US4480261A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Contact structure for a semiconductor substrate on a mounting body
Assignee: Panasonic Holdings Corp
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Filing: 1982-06-18
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Granted: 1984-10-30
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Expires: 2002-06-18
Abstract
Abstract In bonding a semiconductor substrate onto a mounting means, a multiple layer metal electrode is formed on the surface, the multiple layer comprising at least a chromium-nickel alloy layer, nickel layer and a noble metal layer of a noble metal selected from a group consisting of gold, silver or platinum, which is bonded to a solder layer of Pb-Sn-alloy or Ag-Sb-Sn-alloy of the mounting means.
Inventors
- 👤 Hirotsugu Hattori
- 👤 Masahiro Kuwagata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 05:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/20; H10W70/24; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/351; H10W72/352; H10W72/50; H10W72/59; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
108 words
A contact structure for a semiconductor substrate on a mounting body, for a high-power semiconductor device comprising: a semiconductor substrate, a multilayered electrode formed on a surface of said semiconductor substrate, said multilayered electrode comprising a chromium layer formed on said surface, a chromium-nickel alloy layer formed thereon, a nickel layer formed thereon and a noble metal layer of a metal selected from a group consisting of gold, silver, platinum and palladium formed further thereon, a solder layer and a mounting means for holding said semiconductor substrate thereon, said solder layer soldering said multilayered electrode onto said mounting means, thereby bonding said semiconductor substrate onto said mounting means.
Claim 2
Dependent Claim
108 words
A contact structure for a semiconductor substrate on a mounting body, for a high-power semiconductor device comprising: a semiconductor substrate, a multilayered electrode formed on a surface of said semiconductor substrate, said multilayered electrode comprising a chromium layer formed on said surface, a chromium-nickel alloy layer formed thereon, a nickel layer formed thereon and a noble metal layer of a metal selected from a group consisting of gold, silver, platinum and palladium formed further thereon, a solder layer and a mounting means for holding said semiconductor substrate thereon, said solder layer soldering said multilayered electrode onto said mounting means, thereby bonding said semiconductor substrate onto said mounting means.
Claim 3
Dependent Claim
27 words
A semiconductor device in accordance with claim 1, wherein said solder is of a contents that 2-10 wt % is Sn and the rest part is lead.
Claim 4
Dependent Claim
32 words
A semiconductor device in accordance with claim 1, wherein said solder is of a contents that 2-10 wt % is silver, 0.1-20 wt % is antimony and the rest part is tin.
Claim 5
Dependent Claim
32 words
A semiconductor device in accordance with claim 1, wherein said noble metal layer is made of one material selected from the group consisting of gold and platinum, having a thickness of 500Å-3000Å.
Claim 6
Dependent Claim
23 words
A semiconductor device in accordance with claim 1, wherein said noble metal layer is made of silver having a thickness of over 1000Å.
Claim 7
Dependent Claim
23 words
A semiconductor device in accordance with claim 1, wherein said noble metal layer is made of silver having a thickness of over 3000Å.
References Cited (Backward Citations)
US2801375A
Cited
US3266127A
Cited
US3386894A
Cited
US3381256A
Cited
US3562040A
Cited
US3922385A
Cited
JPS531858A
Cited
US4176443A
Cited
JPS54127572A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-10-30 | 1988-04-30 | 1988-10-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-10-30 | 1992-04-30 | 1992-10-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-10-30 | 1996-04-30 | 1996-10-30 | $7700.00 | Window Closed / Lapsed |