Aeolotropic conductive adhesive film

Abstract

Abstract PURPOSE:To secure continuity between terminals when applying printed wiring boards to each other or a printed wiring board to terminals provided in an electronic circuit part and pressing them or heating them under pressure for attaching them with each other by providing bumps consisting of a resin component having conductivity inside or in the surface of a film body having adhesive function. CONSTITUTION:Conductive bumps 2 in the form of columns, cones, pyramids, etc., are arranged in the flat surface of a film body 1 having adhesive property uniformly and regularly. Polystyrene, polyvinyl chloride, polyvinyl acetate, hot melt binding agent, rubber, or the like is used for the film 1, and a similar material of which surface is made conductive is used in the surface where bumps 2 are to be formed. For making the material conductive, powdery matters of gold, silver, copper, nickel, aluminum, etc., shall be included. Then bumps 2 are applied facing each other, and they are pressurized or heated under pressure, so the bumps are connected with each other. A good connection property can thus be obtained, and a shortcircuit or the like will not occur between the adjuscent bumps 2.

Inventors

• 👤 Toshiyuki Kawaguchi
• 👤 Kazuya Tanaka

Bibliographic Details