Forming method for solder bump

Abstract

Abstract PURPOSE:To obtain the solder bump easily and stably by superposing a film of Cr, Ni-Cr, Mo, etc. and a Cu or gold film on an Al electrode and screen-printing creamy solder. CONSTITUTION:The barrier film in Cr, Ni-Cr, Mo, etc. and the Cu or Au film of excellent wetting capability with solder are laminated on the Al electrode through sputtering, etc. and photoetched. A metallic screen is set on a wafer, and creamy solder is printed. With the bump obtained, there is no problem regarding a shape and strength, the impossibility of the formation of the bump due to the corrosion of solder is not generated, and quality on mounting is high. According to the constitution, the stable bump can be formed through a simple process.

Inventors

• 👤 Masahiko Kawada
• 👤 川田　正彦
• 👤 Kenichi Ogawa
• 👤 健一 小川

Bibliographic Details