US5543585A — Direct chip attachment (DCA) with electrically co…

Claim 1

Independent Claim 103 words

An integrated circuit chip with a matrix of conductive interconnections for direct chip attachment, said matrix comprising: a matrix of thin, electrically conductive metal pads on a major surface of the chip; a layer of dry thermoplastic adhesive forming a chip attachment surface, said layer including: bumps of electrically conductive adhesive deposited on each of the metal pads; and an electrically insulating adhesive filling around the conductive bumps and covering the major surface of the chip betw said een the bumps and extending from the major surface of the chip to said surface for attachment to form a unitary structure around the bumps.

Claim 2

Dependent Claim 103 words

An integrated circuit chip with a matrix of conductive interconnections for direct chip attachment, said matrix comprising: a matrix of thin, electrically conductive metal pads on a major surface of the chip; a layer of dry thermoplastic adhesive forming a chip attachment surface, said layer including: bumps of electrically conductive adhesive deposited on each of the metal pads; and an electrically insulating adhesive filling around the conductive bumps and covering the major surface of the chip betw said een the bumps and extending from the major surface of the chip to said surface for attachment to form a unitary structure around the bumps.

Claim 3

Dependent Claim 32 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive contains a dielectric thermoplastic and a solid insulating filler to control a coefficient of thermal expansion of the adhesive.

Claim 4

Dependent Claim 25 words

An integrated circuit chip as recited in claim 2 wherein said insulating filler is selected from the group consisting of glass particles and ceramic particles.

Claim 5

Dependent Claim 22 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a thermoplastic modified by adding a conductive filler.

Claim 6

Dependent Claim 35 words

An integrated circuit chip as recited in claim 4 wherein said conductive filler includes conductive particles comprising a conductive material selected from the group consisting of Au, Ag, Pd, and oxide free noble alloys thereof.

Claim 7

Dependent Claim 26 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive and said insulating adhesive are selected to have similar properties and chemical compatibility.

Claim 8

Dependent Claim 16 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a polymer.

Claim 9

Dependent Claim 28 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a polymer selected from the group consisting of nylons, polysulfones, polyesters, polyimides, and siloxanes.

Claim 10

Dependent Claim 32 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a copolymer, said copolymer being selected from the group consisting of random copolymers, segmented copolymers, and block copolymers.

Claim 11

Dependent Claim 23 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a blend of at least two different polymeric materials.

Claim 12

Dependent Claim 20 words

An integrated circuit chip as recited in claim 1 wherein the chip surface includes a thin passivation layer of polyimide.

Claim 13

Dependent Claim 36 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a copolymer, said copolymer being selected from the group consisting of an ethylene/vinyl acetate copolymer, a siloxane/aryl-ether copolymer, and a polyurethane copolymer.

Claim 14

Dependent Claim 56 words

An integrated circuit chip as recited in claim 1 wherein said insulating adhesive includes a blend of at least two different polymeric materials, said blend selected from the group consisting of a blend of ethylene-acetate copolymer with polyethylene, a blend of ethylene and vinyl acetate and polyvinyl chloride, and a blend of polyester and polyvinyl chloride.

Claim 15

Dependent Claim 16 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a polymer.

Claim 16

Dependent Claim 28 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a polymer selected from the group consisting of nylons, polysulfones, polyesters, polyimides, and siloxanes.

Claim 17

Dependent Claim 32 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a copolymer, said copolymer being selected from the group consisting of random copolymers, segmented copolymers, and block copolymers.

Claim 18

Dependent Claim 23 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a blend of at least two different polymeric materials.

Claim 19

Dependent Claim 36 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a copolymer, said copolymer being selected from the group consisting of an ethylene/vinyl acetate copolymer, a siloxane/aryl-ether copolymer, and a polyurethane copolymer.

Claim 20

Dependent Claim 56 words

An integrated circuit chip as recited in claim 1 wherein said conductive adhesive includes a blend of at least two different polymeric materials, said blend selected from the group consisting of a blend of ethylene-acetate copolymer with polyethylene, a blend of ethylene and vinyl acetate and polyvinyl chloride, and a blend of polyester and polyvinyl chloride.

Claim 21

Dependent Claim 144 words

An interconnection substrate with a matrix of conductive interconnects for direct attachment to a mirror image matrix of conductive metal contacts on a major surface of another substrate, said interconnection substrate comprising: a matrix of thin, electrically conductive, metal pads on a major surface of the interconnection substrate; and a dry composite single layer of polymerized thermoplastic adhesive forming a surface for attachment to said mirror image matrix of conductive metal pads and said major surface of said another substrate, including: a deposit of electrically conductive adhesive on each of the metal pads for bonding to a metal pad and to a metal contact to form a reliable electrical interconnection, and electrically insulating adhesive around the conductive deposit sufficiently thick for filling the volume between the substrates and around the deposit after bonding the insulating adhesive to the major surface of said another substrate.

Claim 22

Dependent Claim 144 words

An interconnection substrate with a matrix of conductive interconnects for direct attachment to a mirror image matrix of conductive metal contacts on a major surface of another substrate, said interconnection substrate comprising: a matrix of thin, electrically conductive, metal pads on a major surface of the interconnection substrate; and a dry composite single layer of polymerized thermoplastic adhesive forming a surface for attachment to said mirror image matrix of conductive metal pads and said major surface of said another substrate, including: a deposit of electrically conductive adhesive on each of the metal pads for bonding to a metal pad and to a metal contact to form a reliable electrical interconnection, and electrically insulating adhesive around the conductive deposit sufficiently thick for filling the volume between the substrates and around the deposit after bonding the insulating adhesive to the major surface of said another substrate.

Claim 23

Dependent Claim 149 words

An interconnect structure, comprising; a substrate with at least one matrix of thin, electrically conductive, metal interconnect pads on a major surface; at least one integrated circuit chip with a matrix of thin, electrically conductive, metal interconnect pads on a major surface and in which the chip matrix is a mirror image of the substrate matrix and confronts the substrate matrix to define confronting pairs of metal pads; a single layer of dry electrically conductive, thermoplastic adhesive connecting between each respective confronting pair of metal pads and bonded directly to both such pair of metal pads to form electrical interconnections; and a single layer of dry electrically insulating, void free, thermoplastic adhesive which is bonded directly to both the surface of the substrate and surface of the chip and extending around the electrically conductive adhesive to fill a volume between the chip and substrate to encapsulate the electrical interconnections.

Claim 24

Dependent Claim 149 words

An interconnect structure, comprising; a substrate with at least one matrix of thin, electrically conductive, metal interconnect pads on a major surface; at least one integrated circuit chip with a matrix of thin, electrically conductive, metal interconnect pads on a major surface and in which the chip matrix is a mirror image of the substrate matrix and confronts the substrate matrix to define confronting pairs of metal pads; a single layer of dry electrically conductive, thermoplastic adhesive connecting between each respective confronting pair of metal pads and bonded directly to both such pair of metal pads to form electrical interconnections; and a single layer of dry electrically insulating, void free, thermoplastic adhesive which is bonded directly to both the surface of the substrate and surface of the chip and extending around the electrically conductive adhesive to fill a volume between the chip and substrate to encapsulate the electrical interconnections.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1999-08-06	2000-02-05	2000-08-06	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2003-08-06	2004-02-05	2004-08-06	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2007-08-06	2008-02-05	2008-08-06	$7700.00	Window Closed / Lapsed

Direct chip attachment (DCA) with electrically conductive adhesives

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