Semiconductor device

Abstract

Abstract PURPOSE:To improve heat radiation and to prevent failure in bonding by a method wherein a pellet is directly mounted on a single-faced exposure-type radiation fin and the said radiation fin and leads are fixed by adhesive structure in a subminiaturized flat package integrated circuit. CONSTITUTION:A pellet 16 can directly be mounted on an exposure-type radiation fin 11, so thermal resistance can be reduced. Adhesive structure between the radiation fin 11 and the leads 13 thins the space between the radiation fin 11 and the leads 13 and eliminates the need for a conventional caulking section. Furthermore, good heat radiation permits the miniaturization of the fin 11, etc. Thus, remarkable miniaturization comparing with conventional cases becomes possible. As each lead 13 is fixed by an edhesive tape 15, repair in leads due to hitch by some item during a process is not required and failure in bonding by unequalizing the interval between each lead 13 is eliminated.

Inventors

• 👤 「徳」丸　征也
• 👤 Seiya Tokumaru
• 👤 Yoshimasa Kudo
• 👤 工藤　好正

Bibliographic Details