Forming method for solder bump

Abstract

Abstract PURPOSE:To obtain a solder bump simply with plating solution of one type by forming a barrier metal film which is difficult to remove after forming solder in an electrode shape before forming the bump. CONSTITUTION:A protective film 2 is covered except an aluminum electrode 1, Cr, Ni-Cr, Mo or the like is deposited to selectively form the barrier film in an electrode shape. Then, a metal film 4 which is hardly etched at a solder by an etchant for Cu, Ni or Au is superposed thereon, and a bump 6' is formed by solder plating with a positive resist mask which is similarly hardly etched by an exfoliating solution. According to this structure, the bump which has good bondability, high quality in mounting such as bonding strength may be simply obtained.

Inventors

• 👤 Kenichi Ogawa
• 👤 健一 小川
• 👤 Masahiko Kawada
• 👤 川田　正彦

Bibliographic Details