Patent US5891759A successfully refreshed from Google Patents.
US5891759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a multiple heat sink resin sealing type semiconductor device
Assignee: Seiko Epson Corp
•
Filing: 1996-10-11
•
Granted: 1999-04-06
•
Expires: 2016-10-11
Abstract
Abstract A resin sealing type semiconductor device has first and second heat radiating portions located on opposite sides of a semiconductor element. The first heat radiating portion has an element placing surface. A plurality of leads are disposed at a given distance from the semiconductor element, and connected to the electrode pads through wires. The second heat radiating portion is located in non-contact with the semiconductor element, leads and wires. A first insulating portion is located between the first heat radiating portion and the leads. A second insulating portion is located between the second heat radiating portion and the leads. Preferably, the first insulating portion is formed continuously on one side of the first heat radiating portion, and the second insulating portion on one side of the second heat radiating portion. A space enclosed by these insulating and heat radiating portions houses the semiconductor element, the wires and the tips of the leads.
Inventors
- 👤 Tetsuya Otsuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:36
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W40/10; H10W72/00; H10W72/50; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
163 words
A method of making a resin sealing type semiconductor element, comprising the steps of: fixing a first insulating portion between a first heat radiating portion and a plurality of leads; bonding a semiconductor element to an element placing surface of said first heat radiating portion; electrically connecting said plurality of leads to electrodes of said semiconductor element through wires; fixing a second insulating portion between said plurality of leads and a second heat radiating portion, said second heat radiating portion being located opposite to said first heat radiating portion, and not contacting said semiconductor element, said plurality of leads and said wires, such that a space enclosed by said first and second heat radiating portions and said first and second insulating portions accommodates at least said semiconductor element, wires and a portion of each of said plurality of leads; and forming a resin sealing portion around an exterior of said first and second heat radiating portions and said first and second insulating portions.
Claim 2
Independent Claim
163 words
A method of making a resin sealing type semiconductor element, comprising the steps of: fixing a first insulating portion between a first heat radiating portion and a plurality of leads; bonding a semiconductor element to an element placing surface of said first heat radiating portion; electrically connecting said plurality of leads to electrodes of said semiconductor element through wires; fixing a second insulating portion between said plurality of leads and a second heat radiating portion, said second heat radiating portion being located opposite to said first heat radiating portion, and not contacting said semiconductor element, said plurality of leads and said wires, such that a space enclosed by said first and second heat radiating portions and said first and second insulating portions accommodates at least said semiconductor element, wires and a portion of each of said plurality of leads; and forming a resin sealing portion around an exterior of said first and second heat radiating portions and said first and second insulating portions.
Claim 3
Dependent Claim
96 words
A method as defined in claim 1, wherein at least one of said first and second heat radiating portions includes at least one resin pouring aperture formed therethrough, and wherein after said step of fixing a second insulating portion, a step of partially filling the space with resin is performed by injecting the resin into the space enclosed by said first and second heat radiating portions and said first and second insulating portions through said at least one resin pouring aperture to form a resin layer which covers at least a surface of said semiconductor element.
Claim 4
Dependent Claim
23 words
A method as defined in claim 2, wherein said resin layer is formed so that said space is substantially filled with the resin.
Claim 5
Dependent Claim
19 words
A method as defined in claim 2, wherein said resin sealing portion is formed simultaneously with said resin layer.
Claim 6
Dependent Claim
55 words
A method as defined in claim 2, wherein said step of partially filling the space is performed using a resin having a thermal coefficient of expansion substantially equal to that of the semiconductor element and the resin covers at least the semiconductor element, the wires, and a part of each of the plurality of leads.
Claim 7
Dependent Claim
25 words
A method as defined in claim 5, wherein said resin layer has a linear expansion coefficient ranging between 1.0×10 -6 cm/°C. and 2.0×10 -5 cm/°C.
Claim 8
Dependent Claim
40 words
A method as defined in claim 1, further comprising a step of forming a resin layer to cover at least a surface of said semiconductor element after performing the step of electrically connecting said plurality of leads to said electrodes.
Claim 9
Dependent Claim
25 words
A method as defined in claim 7, wherein said resin layer has a linear expansion coefficient ranging between 1.0×10 -6 cm/°C. and 2.0×10 -5 cm/°C.
Claim 10
Dependent Claim
34 words
A method as defined in claim 1, wherein said step of forming a resin sealing portion comprises forming a resin sealing portion such that said first and second heat radiating portions are partially exposed.
Claim 11
Dependent Claim
33 words
A method as defined in claim 9, further comprising the step of forming a corrosion inhibiting layer on an exposed portion of at least one of the first and second heat radiating portions.
Claim 12
Dependent Claim
39 words
A method as defined in claim 1, wherein said step of forming a resin sealing portion comprises forming the resin sealing portion of a material having a linear expansion coefficient ranging between 1.0×10 -5 cm/°C. and 2.0×10 -5 cm/°C.
Claim 13
Dependent Claim
39 words
A method as defined in claim 1, wherein said step of forming a resin sealing portion comprises forming the resin sealing portion of a material having a linear expansion coefficient ranging between 1.3×10 -5 cm/°C. and 1.6×10 -5 cm/°C.
Claim 14
Dependent Claim
35 words
A method as defined in claim 1, further comprising the step of filling any empty space between said first and second heat radiating portions and said first and second insulating portions with an inert gas.
Claim 15
Dependent Claim
30 words
A method as defined in claim 13, wherein said step of filling any space comprises filling the space with a gas selected from the group consisting of argon and nitrogen.
References Cited (Backward Citations)
US3212569A
Cited
US3290564A
Cited
US3965277A
Cited
US4151543A
Cited
JPS54124678A
Cited
JPS56122134A
Cited
JPS57136352A
Cited
JPS5812341A
Cited
JPS59207645A
Cited
JPS60223136A
Cited
EP0164794A2
Cited
JPS6297358A
Cited
US4684975A
Cited
JPS63179557A
Cited
JPS63240053A
Cited
WO1988007761A1
Cited
US4961106A
Cited
US4942497A
Cited
US5181097A
Cited
US5358904A
Cited
US5050040A
Cited
JPH02137249A
Cited
US5157478A
Cited
JPH02307251A
Cited
US5208188A
Cited
EP0436126A2
Cited
JPH03222464A
Cited
US5225499A
Cited
JPH03280453A
Cited
JPH0410558A
Cited
JPH0411758A
Cited
JPH0427145A
Cited
US5227662A
Cited
JPH04230056A
Cited
US5202288A
Cited
JPH04174551A
Cited
US5229643A
Cited
JPH0491458A
Cited
US5105259A
Cited
JPH04158556A
Cited
US5252855A
Cited
JPH04199664A
Cited
JPH04316357A
Cited
US5172213A
Cited
US5200809A
Cited
US5444025A
Cited
JPH05160304A
Cited
JPH05211262A
Cited
US5455462A
Cited
US5328870A
Cited
US5262927A
Cited
US5381042A
Cited
JPH0653390A
Cited
JPH0697321A
Cited
JPH0666351A
Cited
JPH0697326A
Cited
US5367196A
Cited
US5703398A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-05 | 2002-10-05 | 2003-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-05 | 2006-10-05 | 2007-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-05 | 2010-10-05 | 2011-04-06 | $7700.00 | Window Closed / Lapsed |