EP0436126A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Resin-encapsulated semiconductor device
Assignee: Toshiba Corp
•
Filing: 1990-12-03
•
Granted: —
•
Expires: 2010-12-03
Abstract
Abstract An insulating resin layer (13), such as a polyimide-resin tape, is formed on selected portions of a thin metal plate (12). Inner leads (14) and outer leads (15), which are integrally formed by etching a copper foil, are bonded to the resin layer (13). A semiconductor chip (17) is die-bonded to that portion of the metal plate (12) which is not covered by the resin layer (13). Metal wires (19) connect the outer leads (15) to the electrode pads (18) formed on the upper surface of the chip (17). The chip 17 is encapsulated by an envelope (20) made of an epoxy resin.
Inventors
- 👤 Yasuhiro C/O Intellectual Property Div. Yamaji
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 20:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/458; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/451; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
123 words
A resin-encapsulated semiconductor device characterized by comprising: a thin metal plate (12); an insulating member (13) formed on the metal plate; a lead-frame pattern (11) made of a conductive thin film and comprising a plurality of inner leads (14) formed on the insulating member, and a plurality of outer leads (15) formed on the insulating member and integrally with the inner leads (14); a semiconductor chip (17) fixed at a predetermined position in the lead-frame pattern (11) and having a plurality of electrode pads (18); connecting means (19) electrically connecting the electrode pads (18) of the semiconductor chip (17) to the inner leads (14) of the lead-frame pattern (11); and an envelope (20) made of resin and encapsulating the entire semiconductor chip (17).
Claim 2
Dependent Claim
36 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that said metal plate (12) has a plurality of through-holes, and the resin is applied via these through-holes to both sides of said metal plate (12).
Claim 3
Dependent Claim
37 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that those portions of said metal plate (12) on which said outer leads (15) are formed are bent and have a cross section shaped like letter J.
Claim 4
Dependent Claim
18 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that said connecting means are metal wires (19).
Claim 5
Dependent Claim
23 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that said connecting means are wiring strips (24) formed on a TAB tape.
Claim 6
Dependent Claim
38 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that those portions of said metal plate (12) on which said outer leads (15) are formed are bent and have a cross section shaped like an inverted J.
Claim 7
Dependent Claim
37 words
A resin-encapsulated semiconductor device according to claim 1, characterized in that those portions of said metal plate (12) on which said outer leads (15) are formed are bent and have a cross section shaped like letter L.
Claim 8
Dependent Claim
52 words
A resin-encapsulated semiconductor device according to claim 5, characterized in that those portions of said metal plate (12) which protrude from said envelope (20) and on which no outer leads are mounted have elongated notches (22), and these elongated notches (22) isolate the tips of said outer leads (15) from one another.
Claim 9
Dependent Claim
142 words
A resin-encapsulated semiconductor device characterized by comprising: a thin metal plate (12); an insulating member (13) formed on the metal plate; a lead-frame pattern (11) made of a conductive thin film and comprising a plurality of inner leads (14) formed on the insulating member, a plurality of outer leads (15) formed on the insulating member and integrally with the inner leads (14), and a plurality of wiring strips (24); a plurality of semiconductor chips (17) fixed at predetermined positions in the lead-frame pattern (11) and having a plurality of electrode pads (18); connecting means (19) electrically connecting the electrode pads (18) of the semiconductor chips (17), the inner leads (14) of the lead-frame pattern (11), and said wiring strips (24), thereby connecting semiconductor chips (17) to one another; and an envelope (20) made of resin and encapsulating the entire semiconductor chip (17).
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.