US5789278A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for fabricating chip modules
Assignee: Micron Technology Inc
•
Filing: 1996-07-30
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Granted: 1998-08-04
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Expires: 2016-07-30
Abstract
Abstract A method for forming a chip module such as a multi chip module or a memory module is provided. The multi chip module includes a substrate configured to mount a plurality of semiconductor dice thereon. The substrate includes raised contact members formed in patterns that correspond to the locations of bond pads on the dice. An anisotropic conductive adhesive layer is formed between the contact members on the substrate and the bond pads on the dice to secure the dice to the substrate and form an electrical connection therebetween. In addition, an underfill layer can be formed between the dice and substrate to fill the gap therebetween and further secure the dice to the substrate. Conductors and input/output pads formed on the substrate form electrical paths to and from the contact members. To form a memory module, one or more multi chip modules can be mounted to a supporting substrate having an edge connector in electrical communication with the conductors and with contact members on the substrates.
Inventors
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/40; H05K3/4007; H10W70/681; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/20; H10W72/251; H10W72/253; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
84 words
A method for fabricating a chip module, comprising: providing a semiconductor die with a plurality of contact locations; providing a substrate comprising a pattern of contact members formed thereon, said contact members comprising microbumps formed on an insulating film attached to the substrate, said contact members configured to provide electrical connections with the contact locations; and mounting a semiconductor die to the substrate using a conductive adhesive layer to electrically connect the contact members on the substrate to the contact locations on the die.
Claim 2
Independent Claim
84 words
A method for fabricating a chip module, comprising: providing a semiconductor die with a plurality of contact locations; providing a substrate comprising a pattern of contact members formed thereon, said contact members comprising microbumps formed on an insulating film attached to the substrate, said contact members configured to provide electrical connections with the contact locations; and mounting a semiconductor die to the substrate using a conductive adhesive layer to electrically connect the contact members on the substrate to the contact locations on the die.
Claim 3
Dependent Claim
21 words
The method as claimed in claim 1 further comprising a conductor on the insulating film in electrical communication with each microbump.
Claim 4
Dependent Claim
16 words
The method as claimed in claim 1 wherein the insulating film comprises a multi layered tape.
Claim 5
Dependent Claim
23 words
The method as claimed in claim 1 further comprising forming a cap layer on each microbump, said cap layer comprising a non-oxidizing material.
Claim 6
Dependent Claim
37 words
The method as claimed in claim 1 further comprising forming a cap layer on each microbump, said cap layer comprises a material selected from the group consisting of gold, palladium, tungsten, platinum and alloys of these materials.
Claim 7
Dependent Claim
27 words
The method as claimed in claim 1 wherein the insulating film comprises a multi layered tape with conductors thereon, said microbumps in electrical communication with the conductors.
Claim 8
Dependent Claim
20 words
The method as claimed in claim 1 further comprising forming an adhesive layer between the substrate and the insulating film.
Claim 9
Dependent Claim
20 words
The method as claimed in claim 1 further comprising forming an underfill layer between the insulating film and the substrate.
Claim 10
Independent Claim
97 words
A method for fabricating a chip module comprising: providing a semiconductor die with a contact location; providing a substrate; attaching an insulating film to the substrate, said insulating film comprising a microbump and a conductor in electrical communication with the microbump; applying a conductive adhesive layer to the microbump or to the contact location; aligning the microbump with the contact location; compressing the conductive adhesive layer between the microbump and the contact location to attach the die to the substrate and establish electrical communication between the microbump and the contact location; and curing the conductive adhesive layer.
Claim 11
Independent Claim
97 words
A method for fabricating a chip module comprising: providing a semiconductor die with a contact location; providing a substrate; attaching an insulating film to the substrate, said insulating film comprising a microbump and a conductor in electrical communication with the microbump; applying a conductive adhesive layer to the microbump or to the contact location; aligning the microbump with the contact location; compressing the conductive adhesive layer between the microbump and the contact location to attach the die to the substrate and establish electrical communication between the microbump and the contact location; and curing the conductive adhesive layer.
Claim 12
Dependent Claim
20 words
The method as claimed in claim 9 further comprising forming an underfill layer between the die and the insulating film.
Claim 13
Dependent Claim
24 words
The method as claimed in claim 9 further comprising forming a cap layer on the microbump, said cap layer comprising a non oxidizing metal.
Claim 14
Dependent Claim
16 words
The method as claimed in claim 9 wherein the insulating film comprises multi layered TAB tape.
Claim 15
Dependent Claim
22 words
The method as claimed in claim 9 further comprising providing a conductor on the insulating film in electrical communication with the microbump.
Claim 16
Dependent Claim
15 words
The method as claimed in claim 9 wherein the insulating film comprises a polymer tape.
Claim 17
Dependent Claim
21 words
The method as claimed in claim 9 wherein attaching the insulating film to the substrate comprises forming an adhesive layer therebetween.
Claim 18
Independent Claim
97 words
A method for fabricating a chip module comprising: providing a substrate; providing a semiconductor die with a plurality of contact locations; forming a pattern of contact members on the substrate corresponding to the contact locations; applying an anisotropic conductive adhesive to the contact members or to the contact locations; aligning the contact members with the contact locations; assembling the substrate and die together with the anisotropic conductive adhesive compressed therebetween; and curing the conductive anisotropic adhesive to secure the die to the substrate and to form separate conductive paths between the contact members and the contact locations.
Claim 19
Independent Claim
97 words
A method for fabricating a chip module comprising: providing a substrate; providing a semiconductor die with a plurality of contact locations; forming a pattern of contact members on the substrate corresponding to the contact locations; applying an anisotropic conductive adhesive to the contact members or to the contact locations; aligning the contact members with the contact locations; assembling the substrate and die together with the anisotropic conductive adhesive compressed therebetween; and curing the conductive anisotropic adhesive to secure the die to the substrate and to form separate conductive paths between the contact members and the contact locations.
Claim 20
Dependent Claim
24 words
The method as claimed in claim 16 wherein each contact member comprises a bi-metal stack including a base layer and a non-oxidizing cap layer.
Claim 21
Dependent Claim
30 words
The method as claimed in claim 16 further comprising forming each contact member with at least one projection configured to press the anisotropic conductive adhesive layer against a contact location.
Claim 22
Dependent Claim
17 words
The method as claimed in claim 16 wherein the contact members comprise microbumps on a flexible tape.
Claim 23
Dependent Claim
24 words
The method as claimed in claim 16 the contact members comprise metal or conductive polymer bumps on a pattern of conductors on the substrate.
Claim 24
Dependent Claim
18 words
The method as claimed in claim 16 further comprising forming an underfill layer between the die and substrate.
Claim 25
Dependent Claim
38 words
The method as claimed in claim 16 further comprising forming a memory module by mounting the substrate to a supporting substrate and electrically connecting the contact members on the substrate to an edge connector on the supporting substrate.
Claim 26
Dependent Claim
16 words
The method as claimed in claim 16 wherein the anisotropic conductive adhesive comprises a z-axis epoxy.
Claim 27
Independent Claim
112 words
A method for forming a chip module comprising: providing a wafer; providing a semiconductor die including a plurality of contact locations; forming a die bonding site on the wafer comprising a plurality of raised contact members configured to form electrical connections with the contact locations on the die; forming a conductive layer on each contact member; singulating the wafer to form a substrate including the die bonding site; applying a conductive adhesive to the contact members on the substrate or to the contact locations on the die; and compressing the conductive adhesive between the contact members on the substrate and the contact locations on the die to form separate electrical paths therebetween.
Claim 28
Independent Claim
112 words
A method for forming a chip module comprising: providing a wafer; providing a semiconductor die including a plurality of contact locations; forming a die bonding site on the wafer comprising a plurality of raised contact members configured to form electrical connections with the contact locations on the die; forming a conductive layer on each contact member; singulating the wafer to form a substrate including the die bonding site; applying a conductive adhesive to the contact members on the substrate or to the contact locations on the die; and compressing the conductive adhesive between the contact members on the substrate and the contact locations on the die to form separate electrical paths therebetween.
Claim 29
Dependent Claim
29 words
The method as claimed in claim 24 further comprising optically aligning the contact members on the substrate with the contact locations on the die prior to the compressing step.
Claim 30
Dependent Claim
26 words
The method as claimed in claim 24 further comprising forming the conductive layer as a bi-metal stack including a base layer and a non-oxidizing cap layer.
Claim 31
Dependent Claim
31 words
The method as claimed in claim 24 further comprising forming each contact member with at least one projection configured to press the conductive adhesive layer into contact with a contact location.
Claim 32
Dependent Claim
18 words
The method as claimed in claim 24 further comprising forming an underfill layer between the die and substrate.
Claim 33
Dependent Claim
22 words
The method as claimed in claim 24 wherein the substrate includes a plurality of die bonding sites for a plurality of dice.
Claim 34
Dependent Claim
16 words
The method as claimed in claim 24 wherein forming the contact members comprises etching the substrate.
Claim 35
Dependent Claim
24 words
The method as claimed in claim 24 further comprising forming a plurality of conductors on the substrate in electrical communication with the contact members.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-03 | 2002-02-02 | 2002-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-03 | 2006-02-02 | 2006-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-03 | 2010-02-02 | 2010-08-04 | $7700.00 | Window Closed / Lapsed |