US4751349A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Zirconium as an adhesion material in a multi-layer metallic structure
Assignee: International Business Machines Corp
•
Filing: 1986-10-16
•
Granted: 1988-06-14
•
Expires: 2006-10-16
Abstract
Abstract A layer of zirconium can be used as an adhesion layer between a ceramic or polyimide substrate and subsequently applied metallic layers. Following the zirconium layer, copper can be deposited followed by a reaction barrier layer and a wettable surface layer such as gold. This type of structure can be used for pin bracing, chip joining, and/or wire connections.
Inventors
- 👤 Jungihl Kim
- 👤 Walter F. Lange
- 👤 Da-Yuan Shih
- 👤 Sheree H. Wen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:19
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/38; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12736; Y10T428/12743; Y10T428/12771; Y10T428/12806; Y10T428/12861; Y10T428/12903
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
56 words
A multi-layer metallic structure for making circuit interconnections on a substrate comprising: a zirconium layer covering a substrate; an aluminum layer covering said zirconium layer; a reaction barrier layer overlying said aluminum layer; said reaction barrier layer selected from the group consisting of zirconium and titanium; and a layer of gold covering said reaction barrier layer.
Claim 2
Dependent Claim
56 words
A multi-layer metallic structure for making circuit interconnections on a substrate comprising: a zirconium layer covering a substrate; an aluminum layer covering said zirconium layer; a reaction barrier layer overlying said aluminum layer; said reaction barrier layer selected from the group consisting of zirconium and titanium; and a layer of gold covering said reaction barrier layer.
Claim 3
Dependent Claim
56 words
A metallic structure for making circuit interconnections between an integrated circuit and a substrate comprising: a layer of zirconium applied to a substrate; a layer of copper covering said zirconium layer; and a reaction barrier layer overlying said copper layer, said reaction barrier layer selected from the group consisting of zirconium, titanium, chromium, tungsten and molybdenum.
Claim 4
Dependent Claim
56 words
A metallic structure for making circuit interconnections between an integrated circuit and a substrate comprising: a layer of zirconium applied to a substrate; a layer of copper covering said zirconium layer; and a reaction barrier layer overlying said copper layer, said reaction barrier layer selected from the group consisting of zirconium, titanium, chromium, tungsten and molybdenum.
Claim 5
Dependent Claim
20 words
The metallic structure as claimed in claim 2 further comprising a layer of gold applied over said reaction barrier layer.
References Cited (Backward Citations)
US2857663A
Cited
US3379568A
Cited
US3699011A
Cited
US3461524A
Cited
US3621442A
Cited
US3798011A
Cited
US3647585A
Cited
US3634159A
Cited
US4042753A
Cited
US4016050A
Cited
US4153518A
Cited
US4424409A
Cited
US4594473A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-14 | 1991-12-14 | 1992-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-14 | 1995-12-14 | 1996-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-14 | 1999-12-14 | 2000-06-14 | $7700.00 | Window Closed / Lapsed |