US5175609A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure and method for corrosion and stress-resistant interconnecting metallurgy
Assignee: International Business Machines Corp
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Filing: 1991-04-10
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Granted: 1992-12-29
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Expires: 2011-04-10
Abstract
Abstract This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.
Inventors
- 👤 Giulio DiGiacomo
- 👤 Armando S. Cammarano
- 👤 Nunzio DiPaolo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:05
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H10; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/01; H10W72/019; H10W90/00; H10W90/701; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K3/38; H05K3/388; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
35 words
A multilayered interconnecting metallurgical structure for an electronic component comprising, a pad over a substrate, wherein said pad comprises sequentially formed layers of chromium, soluble noble metal, nickel and a noble or relatively noble metal.
Claim 2
Dependent Claim
35 words
A multilayered interconnecting metallurgical structure for an electronic component comprising, a pad over a substrate, wherein said pad comprises sequentially formed layers of chromium, soluble noble metal, nickel and a noble or relatively noble metal.
Claim 3
Dependent Claim
43 words
The structure of claim 1, wherein said layer of chromium is on a base metallurgy and wherein said base metallurgy is selected from the group consisting of aluminum, chromium, cobalt, copper, hafnium, molybdenum nickel, niobium, tantalum, titanium, zirconium, noble metals and mixtures thereof.
Claim 4
Dependent Claim
24 words
The structure of claim 1, wherein said soluble noble metal layer is selected from the group consisting of platinum, palladium, rhodium and mixtures thereof.
Claim 5
Dependent Claim
27 words
The structure of claim 1, wherein said noble or relatively noble metal is selected from the group consisting of gold, platinum, palladium, rhodium, tin and mixtures thereof.
Claim 6
Dependent Claim
12 words
The structure of claim 1, wherein said substrate is a semiconductor chip.
Claim 7
Dependent Claim
12 words
The structure of claim 1, wherein said substrate is a ceramic substrate.
Claim 8
Dependent Claim
25 words
The structure of claim 1, wherein at least a portion of said noble or relatively noble metal layer is in contact with a solder material.
Claim 9
Dependent Claim
14 words
The structure of claim 7, wherein a pin is secured to said solder material.
Claim 10
Dependent Claim
15 words
The structure of claim 7, wherein a solder ball is secured to said solder material.
Claim 11
Dependent Claim
27 words
The structure of claim 1, wherein at least a portion of a wire is secured to at least a portion of said noble or relatively noble metal.
Claim 12
Dependent Claim
24 words
The structure of claim 1, wherein at least a portion of a connector is in contact with at least a portion of said pad.
Claim 13
Dependent Claim
57 words
The structure of claim 1, wherein said chromium layer has a thickness from 0.01 to 0.3 micron, said soluble noble metal layer has a thickness from 0.02 to 5.0 micron, said nickel layer has a thickness from 1.0 to 5.0 micron, and said noble or relatively noble metal layer has a thickness from 0.1 to 20.0 micron.
Claim 14
Dependent Claim
13 words
The structure of claim 1, wherein said substrate has at least one via.
Claim 15
Dependent Claim
30 words
The structure of claim 13, wherein at least a portion of said layer of chromium makes electrical contact with at least a portion of at least one of said via.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-29 | 1996-06-29 | 1996-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-29 | 2000-06-29 | 2000-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-29 | 2004-06-29 | 2004-12-29 | $7700.00 | Window Closed / Lapsed |