US4779338A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting LSI
Assignee: Sharp Corp
•
Filing: 1987-01-22
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Granted: 1988-10-25
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Expires: 2007-01-22
Abstract
Abstract A method of mounting an LSI or IC on a wiring circuit substrate by hot-pressing which comprises the steps of placing the pins of the LSI or IC on a heat sealant printed over the circuit pattern of the substrate, placing a film sheet on the entire or partial surface of the LSI chip or IC chip including the pins of the chip, and carrying out a hot-pressing operation on the film sheet.
Inventors
- 👤 Ichirou Kohara
- 👤 Kazuhito Ozawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K13/00; H05K13/04; H05K13/046; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K1/18; H05K1/181; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1311; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
71 words
A method of a mounting a LSI or an IC on a wiring circuit substrate by hot-pressing which comprises the steps of: placing the pins of said LSI or IC on a heat sealant printed over the circuit pattern of said substrate; placing a film sheet on the entire or partial surface of said LSI or IC chip, including said pins; and carrying out a hot-pressing operation on the film sheet.
Claim 2
Independent Claim
71 words
A method of a mounting a LSI or an IC on a wiring circuit substrate by hot-pressing which comprises the steps of: placing the pins of said LSI or IC on a heat sealant printed over the circuit pattern of said substrate; placing a film sheet on the entire or partial surface of said LSI or IC chip, including said pins; and carrying out a hot-pressing operation on the film sheet.
Claim 3
Dependent Claim
29 words
The method of mounting a LSI or an IC on a wiring circuit substrate by hot-pressing according to claim 1, wherein the heat sealant is an anisotropic conductive paste.
References Cited (Backward Citations)
US4381602A
Cited
US4631820A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-10-25 | 1992-04-25 | 1992-10-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-10-25 | 1996-04-25 | 1996-10-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-10-25 | 2000-04-25 | 2000-10-25 | $7700.00 | Window Closed / Lapsed |