Hybrid circuit with an electrically conductive adhesive

Claim 1

A composite hybrid semiconductor structure comprising a support plate substrate (11); a plurality of support connector spots (13) located on a surface of the support plate substrate (11); a semiconductor chip or semiconductor wafer substrate (10); a plurality of chip connector spots (16) located on a surface of the semiconductor chip or semiconductor wafer substrate (10); thermally and electrically conductive adhesive layer elements (13') located between the areas of the support connector spots (13) on the surface of the support plate substrate (11) and said chip connector spots (16) on the surface of the semiconductor chip or semiconductor wafer substrate (10), said thermally and electrically conductive adhesive layer elements (13') forming an electrically conductive and mechanically firm connection; and at least one further thermally and electrically conductive adhesive layer portion (130') located between the surface of the support plate substrate (11) and the surface of the semiconductor chip or semiconductor wafer substrate (10) in an area outside of the areas of the support connector spots (13) to improve the mechanically firm connection of said substrates (10, 11) and dissipation of heat arising in operation of said semiconductor structure.