circuit of said plurality of circuits having a portion thereof extending into the substrate; a plurality of wire bonds for extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the attachment surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 37
Dependent Claim
213 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of the bare semiconductor die attached to a portion of the die side surface of the substrate, at least a portion of at least one circuit of said plurality of circuits having a portion thereof extending into the substrate; a plurality of wire bonds for extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the attachment surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 38
Dependent Claim
19 words
The electrical assembly of claim 33 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 39
Dependent Claim
18 words
The electrical assembly of claim 33 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 40
Dependent Claim
34 words
The electrical assembly of claim 33 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located in the substrate.
Claim 41
Dependent Claim
38 words
The electrical assembly of claim 33 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the attachment surface of the substrate.
Claim 42
Dependent Claim
46 words
The electrical assembly of claim 33 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 43
Dependent Claim
39 words
The electrical assembly of claim 33 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the die side surface of the substrate.
Claim 44
Dependent Claim
47 words
The electrical assembly of claim 33 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located on the die side surface of the substrate and a portion thereof located in the substrate.
Claim 45
Dependent Claim
15 words
The electrical assembly of claim 33 , wherein the substrate comprises a printed circuit board.
Claim 46
Dependent Claim
24 words
The electrical assembly of claim 33 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 47
Dependent Claim
22 words
The electrical assembly of claim 42 , wherein the plurality of bond pads is located on the attachment surface of the substrate.
Claim 48
Dependent Claim
23 words
The electrical assembly of claim 42 , wherein the plurality of bond pads is located on the die side surface of the substrate.
Claim 49
Dependent Claim
32 words
The electrical assembly of claim 33 , further comprising: a sealant located in a portion of the via in the substrate encasing at least a portion of the plurality of bond wires.
Claim 50
Dependent Claim
68 words
The electrical assembly of claim 33 , further comprising: an adhesive attaching a portion of the surface having the plurality of bond pads thereon of the bare semiconductor die to the die side surface of the substrate with the plurality of bond pads of the bare semiconductor die located in the via extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 51
Dependent Claim
14 words
The electrical assembly of claim 46 , wherein the adhesive comprises a sealing adhesive.
Claim 52
Dependent Claim
14 words
The electrical assembly of claim 46 , wherein the adhesive comprises an adhesive tape.
Claim 53
Dependent Claim
250 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: at least two bare semiconductor dice, each bare semiconductor die of the at least two bare semiconductor dice having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, at least two vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads thereon of each bare semiconductor die of the at least two bare semiconductor dice attached to a portion of the die side surface of the substrate, at least a portion of at least one circuit trace of the plurality of circuit traces extending into the substrate; a plurality of wire bonds for extending through each via of the at least two vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the at least two bare semiconductor dice to the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 54
Dependent Claim
250 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: at least two bare semiconductor dice, each bare semiconductor die of the at least two bare semiconductor dice having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, at least two vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads thereon of each bare semiconductor die of the at least two bare semiconductor dice attached to a portion of the die side surface of the substrate, at least a portion of at least one circuit trace of the plurality of circuit traces extending into the substrate; a plurality of wire bonds for extending through each via of the at least two vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the at least two bare semiconductor dice to the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 55
Dependent Claim
19 words
The electrical assembly of claim 49 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 56
Dependent Claim
18 words
The electrical assembly of claim 49 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 57
Dependent Claim
34 words
The electrical assembly of claim 49 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace thereof having a portion thereof located in the substrate.
Claim 58
Dependent Claim
37 words
The electrical assembly of claim 49 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the substrate.
Claim 59
Dependent Claim
51 words
The electrical assembly of claim 49 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 60
Dependent Claim
38 words
The electrical assembly of claim 49 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the substrate.
Claim 61
Dependent Claim
46 words
The electrical assembly of claim 49 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the substrate and a portion thereof located in the substrate.
Claim 62
Dependent Claim
15 words
The electrical assembly of claim 49 , wherein the substrate comprises a printed circuit board.
Claim 63
Dependent Claim
24 words
The electrical assembly of claim 49 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 64
Dependent Claim
22 words
The electrical assembly of claim 58 , wherein the plurality of bond pads is located on the attachment surface of the substrate.
Claim 65
Dependent Claim
23 words
The electrical assembly of claim 58 , wherein the plurality of bond pads is located on the die side surface of the substrate.
Claim 66
Dependent Claim
39 words
The electrical assembly of claim 49 , further comprising: a sealant located in a portion of each via of the at least two vias in the substrate for encasing at least a portion of the plurality of wire bonds.
Claim 67
Dependent Claim
87 words
The electrical assembly of claim 49 , further comprising: an adhesive attaching a portion of the surface having the plurality of bond pads thereon of each bare semiconductor die of the at least two bare semiconductor dice to the die side surface of the substrate with the plurality of bond pads of each bare semiconductor die of the at least two bare semiconductor dice located in the at least two vias extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 68
Dependent Claim
14 words
The electrical assembly of claim 62 , wherein the adhesive comprises a sealing adhesive.
Claim 69
Dependent Claim
14 words
The electrical assembly of claim 62 , wherein the adhesive comprises an adhesive tape.
Claim 70
Dependent Claim
248 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a plurality of bare semiconductor dice, each bare semiconductor die of the plurality of bare semiconductor dice having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the plurality of bare semiconductor dice for attaching to a portion of the die side surface of the substrate, at least a portion of the at least one circuit trace of the plurality of circuit traces extending into the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice to the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 71
Dependent Claim
248 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a plurality of bare semiconductor dice, each bare semiconductor die of the plurality of bare semiconductor dice having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the plurality of bare semiconductor dice for attaching to a portion of the die side surface of the substrate, at least a portion of the at least one circuit trace of the plurality of circuit traces extending into the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice to the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate to another substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 72
Dependent Claim
19 words
The electrical assembly of claim 65 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 73
Dependent Claim
18 words
The electrical assembly of claim 65 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 74
Dependent Claim
33 words
The electrical assembly of claim 65 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located in the substrate.
Claim 75
Dependent Claim
37 words
The electrical assembly of claim 65 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the substrate.
Claim 76
Dependent Claim
45 words
The electrical assembly of claim 65 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 77
Dependent Claim
38 words
The electrical assembly of claim 65 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the substrate.
Claim 78
Dependent Claim
46 words
The electrical assembly of claim 65 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the substrate and a portion thereof located in the substrate.
Claim 79
Dependent Claim
15 words
The electrical assembly of claim 65 , wherein the substrate comprises a printed circuit board.
Claim 80
Dependent Claim
24 words
The electrical assembly of claim 65 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 81
Dependent Claim
22 words
The electrical assembly of claim 74 , wherein the plurality of bond pads is located on the attachment surface of the substrate.
Claim 82
Dependent Claim
23 words
The electrical assembly of claim 74 , wherein the plurality of bond pads is located on the die side surface of the substrate.
Claim 83
Dependent Claim
38 words
The electrical assembly of claim 65 , further comprising: a sealant located in a portion of each via of the plurality of vias in the substrate for encasing at least a portion of the plurality of wire bonds.
Claim 84
Dependent Claim
85 words
The electrical assembly of claim 65 , further comprising: an adhesive attaching a portion of the surface having the plurality of bond pads thereon of each bare semiconductor die of the plurality of bare semiconductor dice to the die side surface of the substrate with the plurality of bond pads of said each bare semiconductor die of the plurality of bare semiconductor dice located in the plurality of vias extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 85
Dependent Claim
14 words
The electrical assembly of claim 78 , wherein the adhesive comprises a sealing adhesive.
Claim 86
Dependent Claim
14 words
The electrical assembly of claim 78 , wherein the adhesive comprises an adhesive tape.
Claim 87
Dependent Claim
219 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a first substrate; a bare semiconductor die having a surface having a plurality of bond pads located thereon; a second substrate having a die side surface, an attachment surface, a via extending through the second substrate from the die side surface to the attachment surface, a plurality of circuit traces, at least a portion of at least one circuit trace of the plurality of circuit traces extending into the second substrate, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of the bare semiconductor die for attaching to a portion of the die side surface of the second substrate; a plurality of wire bonds extending through the via extending through the second substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the second substrate electrically connecting the first substrate and the second substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 88
Dependent Claim
219 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a first substrate; a bare semiconductor die having a surface having a plurality of bond pads located thereon; a second substrate having a die side surface, an attachment surface, a via extending through the second substrate from the die side surface to the attachment surface, a plurality of circuit traces, at least a portion of at least one circuit trace of the plurality of circuit traces extending into the second substrate, and at least one bond pad connected to at least one circuit trace of the plurality of circuit traces, a portion of the surface having the plurality of bond pads of the bare semiconductor die for attaching to a portion of the die side surface of the second substrate; a plurality of wire bonds extending through the via extending through the second substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the second substrate electrically connecting the first substrate and the second substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 89
Dependent Claim
19 words
The electrical assembly of claim 81 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 90
Dependent Claim
18 words
The electrical assembly of claim 81 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 91
Dependent Claim
34 words
The electrical assembly of claim 81 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located in the second substrate.
Claim 92
Dependent Claim
38 words
The electrical assembly of claim 81 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the second substrate.
Claim 93
Dependent Claim
47 words
The electrical assembly of claim 81 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the second substrate and a portion thereof located in the second substrate.
Claim 94
Dependent Claim
39 words
The electrical assembly of claim 81 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the second substrate.
Claim 95
Dependent Claim
48 words
The electrical assembly of claim 81 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the second substrate and a portion thereof located in the second substrate.
Claim 96
Dependent Claim
16 words
The electrical assembly of claim 81 , wherein the first substrate comprises a printed circuit board.
Claim 97
Dependent Claim
25 words
The electrical assembly of claim 81 , wherein the first substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 98
Dependent Claim
23 words
The electrical assembly of claim 90 , wherein the plurality of bond pads is located on the attachment surface of the first substrate.
Claim 99
Dependent Claim
24 words
The electrical assembly of claim 90 , wherein the plurality of bond pads is located on the die side surface of the first substrate.
Claim 100
Dependent Claim
34 words
The electrical assembly of claim 81 , further comprising: a sealant located in a portion of the via in the second substrate for encasing at least a portion of the plurality of wire bonds.
Claim 101
Dependent Claim
71 words
The electrical assembly of claim 81 , further comprising: an adhesive attaching a portion of the surface having the plurality of bond pads thereon of the bare semiconductor die to the die side surface of the second substrate with the plurality of bond pads of the bare semiconductor die located in the via extending through the second substrate from the die side surface to the attachment surface of the second substrate.
Claim 102
Dependent Claim
14 words
The electrical assembly of claim 94 , wherein the adhesive comprises a sealing adhesive.
Claim 103
Dependent Claim
14 words
The electrical assembly of claim 94 , wherein the adhesive comprises an adhesive tape.
Claim 104
Dependent Claim
257 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a first substrate; a plurality of bare semiconductor dice, each bare semiconductor die of the plurality of bare semiconductor dice having a surface having a plurality of bond pads located thereon; a second substrate having a die side surface, an attachment surface, a plurality of vias extending through the second substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit of the plurality of circuits, a portion of the surface having the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice for attaching to a portion of the die side surface of the second substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the second substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice and the plurality of circuit traces of the second substrate; and a plurality of electrical connectors located on the die side surface of the second substrate for electrically connecting the first substrate and the second substrate having the plurality of vias, the plurality of electrical connectors connected to the plurality of circuit traces, the plurality of electrical connectors comprising one of a plurality of solder balls and a plurality of pins.
Claim 105
Dependent Claim
257 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a first substrate; a plurality of bare semiconductor dice, each bare semiconductor die of the plurality of bare semiconductor dice having a surface having a plurality of bond pads located thereon; a second substrate having a die side surface, an attachment surface, a plurality of vias extending through the second substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit of the plurality of circuits, a portion of the surface having the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice for attaching to a portion of the die side surface of the second substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the second substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice and the plurality of circuit traces of the second substrate; and a plurality of electrical connectors located on the die side surface of the second substrate for electrically connecting the first substrate and the second substrate having the plurality of vias, the plurality of electrical connectors connected to the plurality of circuit traces, the plurality of electrical connectors comprising one of a plurality of solder balls and a plurality of pins.
Claim 106
Dependent Claim
19 words
The electrical assembly of claim 97 , wherein the plurality of electrical connectors comprises a plurality of solder balls.
Claim 107
Dependent Claim
18 words
The electrical assembly of claim 97 , wherein the plurality of electrical connectors comprises a plurality of pins.
Claim 108
Dependent Claim
34 words
The electrical assembly of claim 97 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located in the second substrate.
Claim 109
Dependent Claim
38 words
The electrical assembly of claim 97 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the second substrate.
Claim 110
Dependent Claim
47 words
The electrical assembly of claim 97 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the attachment surface of the second substrate and a portion thereof located in the second substrate.
Claim 111
Dependent Claim
39 words
The electrical assembly of claim 97 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the second substrate.
Claim 112
Dependent Claim
48 words
The electrical assembly of claim 97 , wherein the plurality of circuit traces comprises a plurality of circuit traces having at least one circuit trace having a portion thereof located on the die side surface of the second substrate and a portion thereof located in the second substrate.
Claim 113
Dependent Claim
16 words
The electrical assembly of claim 97 , wherein the first substrate comprises a printed circuit board.
Claim 114
Dependent Claim
25 words
The electrical assembly of claim 97 , wherein the second substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 115
Dependent Claim
23 words
The electrical assembly of claim 106 , wherein the plurality of bond pads is located on the attachment surface of the second substrate.
Claim 116
Dependent Claim
24 words
The electrical assembly of claim 106 , wherein the plurality of bond pads is located on the die side surface of the second substrate.
Claim 117
Dependent Claim
39 words
The electrical assembly of claim 97 , further comprising: a sealant located in a portion of each via of the plurality of vias in the second substrate for encasing at least a portion of the plurality of wire bonds.
Claim 118
Dependent Claim
86 words
The electrical assembly of claim 97 , further comprising: an adhesive attaching a portion of the surface having the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice to the die side surface of the second substrate with the plurality of bond pads of each bare semiconductor die of the plurality of bare semiconductor dice located in the plurality of vias extending through the second substrate from the die side surface to the attachment surface of the second substrate.
Claim 119
Dependent Claim
14 words
The electrical assembly of claim 110 , wherein the adhesive comprises a sealing adhesive.
Claim 120
Dependent Claim
14 words
The electrical assembly of claim 110 , wherein the adhesive comprises an adhesive tape.
References Cited (Backward Citations)
US4446477A
Cited
US5107329A
Cited
US4975765A
Cited
US5239198A
Cited
US5293068A
Cited
US5099309A
Cited
JPH0430544A
Cited
US5714405A
Cited
JPH04107964A
Cited
US5086018A
Cited
US5343106A
Cited
US5218234A
Cited
US5637915A
Cited
US5222014A
Cited
US5313096A
Cited
US5286679A
Cited
US6262477B1
Cited
US6046072A
Cited
US5454161A
Cited
US5486723A
Cited
US5434452A
Cited
US5473512A
Cited
US5384689A
Cited
US5933710A
Cited
US5615089A
Cited
US5508556A
Cited
US5541450A
Cited
US5636104A
Cited
US6013948A
Cited
US5674785A
Cited
US6265766B1
Cited
US6013946A
Cited
US6097085A
Cited
US5952611A
Cited
US6091140A
Cited
US6048755A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-12-22 | 2007-06-23 | 2007-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-12-22 | 2011-06-23 | 2011-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-12-22 | 2015-06-23 | 2015-12-23 | $7700.00 | Window Closed / Lapsed |