US5668059A
Expired / Lapsed
US
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Solder interconnection structure and process for making
Assignee: International Business Machines Corp
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Filing: 1996-07-12
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Granted: 1997-09-16
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Expires: 2016-07-12
Abstract
Abstract Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
Inventors
- 👤 Frederick Richard Christie
- 👤 Kostas I. Papathomas
- 👤 David Wei Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:21
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/285; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31547
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
178 words
A method of increasing the fatigue life of solder interconnections between a semiconductor device and a supporting substrate comprising attaching said device to said substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device; filling said gap with a composition that contains: A. binder selected from the group of a cycloaliphatic epoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B; and curing said composition.
Claim 2
Independent Claim
178 words
A method of increasing the fatigue life of solder interconnections between a semiconductor device and a supporting substrate comprising attaching said device to said substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device; filling said gap with a composition that contains: A. binder selected from the group of a cycloaliphatic epoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B; and curing said composition.
Claim 3
Dependent Claim
16 words
The method of claim 1 wherein said gap is about 15 to about 160 microns wide.
Claim 4
Dependent Claim
22 words
The method of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
Claim 5
Dependent Claim
12 words
The method of claim 1 wherein said binder includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane 3 carboxylate.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein the viscosity of said binder at 25° C. is about 35 to about 500 centipoise.
Claim 7
Dependent Claim
11 words
The method of claim 1 wherein said filler is aluminum nitride.
Claim 8
Dependent Claim
18 words
The method of claim 1 wherein said filler has particle sizes of about 0.5 to about 31 micrometers.
Claim 9
Dependent Claim
28 words
The method of claim 1 wherein said amount of said binder is about 25-60% by weight and said amount of said filler is correspondingly about 40-75% by weight.
Claim 10
Dependent Claim
17 words
The method of claim 1 wherein said composition includes an anhydride of an organic carboxylic acid hardener.
Claim 11
Dependent Claim
18 words
The method of claim 9 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
Claim 12
Dependent Claim
18 words
The method of claim 9 wherein the amount of the hardener is about 89 to about 110 phr.
Claim 13
Dependent Claim
21 words
The method of claim 9 wherein the viscosity at 25° C. of said composition is about 1,500 to about 30,000 centipoise.
Claim 14
Dependent Claim
12 words
The method of claim 1 wherein said composition also includes a catalyst.
Claim 15
Dependent Claim
22 words
The method of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
Claim 16
Dependent Claim
14 words
The method of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 17
Dependent Claim
13 words
The method of claim 1 wherein said composition also includes an adhesion promoter.
Claim 18
Dependent Claim
11 words
The method of claim 1 wherein the composition contains coupling agent.
Claim 19
Dependent Claim
28 words
The method of claim 17 wherein the coupling agent is selected from the group consisting of γ-amino propyl triethoxy silane, β-(3,4,-epoxy cyclohexyl) ethyltrimethoxy silane, and γ-glycidoxy propyltrimethoxy silane.
Claim 20
Dependent Claim
28 words
The method of claim 17 wherein the coupling agent is present in an amount which is about 0.25% by weight to about 2% by weight of the binder.
Claim 21
Dependent Claim
16 words
The method of claim 1 wherein said substrate is an organic, inorganic or a composite material.
Claim 22
Dependent Claim
12 words
The method of claim 1 wherein said binder is a cyanate ester.
Claim 23
Dependent Claim
29 words
The method of claim 1 wherein said cyanate ester is chosen from the group consisting of 4,4'-ethylidene bisphenol dicyanate, bisphenol-M dicyanate, bisphenol-P dicyanate, hexafluorobisphenol A dicyanate, and mixtures thereof.
Claim 24
Dependent Claim
12 words
The method of claim 1 wherein the substrate is an organic substrate.
Claim 25
Dependent Claim
34 words
The method of claim 23 wherein the organic substrate comprises a material chosen from the group consisting of FR-4 epoxy, polyimides, cyanates (triazines), fluoropolymers, benzocyclobutenes, polyphenylenesulfide, polysulfones, polyetherimides, polyetherketones, polyphenylquinoxalines, polybenzoxazoles, and polyphenyl benzobisthiazoles.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-15 | 2001-03-17 | 2001-09-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-15 | 2005-03-17 | 2005-09-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-15 | 2009-03-17 | 2009-09-16 | $7700.00 | Window Closed / Lapsed |