Stackable ball grid array package

Claim 1

A computer system comprising: an input device; an output device; a processor, coupled to said input and output devices; and a memory module, coupled to said processor, comprising: a ball grid array, comprising: a printed circuit board substrate having a first surface, a second surface, an aperture, said first surface including a plurality of conductive element pads, at least one conductive element pad on said second surface and at least one terminal pad on said second surface; a memory semiconductor device, mounted within a first perimeter of said first surface of said printed circuit board substrate and having at least one bond pad; at least one wire bond, connected to said at least one bond pad and said at least one terminal pad on said second surface of said printed circuit board substrate while passing through said aperture; a material placed along said aperture, on said at least one bond pad, said at least one terminal pad, and said at least one wire bond, forming a first profile height; and a plurality of conductive elements, mounted along a second perimeter of said second surface, said second perimeter being greater than said first perimeter, and coupled to said at least one conductive element pad on said second surface, said plurality of conductive elements having a second profile height greater than said first profile height.