US5879761A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming electrically conductive polymer interconnects on electrical substrates
Assignee: Adeia Semiconductor Technologies LLC
•
Filing: 1995-07-18
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Granted: 1999-03-09
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Expires: 2015-07-18
Abstract
Abstract A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
Inventors
- 👤 Frank W. Kulesza
- 👤 Richard H. Estes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:49
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4473; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K2203/00; H05K2203/11; H05K2203/1189; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/22; H05K3/28; H05K3/303; H05K3/305; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07237; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/20; H10W72/221; H10W72/225; H10W72/241; H10W72/251; H10W72/252; H10W72/253; H10W72/30; H10W72/331; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
69 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness selected such that when electrically conductive bumps on bond pads of a second substrate are contacted with the uncoated bond pads, void space between the substrates is substantially eliminated.
Claim 2
Independent Claim
69 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness selected such that when electrically conductive bumps on bond pads of a second substrate are contacted with the uncoated bond pads, void space between the substrates is substantially eliminated.
Claim 3
Independent Claim
68 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness selected such that when electrical interconnections are formed between the uncoated bond pads and bond pads of a second substrate, void space between the substrates is substantially eliminated.
Claim 4
Independent Claim
68 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness selected such that when electrical interconnections are formed between the uncoated bond pads and bond pads of a second substrate, void space between the substrates is substantially eliminated.
Claim 5
Independent Claim
79 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness which is that thickness of electrically conductive interconnections to be formed on the uncoated bond pads, such that when electrically conductive interconnections are formed on the uncoated bond pads, the interconnections are substantially flush with the organic protective layer.
Claim 6
Independent Claim
79 words
A method of selectively forming an organic protective layer on a substrate having bond pads, comprising the step of coating the substrate with the organic protective layer, leaving the bond pads uncoated, the organic protective layer being of a thickness which is that thickness of electrically conductive interconnections to be formed on the uncoated bond pads, such that when electrically conductive interconnections are formed on the uncoated bond pads, the interconnections are substantially flush with the organic protective layer.
Claim 7
Independent Claim
25 words
The method of any of claims 1, 2, or 3 wherein the substrate is coated by screen printing the organic protective layer onto the substrate.
Claim 8
Independent Claim
19 words
The method of any of claims 1, 2, or 3 wherein the organic protective layer is a dielectric polymer.
Claim 9
Independent Claim
32 words
The method of any of claims 1, 2, or 3 further comprising the step of forming a passivation layer on the substrate prior to coating the substrate with the organic protective layer.
Claim 10
Independent Claim
23 words
The method of any of claims 1, 2, or 3 further comprising the step of coating the bond pads with an adhesive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-08 | 2002-09-07 | 2003-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-08 | 2006-09-07 | 2007-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-08 | 2010-09-07 | 2011-03-09 | $7700.00 | Window Closed / Lapsed |