Thin-film electronic circuit unit

Claim 1

A thin-film electronic circuit unit carried on a substrate (1) plate of insulation material comprising: a first valve metal layer (2) of a thickness order of magnitude from one-tenth to several tenths of 1 μm located directly on said substrate and partly covering said substrate in first (M 1 ) and second (M 2 ) patterns which interconnect in at least one location and form first (M 1 ) and second (M 2 ) regions of said first valve metal layer (2), said first region thereof defining circuit component elements of said circuit unit and said second region thereof defining connection paths (L) and contact areas (A 1 ,A 2 ) of said circuit unit; metallization of the thickness order of magnitude from one-tenth to several tenths of 1 μm and constituted by a single layer of nickel (50), superposed on said second region (M 2 ) of said valve metal layer; a layer of copper (10) at least 2 μm thick of a metal that does not melt at temperatures to which it may be exposed in soldering operations performed in making connections to said circuit unit, superposed on said metallization (4,5,6;50), said copper layer serving to enhance conductivity of conducting paths and to reinforce said metallization to preserve the integrity of said conducting paths and contact areas and being uncovered in the portion of said second region (M 2 ) serving to provide electrical connection paths; a layer of soft solder (12) covering said copper layer only in the portion of said second region (M 2 ) serving to provide particular electrical contact areas (A 1 ) for facilitating the soldering thereto of components by the reflow solder process, and a gold layer (11) in the portion of said second region (M 2 ) serving to provide particular electrical contact areas (A 2 ) for facilitating the electrical connection of components by chip-and-wire-bonding technique.