US5089440A
Expired / Lapsed
US
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Solder interconnection structure and process for making
Assignee: International Business Machines Corp
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Filing: 1990-12-10
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Granted: 1992-02-18
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Expires: 2010-12-10
Abstract
Abstract Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
Inventors
- 👤 Frederick R. Christie
- 👤 Kostas I. Papathomas
- 👤 David W. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:31
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/285; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T428/00; Y10T428/31504; Y10T428/31547
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
162 words
A method of increasing the fatigue life of solder interconnections between a semiconductor device and a supporting substrate comprising attaching said device to said substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device; filling said gap with a composition that contains: A. binder selected from the group of a cycloaliphatic epoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 31 microns and being free of alpha particle emissions; wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B; and curing said composition.
Claim 2
Independent Claim
162 words
A method of increasing the fatigue life of solder interconnections between a semiconductor device and a supporting substrate comprising attaching said device to said substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device; filling said gap with a composition that contains: A. binder selected from the group of a cycloaliphatic epoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 31 microns and being free of alpha particle emissions; wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B; and curing said composition.
Claim 3
Dependent Claim
16 words
The method of claim 1 wherein said gap is about 25 to about 160 microns wide.
Claim 4
Dependent Claim
22 words
The method of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said binder includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein the viscosity of said binder at 25° C. is about 35 to about 500 centipoise.
Claim 7
Dependent Claim
22 words
The method of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica.
Claim 8
Dependent Claim
19 words
The method of claim 1 wherein said filler has emission rate of less than 0.01 alpha particles/cm 2 -hr.
Claim 9
Dependent Claim
18 words
The method of claim 1 wherein said filler has particle sizes of about 0.5 to about 20 micrometers.
Claim 10
Dependent Claim
28 words
The method of claim 1 wherein said amount of said binder is about 43% by weight and said amount of said filler is correspondingly about 57% by weight.
Claim 11
Dependent Claim
17 words
The method of claim 1 wherein said composition includes an anhydride of an organic carboxylic acid hardener.
Claim 12
Dependent Claim
18 words
The method of claim 10 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
Claim 13
Dependent Claim
18 words
The method of claim 10 wherein the amount of the hardener is about 89 to about 110 phr.
Claim 14
Dependent Claim
21 words
The method of claim 1 wherein the viscosity at 25° C. of said composition is about 3,000 to about 17,000 centipoise.
Claim 15
Dependent Claim
12 words
The method of claim 1 wherein said composition also includes a catalyst.
Claim 16
Dependent Claim
22 words
The method of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
Claim 17
Dependent Claim
14 words
The method of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 18
Dependent Claim
13 words
The method of claim 1 wherein said composition also includes an adhesion promoter.
Claim 19
Dependent Claim
16 words
The method of claim 1 wherein said substrate is an organic, inorganic or a composite material.
Claim 20
Dependent Claim
12 words
The method of claim 1 wherein said binder is a cyanate ester.
Claim 21
Dependent Claim
13 words
The method of claim 1 wherein said cyanate ester is 4,4'-ethylidene bisphenol dicyanate.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-17 | 1995-08-19 | 1996-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-17 | 1999-08-19 | 2000-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-17 | 2003-08-19 | 2004-02-18 | $7700.00 | Window Closed / Lapsed |