US6002180A
Expired / Lapsed
US
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Multi chip module with conductive adhesive layer
Assignee: Micron Technology Inc
•
Filing: 1998-04-23
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Granted: 1999-12-14
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Expires: 2018-04-23
Abstract
Abstract A method for forming a chip module such as a multi chip module or a memory module is provided. The multi chip module includes a substrate configured to mount a plurality of semiconductor dice thereon. The substrate includes raised contact members formed in patterns that correspond to the locations of bond pads on the dice. An anisotropic conductive adhesive layer is formed between the contact members on the substrate and the bond pads on the dice to secure the dice to the substrate and form an electrical connection therebetween. In addition, an underfill layer can be formed between the dice and substrate to fill the gap therebetween and further secure the dice to the substrate. Conductors and input/output pads formed on the substrate form electrical paths to and from the contact members. To form a memory module, one or more multi chip modules can be mounted to a supporting substrate having an edge connector in electrical communication with the conductors and with contact members on the substrates.
Inventors
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/40; H05K3/4007; H10W70/681; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/20; H10W72/251; H10W72/253; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
88 words
A chip module comprising: a substrate; a multi layered tape attached to the substrate comprising an insulating film, a microbump in a via on a first side of the film, and a conductor on a second opposing side of the film in electrical communication with the microbump; a die on the substrate comprising a pad in electrical communication with the microbump; and a conductive adhesive layer between the die and the substrate establishing electrical communication between the microbump and the pad, and attaching the die to the substrate.
Claim 2
Dependent Claim
88 words
A chip module comprising: a substrate; a multi layered tape attached to the substrate comprising an insulating film, a microbump in a via on a first side of the film, and a conductor on a second opposing side of the film in electrical communication with the microbump; a die on the substrate comprising a pad in electrical communication with the microbump; and a conductive adhesive layer between the die and the substrate establishing electrical communication between the microbump and the pad, and attaching the die to the substrate.
Claim 3
Dependent Claim
16 words
The module of claim 1 wherein the microbump comprises a cap layer comprising a non-oxidizing material.
Claim 4
Dependent Claim
15 words
The module of claim 1 further comprising an underfill layer between the die and substrate.
Claim 5
Dependent Claim
11 words
The module of claim 1 wherein the insulating film comprises polyimide.
Claim 6
Dependent Claim
16 words
The module of claim 1 wherein the microbump comprises a metal or a conductive polymer bump.
Claim 7
Dependent Claim
100 words
A multi chip module comprising: a silicon substrate comprising a plurality of raised contact members comprising raised portions of the substrate at least partially covered with conductive layers; a plurality of conductors on the substrate in electrical communication with the conductive layers; a plurality of semiconductor dice on the substrate comprising a plurality of die contacts; and a conductive adhesive layer between the dice and the substrate attaching and electrically connecting the conductive layers to the die contacts, the conductive adhesive layer compressed by the raised portions of the substrate and the conductive layers into contact with the die contacts.
Claim 8
Dependent Claim
100 words
A multi chip module comprising: a silicon substrate comprising a plurality of raised contact members comprising raised portions of the substrate at least partially covered with conductive layers; a plurality of conductors on the substrate in electrical communication with the conductive layers; a plurality of semiconductor dice on the substrate comprising a plurality of die contacts; and a conductive adhesive layer between the dice and the substrate attaching and electrically connecting the conductive layers to the die contacts, the conductive adhesive layer compressed by the raised portions of the substrate and the conductive layers into contact with the die contacts.
Claim 9
Dependent Claim
17 words
The multi chip module of claim 6 further comprising a non-oxidizing cap layer on each conductive layer.
Claim 10
Dependent Claim
31 words
The multi chip module of claim 6 wherein the conductive adhesive layer comprises a plurality of conductive particles compressed by the raised portions and the conductive layers into the die contacts.
Claim 11
Dependent Claim
17 words
The multi chip module of claim 6 wherein the conductive layers and conductors comprise a same material.
Claim 12
Dependent Claim
24 words
The multi chip module of claim 6 wherein the contact members comprise a plurality of projections at least partially covered by the conductive layers.
Claim 13
Dependent Claim
25 words
The multi chip module of claim 6 wherein the dice comprise memory devices and the multi chip module comprises a single in line memory module.
Claim 14
Dependent Claim
20 words
The multi chip module of claim 6 wherein the conductive layers and conductors comprise outer layers comprising a non-oxidizing metal.
Claim 15
Dependent Claim
14 words
The multi chip module of claim 6 wherein the dice comprise a semiconductor wafer.
Claim 16
Dependent Claim
18 words
The multi chip module of claim 6 further comprising an underfill layer between the substrate and the dice.
Claim 17
Dependent Claim
114 words
A chip module comprising: a substrate; a semiconductor die on the substrate comprising a plurality of first contacts in a first pattern; a plurality of second contacts on the substrate in a second pattern substantially matching the first pattern, the second contacts comprising raised portions of the substrate having tip portions with a plurality of projections extending therefrom at least partially covered with conductive layers; and a conductive adhesive layer between the second contacts and the first contacts configured to establish electrical communication therebetween, the conductive adhesive layer compressed by the second contacts against the die and comprising a plurality of conductive particles forced by the projections into electrical contact with the first contacts.
Claim 18
Dependent Claim
114 words
A chip module comprising: a substrate; a semiconductor die on the substrate comprising a plurality of first contacts in a first pattern; a plurality of second contacts on the substrate in a second pattern substantially matching the first pattern, the second contacts comprising raised portions of the substrate having tip portions with a plurality of projections extending therefrom at least partially covered with conductive layers; and a conductive adhesive layer between the second contacts and the first contacts configured to establish electrical communication therebetween, the conductive adhesive layer compressed by the second contacts against the die and comprising a plurality of conductive particles forced by the projections into electrical contact with the first contacts.
Claim 19
Dependent Claim
15 words
The chip module of claim 15 wherein the substrate and the second contacts comprise silicon.
Claim 20
Dependent Claim
16 words
The chip module of claim 15 wherein the conductive adhesive layer comprises a z-axis anisotropic adhesive.
Claim 21
Dependent Claim
16 words
The chip module of claim 15 further comprising an underfill layer between the substrate and die.
Claim 22
Dependent Claim
35 words
The chip module of claim 15 further comprising a plurality of conductors on the substrate in electrical communication with the second contacts and an electrical connector on the substrate in electrical communication with the conductors.
Claim 23
Dependent Claim
114 words
A chip module comprising: a substrate; a semiconductor die on the substrate comprising a plurality of first contacts in a first pattern; a multi layered tape attached to the substrate comprising an insulating film having a first side, an opposing second side, a plurality of vias therethrough, a plurality of microbumps on the first side in the vias, and a plurality of conductors on the second side in electrical communication with the microbumps, the microbumps having a second pattern substantially matching the first pattern; a conductive adhesive layer between the die and the substrate electrically connecting and attaching the first contacts to the microbumps; and an underfill layer between the die and the substrate.
Claim 24
Dependent Claim
114 words
A chip module comprising: a substrate; a semiconductor die on the substrate comprising a plurality of first contacts in a first pattern; a multi layered tape attached to the substrate comprising an insulating film having a first side, an opposing second side, a plurality of vias therethrough, a plurality of microbumps on the first side in the vias, and a plurality of conductors on the second side in electrical communication with the microbumps, the microbumps having a second pattern substantially matching the first pattern; a conductive adhesive layer between the die and the substrate electrically connecting and attaching the first contacts to the microbumps; and an underfill layer between the die and the substrate.
Claim 25
Dependent Claim
20 words
The chip module of claim 20 further comprising a compliant adhesive layer attaching the multi layered tape to the substrate.
Claim 26
Dependent Claim
12 words
The chip module of claim 20 wherein the insulating film comprises polyimide.
Claim 27
Dependent Claim
26 words
The chip module of claim 20 wherein the substrate comprises a material selected from the group consisting of silicon, ceramic, glass filled polymer, FR-4, and plastic.
Claim 28
Dependent Claim
116 words
A chip module comprising: a semiconductor die comprising a plurality of first contacts in a first pattern; a conductive adhesive layer on the die at least partially covering the first contacts; a silicon substrate comprising a plurality of second contacts on the substrate in a second pattern substantially matching the first pattern, the second contacts comprising pillars formed as portions of the substrate at least partially covered with conductive layers, the second contacts configured to compress the conductive adhesive layer to establish electrical communication between the conductive layers and the first contacts; a plurality of conductors on the substrate in electrical communication with the conductive layers; and an underfill layer attaching the die to the substrate.
Claim 29
Dependent Claim
116 words
A chip module comprising: a semiconductor die comprising a plurality of first contacts in a first pattern; a conductive adhesive layer on the die at least partially covering the first contacts; a silicon substrate comprising a plurality of second contacts on the substrate in a second pattern substantially matching the first pattern, the second contacts comprising pillars formed as portions of the substrate at least partially covered with conductive layers, the second contacts configured to compress the conductive adhesive layer to establish electrical communication between the conductive layers and the first contacts; a plurality of conductors on the substrate in electrical communication with the conductive layers; and an underfill layer attaching the die to the substrate.
Claim 30
Dependent Claim
15 words
The chip module of claim 24 wherein the substrate and the second contacts comprise silicon.
Claim 31
Dependent Claim
17 words
The chip module of claim 24 wherein the conductive layers and the conductors comprise a non-oxidizing metal.
References Cited (Backward Citations)
JPH02180036A
Cited
US5668059A
Cited
US5140405A
Cited
US5866951A
Cited
US5262674A
Cited
JPH04323840A
Cited
US5634267A
Cited
US5519332A
Cited
US5541525A
Cited
US5559444A
Cited
US5686317A
Cited
US5607818A
Cited
US5678301A
Cited
US5440240A
Cited
JPH05166961A
Cited
US5578526A
Cited
US5438223A
Cited
US5458694A
Cited
US5483741A
Cited
US5557149A
Cited
US5474620A
Cited
US5625230A
Cited
US5578527A
Cited
US5661042A
Cited
US5844320A
Cited
US5789278A
Cited
US5790377A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-13 | 2003-06-14 | 2003-12-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-13 | 2007-06-14 | 2007-12-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-13 | 2011-06-14 | 2011-12-14 | $7700.00 | Window Closed / Lapsed |