Patent EP0528581A1 successfully refreshed from Google Patents.
EP0504411A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device having many lead pins
Assignee: Fujitsu Ltd
•
Filing: 1991-09-19
•
Granted: —
•
Expires: 2011-09-19
Abstract
Abstract A semiconductor device with a high package lead density such as the PGA type, allowing the density of the semiconductor device to increase by forming the leads of the semiconductor device with lead pins (14) for surface mounting arranged by the specified quantity at the outer peripheral area on the back of a package (13) where a chip (11) is mounted and lead members (22 and 41) having the predetermined function at least one of which is arranged at the internal area other than the area of the above lead pins (14).
Inventors
- 👤 Tetsu Fujitsu Limited Tanizawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/851; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K3/3421; H05K3/3426; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/688; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/401; H10W90/701; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10704; H05K3/3447; H10W70/65; H10W70/654; H10W70/655; H10W70/68; H10W70/682; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
85 words
A semiconductor device comprising: a predetermined number of surface mount lead pins (14) provided at a periphery of an underside of a package (13) fitted with a chip (11); and a plurality of surface mount lead members (22), each assigned for a specific use and provided near a center region of the underside of said package (13) beyond the region populated with said lead pins (14), at least two lead pins (22) for the same use being included in said surface mount lead members (22).
Claim 2
Dependent Claim
75 words
A semiconductor device comprising: a predetermined number of surface mount lead pins (14) provided at a periphery of an underside of a package (13) fitted with a chip (11); and at least one lead member (41), each assigned for a specific use, said lead member (41) being longer than said lead pins (14) and provided near a center region on the underside of said package (13) beyond the region populated with said lead pins (14).
Claim 3
Dependent Claim
110 words
A semiconductor device comprising: a predetermined number of surface mount lead pins (14) provided at a periphery of an underside of a package (116) fitted with a predetermined number of chips (11); and a thin film (112) built with layers of patterned films, and interposed between the chip (41) and the lead pins (14), for connecting said chip (111) and said lead pins (14); and at least one lead member (22, 41), each assigned for a specific use, connected to said chip (111) without the interposition of said wiring pattern on said thin film (112) and provided near a center region beyond the region populated with said lead pins (14).
Claim 4
Dependent Claim
96 words
A semiconductor device comprising: a predetermined number of surface mount lead pins (14) provided at a periphery of an underside of a package (116) fitted with a predetermined number of chips (111); and a thin film (112) built with layers of patterned films, said layers being interposed for connecting said chip (111) and said lead pins (14); and at least one lead member (22, 41), each assigned for a specific use, connected to said chip (111) through said interposed thin film (112) and provided near the center beyond the region populated with said lead pins (14).
Claim 5
Dependent Claim
39 words
A semiconductor device as claimed in claim 3 or claim 4, wherein a plurality of chips (111, 111A) are mounted, and a connection between said chips (111, 111A) is accomplished by interposing said thin film (112) between the chips.
Claim 6
Dependent Claim
66 words
A semiconductor device comprising: a predetermined number of lead terminals (162) projecting from all four sides of a package (161) fitted with a chip; and a plurality of surface mount lead members (163), each assigned for a specific use and provided on an underside of said package (161), at least two lead members (163) for the same use being included in said surface mount lead members.
Claim 7
Dependent Claim
63 words
A semiconductor device comprising: a predetermined number of lead terminals (162) projecting from all sides of a package (161) fitted with a chip (111); and at least one member (163), each assigned for a specific use and provided on an underside of said package (161), wherein said lead members (163) project further from the underside of the package (161) than said lead terminals.
Claim 8
Dependent Claim
76 words
A semiconductor device as claimed in any of claims 1 to 7, wherein said lead members (22, 41, 163) comprise a plurality of groups of lead members having a plurality of functions, wherein each of the groups of lead members (22, 41, 163) has one specific function, and consists of a plurality of lead members, and the neighboring lead members within each group are more sparsely populated than the lead members found in any other configuration.
Claim 9
Dependent Claim
29 words
A semiconductor device as claimed in any of claims 1 to 8, wherein said lead members (22, 41, 163) serve as a power supply system in a semiconductor circuit.
Claim 10
Dependent Claim
30 words
A semiconductor device as claimed in any of claims 1 to 9, wherein said lead members (22, 41, 163) are thicker than said lead pins (14) having a column shape.
Claim 11
Dependent Claim
40 words
A semiconductor device as claimed in claim 2 or claim 7, wherein said lead members (22, 41, 163) having a column shape, longer than said lead pins (14), serve as guides pin when mounting the composite onto said board (42).
Claim 12
Dependent Claim
25 words
A semiconductor device as claimed in any of claims 1 to 9, wherein said lead members (22, 41, 163) comprise a block shape (71, 81).
Claim 13
Dependent Claim
25 words
A semiconductor device as claimed in any of claims 1 to 9, wherein said lead members (22, 41, 163) comprise an L-plate plate (91, 171).
Claim 14
Dependent Claim
30 words
A semiconductor device as claimed in any of claims 1 to 13, comprising terminals (51) each assigned for a specific use, and encompassed by said lead members (22, 41, 163).
Claim 15
Dependent Claim
38 words
A semiconductor device as claimed in claim 14, wherein said terminals (51) are longer than said lead pins (14), so as to go through the board and be fixed onto it when mounting the composite onto the board.
Claim 16
Dependent Claim
30 words
A semiconductor device as claimed in claim 15, wherein said terminals (51), longer than said lead pins (14), serve as a guide when mounting the composite onto said board (42).
Claim 17
Dependent Claim
24 words
A semiconductor device as claimed in any of claims 14 to 16, wherein said terminals (51) serve as clock terminals in the semiconductor circuit.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.