Patent US6093029A successfully refreshed from Google Patents.
US6093029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vertically stackable integrated circuit
Assignee: Altera Corp
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Filing: 1998-09-08
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Granted: 2000-07-25
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Expires: 2018-09-08
Abstract
Abstract An arrangement for coupling a first packaged integrated circuit to a second packaged integrated circuit comprises a first packaged integrated circuit that includes a first set of electrical interconnection elements arranged on a first surface and a second set of electrical interconnection elements arranged on a second surface which is opposite to the first side. A thermally conductive material is disposed on the second surface and the second set of electrical interconnection elements are arranged around at least a portion of the periphery of the second surface. A second packaged integrated circuit includes a third set of electrical interconnection elements arranged on a first surface of the second packaged integrated circuit. The third set of electrical interconnection elements are shaped to mechanically and electrically couple and decouple to or from the second set of electrical interconnection elements non-destructively by application of manual force.
Inventors
- 👤 Young Kwon
- 👤 Jon Ewanich
- 👤 Bill Gervasi
- 👤 Paul Franklin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:26
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
145 words
Apparatus comprising: a first packaged integrated circuit comprising a first semiconductor die and a first set of electrical interconnection elements disposed on a surface of said first packaged integrated circuit, the first semiconductor die positioned in said first packaged integrated circuit in a "cavity-down" arrangement; and a second packaged integrated circuit comprising a second semiconductor die, a second set of electrical interconnection elements disposed on a lower surface of said second packaged integrated circuit, and a third set of electrical interconnection elements disposed on an upper surface of said second packaged integrated circuit, said second set of electrical interconnection elements being arranged to electrically couple and non-destructively decouple with corresponding electrical interconnection elements of said first set of electrical interconnection elements by application of manual force, said second semiconductor die serving as an electrical interface between said second and third sets of electrical interconnection elements.
Claim 2
Dependent Claim
145 words
Apparatus comprising: a first packaged integrated circuit comprising a first semiconductor die and a first set of electrical interconnection elements disposed on a surface of said first packaged integrated circuit, the first semiconductor die positioned in said first packaged integrated circuit in a "cavity-down" arrangement; and a second packaged integrated circuit comprising a second semiconductor die, a second set of electrical interconnection elements disposed on a lower surface of said second packaged integrated circuit, and a third set of electrical interconnection elements disposed on an upper surface of said second packaged integrated circuit, said second set of electrical interconnection elements being arranged to electrically couple and non-destructively decouple with corresponding electrical interconnection elements of said first set of electrical interconnection elements by application of manual force, said second semiconductor die serving as an electrical interface between said second and third sets of electrical interconnection elements.
Claim 3
Dependent Claim
24 words
Apparatus as set forth in claim 1 wherein said second semiconductor die is positioned in said second packaged integrated circuit in a "cavity-down" arrangement.
Claim 4
Dependent Claim
24 words
Apparatus as set forth in claim 1 wherein said first semiconductor die is positioned in said first packaged integrated circuit in a "cavity-up" arrangement.
Claim 5
Dependent Claim
148 words
Apparatus comprising: a first packaged integrated circuit comprising a first semiconductor die and a first set of electrical interconnection elements disposed on a surface of said first packaged integrated circuit; and a second packaged integrated circuit comprising a second semiconductor die, a second set of electrical interconnection elements disposed on a lower surface of said second packaged integrated circuit, and a third set of electrical interconnection elements disposed on an upper surface of said second packaged integrated circuit, said second set of electrical interconnection elements being arranged to electrically couple and non-destructively decouple with corresponding electrical interconnection elements of said first set of electrical interconnection elements by application of manual force, said second semiconductor die serving as an electrical interface between said second and third sets of electrical interconnection elements and wherein said second semiconductor die is positioned in said second packaged integrated circuit in a "cavity-down" arrangement.
Claim 6
Dependent Claim
148 words
Apparatus comprising: a first packaged integrated circuit comprising a first semiconductor die and a first set of electrical interconnection elements disposed on a surface of said first packaged integrated circuit; and a second packaged integrated circuit comprising a second semiconductor die, a second set of electrical interconnection elements disposed on a lower surface of said second packaged integrated circuit, and a third set of electrical interconnection elements disposed on an upper surface of said second packaged integrated circuit, said second set of electrical interconnection elements being arranged to electrically couple and non-destructively decouple with corresponding electrical interconnection elements of said first set of electrical interconnection elements by application of manual force, said second semiconductor die serving as an electrical interface between said second and third sets of electrical interconnection elements and wherein said second semiconductor die is positioned in said second packaged integrated circuit in a "cavity-down" arrangement.
Claim 7
Dependent Claim
24 words
Apparatus as set forth in claim 1 wherein said second semiconductor die is positioned in said second packaged integrated circuit in a "cavity-up" arrangement.
Claim 8
Dependent Claim
69 words
Apparatus as set forth in claim 1, said apparatus further comprising a third packaged integrated circuit comprising a fourth set of electrical interconnection elements disposed on a lower surface of said third packaged integrated circuit, said fourth set of electrical interconnection elements being arranged to electrically couple and to non-destructively decouple with corresponding electrical interconnection elements of said third set of electrical interconnection elements by application of manual force.
Claim 9
Dependent Claim
186 words
Apparatus comprising: a first packaged integrated circuit comprising, a first set of electrical interconnection elements arranged on a first surface of said first packaged integrated circuit; and a second set of electrical interconnection elements arranged on a second surface of said first packaged integrated circuit, said second surface being opposite from said first surface and said second surface comprising a substrate having a first side and a second side upon which a thermally conductive material resides, said second set of electrical interconnection elements arranged upon said second surface; a first semiconductor die residing upon said first side of said substrate; and a second packaged integrated circuit comprising, a third set of electrical interconnection elements arranged on a first surface of said second packaged integrated circuit and shaped to mechanically and electrically couple to said second set of electrical interconnection elements; a fourth set of electrical interconnection elements arranged on a second surface of said second packaged integrated circuit; and a second semiconductor die residing upon said second packaged integrated circuit and serving as an electrical interface between said third and fourth sets of electrical interconnection elements.
Claim 10
Dependent Claim
186 words
Apparatus comprising: a first packaged integrated circuit comprising, a first set of electrical interconnection elements arranged on a first surface of said first packaged integrated circuit; and a second set of electrical interconnection elements arranged on a second surface of said first packaged integrated circuit, said second surface being opposite from said first surface and said second surface comprising a substrate having a first side and a second side upon which a thermally conductive material resides, said second set of electrical interconnection elements arranged upon said second surface; a first semiconductor die residing upon said first side of said substrate; and a second packaged integrated circuit comprising, a third set of electrical interconnection elements arranged on a first surface of said second packaged integrated circuit and shaped to mechanically and electrically couple to said second set of electrical interconnection elements; a fourth set of electrical interconnection elements arranged on a second surface of said second packaged integrated circuit; and a second semiconductor die residing upon said second packaged integrated circuit and serving as an electrical interface between said third and fourth sets of electrical interconnection elements.
Claim 11
Dependent Claim
33 words
Apparatus as set forth in claim 7 wherein said second set of electrical interconnection elements are manually and electrically coupled to said third set of electrical interconnection elements by application of manual force.
Claim 12
Dependent Claim
37 words
Apparatus as set forth in claim 8 wherein said second set of electrical interconnection elements are capable of being non-destructively mechanically and electrically de-coupled from said third set of electrical interconnection elements by application of manual force.
Claim 13
Dependent Claim
27 words
Apparatus as set forth in claim 7 wherein said first set of electrical interconnection elements comprise solder balls formed to comprise a ball grid array type arrangement.
Claim 14
Dependent Claim
192 words
Apparatus comprising: a first packaged integrated circuit comprising, a first set of electrical interconnection elements arranged on a first surface of said first packaged integrated circuit; and a second set of electrical interconnection elements arranged on a second surface of said first packaged integrated circuit, said second surface being opposite from said first surface and comprising a substrate having a first side and a second side upon which a thermally conductive material resides, said second set of electrical interconnection elements arranged upon said second surface and extending through openings in said thermally conductive material; a first semiconductor die residing upon said first side of said substrate; and a second packaged integrated circuit comprising, a third set of electrical interconnection elements arranged on a first surface of said second packaged integrated circuit and shaped to mechanically and electrically couple to said second set of electrical interconnection elements; a fourth set of electrical interconnection elements arranged on a second surface of said second packaged integrated circuit; and a second semiconductor die residing upon said second packaged integrated circuit and serving as an electrical interface between said third and fourth sets of electrical interconnection elements.
Claim 15
Dependent Claim
192 words
Apparatus comprising: a first packaged integrated circuit comprising, a first set of electrical interconnection elements arranged on a first surface of said first packaged integrated circuit; and a second set of electrical interconnection elements arranged on a second surface of said first packaged integrated circuit, said second surface being opposite from said first surface and comprising a substrate having a first side and a second side upon which a thermally conductive material resides, said second set of electrical interconnection elements arranged upon said second surface and extending through openings in said thermally conductive material; a first semiconductor die residing upon said first side of said substrate; and a second packaged integrated circuit comprising, a third set of electrical interconnection elements arranged on a first surface of said second packaged integrated circuit and shaped to mechanically and electrically couple to said second set of electrical interconnection elements; a fourth set of electrical interconnection elements arranged on a second surface of said second packaged integrated circuit; and a second semiconductor die residing upon said second packaged integrated circuit and serving as an electrical interface between said third and fourth sets of electrical interconnection elements.
Claim 16
Dependent Claim
33 words
Apparatus as set forth in claim 11 wherein said second set of electrical interconnection elements are manually and electrically coupled to said third set of electrical interconnection elements by application of manual force.
Claim 17
Dependent Claim
37 words
Apparatus as set forth in claim 12 wherein said second set of electrical interconnection elements are capable of being non-destructively mechanically and electrically de-coupled from said third set of electrical interconnection elements by application of manual force.
Claim 18
Dependent Claim
27 words
Apparatus as set forth in claim 11 wherein said first set of electrical interconnection elements comprise solder balls formed to comprise a ball grid array type arrangement.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-25 | 2004-01-24 | 2004-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-25 | 2008-01-24 | 2008-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-25 | 2012-01-24 | 2012-07-25 | $7700.00 | Window Closed / Lapsed |