US5436412A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnect structure having improved metallization
Assignee: International Business Machines Corp
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Filing: 1993-08-03
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Granted: 1995-07-25
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Expires: 2013-08-03
Abstract
Abstract An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.
Inventors
- 👤 Umar M. U. Ahmad
- 👤 Ananda H. Kumar
- 👤 Eric D. Perfecto
- 👤 Chandrika Prasad
- 👤 Sampath Purushothaman
- 👤 Sudipta K. Ray
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:58
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/66; H10W70/67; H10W70/68; H10W70/685; H10W90/00; H10W90/701; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/0183; H05K2201/0195; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2201/096; H05K2201/09654; H05K2201/0979; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0041; H05K3/40; H05K3/4038; H05K3/4076; H05K3/46; H05K3/4602; H05K3/4605; H05K3/4644; H05K3/467; H10W72/00; H10W72/50; H10W72/531; H10W72/536
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
75 words
An electrical interconnect structure comprising: at least one electrically conducting feature on a surface of a substrate; a cap of electrically conducting metallization on the electrically conducting feature wherein said cap only partially covers said electrically conducting feature; and a layer of polymeric material deposited on the surface of the substrate, on the electrically conducting feature not covered by said cap and around said cap, wherein said cap extends beyond the layer of polymeric material.
Claim 2
Dependent Claim
75 words
An electrical interconnect structure comprising: at least one electrically conducting feature on a surface of a substrate; a cap of electrically conducting metallization on the electrically conducting feature wherein said cap only partially covers said electrically conducting feature; and a layer of polymeric material deposited on the surface of the substrate, on the electrically conducting feature not covered by said cap and around said cap, wherein said cap extends beyond the layer of polymeric material.
Claim 3
Dependent Claim
29 words
The interconnect structure of claim 1 further comprising at least a second electrically conducting feature, said second electrically conducting feature being totally enclosed within said layer of polymeric material.
Claim 4
Dependent Claim
20 words
The interconnect structure of claim 1 wherein the electrically conducting feature is a pad for joining to a semiconductor device.
Claim 5
Dependent Claim
26 words
The interconnect structure of claim 1 wherein the electrically conducting feature is selected from the group consisting of an engineering change and a wiring bonding pad.
Claim 6
Dependent Claim
22 words
The interconnect structure of claim 1 wherein said electrically conducting feature is a bonding pad for receiving an I/O pin or pad.
Claim 7
Dependent Claim
30 words
The interconnect structure of claim 1 wherein the cap of metallization is selected from the group consisting of sequential layers of nickel (P) and gold and cobalt (P) and gold.
Claim 8
Dependent Claim
28 words
The interconnect structure of claim 1 wherein the cap of metallization is selected from the group consisting of sequential layers of Cr/Cu/Ti/Mo/Au, Cr/Ni/Au, Cr/Ti/Au, Cr/Co/Au, Cr/Cu/Ni/Au and Cr/Cu/Co/Au.
Claim 9
Dependent Claim
163 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; and further comprising a third layer of polymeric material deposited on the second layer of polymeric material and around the cap of metallization, the cap of metallization extending beyond the third layer of polymeric material.
Claim 10
Dependent Claim
163 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; and further comprising a third layer of polymeric material deposited on the second layer of polymeric material and around the cap of metallization, the cap of metallization extending beyond the third layer of polymeric material.
Claim 11
Dependent Claim
19 words
The interconnect structure of claim 8 further comprising a wiring line enclosed within said first layer of polymeric material.
Claim 12
Dependent Claim
19 words
The interconnect structure of claim 8 further comprising a wiring line enclosed within said second layer of polymeric materials.
Claim 13
Dependent Claim
17 words
The interconnect structure of claim 8 wherein there are a plurality of capture pads and bonding pads.
Claim 14
Dependent Claim
158 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; wherein the bonding pads are principally copper; and wherein the cap of metallization is selected from the group consisting of sequential layers of nickel(P) and gold and cobalt(P) and gold.
Claim 15
Dependent Claim
158 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; wherein the bonding pads are principally copper; and wherein the cap of metallization is selected from the group consisting of sequential layers of nickel(P) and gold and cobalt(P) and gold.
Claim 16
Dependent Claim
158 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; wherein the bonding pads are principally copper; and wherein the cap of metallization is selected from the group consisting of sequential layers of Cr/Cu/Ti/Mo/Au, Cr/Ni/Au, Cr/Ti/Au, Cr/Co/Au, Cr/Cu/Ni/Au and Cr/Cu/Co/Au.
Claim 17
Dependent Claim
158 words
An electrical interconnect structure comprising: at least one electrically conducting capture pad on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pad; at least one electrically conducting bonding pad deposited on the first layer of polymeric material; an electrically conducting stud connecting the capture pad and bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pad, the polymeric material being at the same height as the bonding pad; a cap of electrically conducting metallization on the bonding pad extending beyond the second layer of polymeric material, the cap being of a different composition than the bonding pad; wherein the bonding pads are principally copper; and wherein the cap of metallization is selected from the group consisting of sequential layers of Cr/Cu/Ti/Mo/Au, Cr/Ni/Au, Cr/Ti/Au, Cr/Co/Au, Cr/Cu/Ni/Au and Cr/Cu/Co/Au.
Claim 18
Dependent Claim
31 words
The interconnect structure of claim 11 further comprising at least one pad external to the substrate bonded to a cap of metallization on a bonding pad to form a pad-on-pad connection.
Claim 19
Dependent Claim
28 words
The interconnect structure of claim 14 further comprising at least one I/O pin bonded to a cap of metallization on a bonding pad to form a pin connection.
Claim 20
Dependent Claim
147 words
An electrical interconnect structure comprising: at least two electrically conducting capture pads on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pads; at least two electrically conducting bonding pads deposited on the first layer of polymeric material wherein one bonding pad is larger than the other bonding pad; an electrically conducting stud connecting each of the capture pads to a corresponding bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pads, the polymeric material being at the same height as the bonding pads; a cap of electrically conducting metallization on each of the bonding pads extending beyond the second layer of polymeric material, the caps of metallization being of a different composition than the bonding pads.
Claim 21
Dependent Claim
147 words
An electrical interconnect structure comprising: at least two electrically conducting capture pads on a surface of the substrate; a first layer of polymeric material deposited on the surface of the substrate and the capture pads; at least two electrically conducting bonding pads deposited on the first layer of polymeric material wherein one bonding pad is larger than the other bonding pad; an electrically conducting stud connecting each of the capture pads to a corresponding bonding pad through said first layer of polymeric material; a second layer of polymeric material deposited on the first layer of polymeric material and around the bonding pads, the polymeric material being at the same height as the bonding pads; a cap of electrically conducting metallization on each of the bonding pads extending beyond the second layer of polymeric material, the caps of metallization being of a different composition than the bonding pads.
Claim 22
Dependent Claim
40 words
The interconnect structure of claim 16 further comprising a third layer of polymeric material deposited on the second layer of polymeric material and around the caps of metallization, the caps of metallization extending beyond the third layer of polymeric material.
Claim 23
Dependent Claim
19 words
The interconnect structure of claim 16 further comprising a wiring line enclosed within said first layer of polymeric material.
Claim 24
Dependent Claim
19 words
The interconnect structure of claim 16 further comprising a wiring line enclosed within said second layer of polymeric material.
Claim 25
Dependent Claim
13 words
The interconnect structure of claim 16 wherein the bonding pads are principally copper.
Claim 26
Dependent Claim
28 words
The interconnect structure of claim 16 wherein the caps of metallization are selected from the group consisting of sequential layers of nickel(P) and gold and cobalt(P) and gold.
Claim 27
Dependent Claim
13 words
The interconnect structure of claim 17 wherein the bonding pads are principally copper.
Claim 28
Dependent Claim
27 words
The interconnect structure of claim 22 wherein the caps of metallization are selected from the group consisting of sequential layers of Cr/Cu/Ti/Mo/Au, Cr/Ni/Au, Cr/Ti/Au, Cr/Cu/Ni/Au and Cr/Cu/Co/Au.
Claim 29
Dependent Claim
34 words
The interconnect structure of claim 16 further comprising at least one pad external to the substrate bonded to the smaller of the bonding pads and the cap of metallization to form a pad-on-pad connection.
Claim 30
Dependent Claim
31 words
The interconnect structure of claim 24 further comprising at least one I/O pin bonded to the larger of the bonding pads and the cap of metallization to form a pin connection.
Claim 31
Dependent Claim
22 words
The interconnect structure of claim 16 wherein there are a plurality of capture pads and a plurality of the differently-sized bonding pads.
Claim 32
Dependent Claim
37 words
The interconnect structure of claim 26 further comprising a plurality of pads external to the substrate bonded to the smaller of the bonding pads and the caps of metallization and to form a plurality of pad-on-pad connections.
Claim 33
Dependent Claim
33 words
The interconnect structure of claim 27 further comprising a plurality of I/O pins bonded to the larger of the bonding pads and the caps of metallization to form a plurality of pin connections.
Claim 34
Dependent Claim
42 words
The interconnect structure of claim 28 wherein the plurality of pad-on-pad connections are located around the periphery of the surface of the substrate and the plurality of pin connections are located in a generally central portion of the surface of the substrate.
Claim 35
Dependent Claim
26 words
The interconnect structure of claim 16 wherein there are a plurality of electrically conducting studs connecting at least one capture pad to its corresponding bonding pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-24 | 1999-01-23 | 1999-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-24 | 2003-01-23 | 2003-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-24 | 2007-01-23 | 2007-07-25 | $7700.00 | Window Closed / Lapsed |