Semiconductor device of resin potted type

Abstract

Abstract PURPOSE:To prevent wirings short circuits and improve heat radiating capability by a method wherein potting with resin follows the provision of a soft silicone resin encapsulating layer covering the entire surface of the bonding wire in a semiconductor chip resin potting process. CONSTITUTION:A semiconductor chip 13 is mounted by solder 12 on a Cu or Al made heat sink 11 and the heat sink 11 is coated with an insulator layer 14 around its periphery. Secured on the insulator layer 14 via an insulating adhesive layer 16 is a lead 15. The lead 15 and a bonding pad 18 on the semiconductor chip 13 connected with each other by a bonding wire 17. The entire surface of the bonding wire 17 is provided with a soft silicone resin encapsulating layer 19. Finally, the entire semiconductor device is potted in resin 20. The bonding wire 17, surrounded with soft potting resin, does not change its location when undergoing the potting process, which prevents short circuits and improves heat radiating capability.

Inventors

• 👤 Takeyumi Abe

Bibliographic Details