Method of making a semiconductor memory device

Claim 1

A method of manufacturing a memory cell having a MISFET, comprising the steps of: forming a first insulator film on a front surface of a semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said MISFET, wherein a part of said first insulator film under said floating gate electrode is left as a gate insulator film of said MISFET forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of said floating gate electrode and control gate electrode as viewed in a channel direction of said MISFET; ion-implanting an n-type impurity into a region of the semiconductor substrate surface for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends to a position under said floating gate electrode, wherein a film thickness of said gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said gate insulator film; after said ion-implanting step, removing said third insulator film; after said removing step, oxidizing the semiconductor substrate surface, to form an oxide film on said region for forming said n-type semiconductor region, wherein said oxidizing step is performed so as to thicken the film thickness of a portion of said gate insulator film, corresponding to ends of said floating gate electrode, rather than the film thickness of another portion of said gate insulator film; after said oxidizing step, forming an insulating film so as to cover the front surface of the semiconductor substrate by deposition; and forming side wall spacers on side surfaces of said control and floating gate electrodes, by etching said insulating film, in self-alignment with said control and floating gate electrodes.

Claim 2

A method of manufacturing a memory cell having a MISFET, comprising the steps of: forming a first insulator film on a front surface of a semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said MISFET, wherein a part of said first insulator film under said floating gate electrode is left as a gate insulator film of said MISFET forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of said floating gate electrode and control gate electrode as viewed in a channel direction of said MISFET; ion-implanting an n-type impurity into a region of the semiconductor substrate surface for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends to a position under said floating gate electrode, wherein a film thickness of said gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said gate insulator film; after said ion-implanting step, removing said third insulator film; after said removing step, oxidizing the semiconductor substrate surface, to form an oxide film on said region for forming said n-type semiconductor region, wherein said oxidizing step is performed so as to thicken the film thickness of a portion of said gate insulator film, corresponding to ends of said floating gate electrode, rather than the film thickness of another portion of said gate insulator film; after said oxidizing step, forming an insulating film so as to cover the front surface of the semiconductor substrate by deposition; and forming side wall spacers on side surfaces of said control and floating gate electrodes, by etching said insulating film, in self-alignment with said control and floating gate electrodes.

Claim 7

A method of manufacturing a memory cell of an electrically erasable programmable read only memory, said memory cell constituted by a single MISFET, comprising the steps of: forming a first insulator film on a front surface of a semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said single MISFET, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; ion-implanting an n-type impurity into a region of the semiconductor substrate surface for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step, oxidizing the semiconductor substrate surface and said third insulator film, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than a film thickness of another portion of said first gate insulator film; after said oxidizing step, forming an insulating film so as to cover the front surface of the semiconductor substrate by deposition; and forming side wall spacers on side surface of said control and floating gate electrodes, by etching said insulating film, in self-alignment with said control and floating gate electrodes.

Claim 8

A method of manufacturing a memory cell of an electrically erasable programmable read only memory, said memory cell constituted by a single MISFET, comprising the steps of: forming a first insulator film on a front surface of a semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said single MISFET, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; ion-implanting an n-type impurity into a region of the semiconductor substrate surface for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step, oxidizing the semiconductor substrate surface and said third insulator film, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than a film thickness of another portion of said first gate insulator film; after said oxidizing step, forming an insulating film so as to cover the front surface of the semiconductor substrate by deposition; and forming side wall spacers on side surface of said control and floating gate electrodes, by etching said insulating film, in self-alignment with said control and floating gate electrodes.

Claim 13

A method of manufacturing an electrically erasable programmable read only memory including memory cells and peripheral circuits, each memory cell constituted by a single MISFET, said peripheral circuits comprised of MISFETs, comprising the steps of: providing a semiconductor substrate having a memory cell forming area and a peripheral circuit forming area; forming a first insulator film on a front surface of said memory cell forming area of said semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said single MISFET of the memory cell, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET of said memory cell forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; forming a second gate insulator film on a front surface of said peripheral circuit forming area of said semiconductor substrate; forming a gate electrode on said second gate insulator film; ion-implanting an n-type impurity into a region of said memory cell forming area for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step for forming said n-type semiconductor region, removing said third insulator film; after said removing step, oxidizing the semiconductor substrate surface, to form an oxide film on said region for forming said n-type semiconductor region, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than a film thickness of another portion of said first gate insulator film; ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming first regions in said semiconductor substrate in self-alignment with said gate electrode; after said oxidizing step, forming an insulating film so as to cover said control and floating gate electrodes and said gate electrode by deposition; forming side wall spacers on side surfaces of said control and floating gate electrodes and on side surfaces of said gate electrode, by etching said insulating film in self-alignment with said control and floating gate electrodes and in self-alignment with said gate electrode; and ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming second regions in said semiconductor substrate, in self-alignment with said gate electrode and side wall spacers on said gate electrode, wherein said first and second regions serve as source and drain regions of said MISFETs of said peripheral circuits.

Claim 14

A method of manufacturing an electrically erasable programmable read only memory including memory cells and peripheral circuits, each memory cell constituted by a single MISFET, said peripheral circuits comprised of MISFETs, comprising the steps of: providing a semiconductor substrate having a memory cell forming area and a peripheral circuit forming area; forming a first insulator film on a front surface of said memory cell forming area of said semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of said single MISFET of the memory cell, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET of said memory cell forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; forming a second gate insulator film on a front surface of said peripheral circuit forming area of said semiconductor substrate; forming a gate electrode on said second gate insulator film; ion-implanting an n-type impurity into a region of said memory cell forming area for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step for forming said n-type semiconductor region, removing said third insulator film; after said removing step, oxidizing the semiconductor substrate surface, to form an oxide film on said region for forming said n-type semiconductor region, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than a film thickness of another portion of said first gate insulator film; ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming first regions in said semiconductor substrate in self-alignment with said gate electrode; after said oxidizing step, forming an insulating film so as to cover said control and floating gate electrodes and said gate electrode by deposition; forming side wall spacers on side surfaces of said control and floating gate electrodes and on side surfaces of said gate electrode, by etching said insulating film in self-alignment with said control and floating gate electrodes and in self-alignment with said gate electrode; and ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming second regions in said semiconductor substrate, in self-alignment with said gate electrode and side wall spacers on said gate electrode, wherein said first and second regions serve as source and drain regions of said MISFETs of said peripheral circuits.

Claim 19

A method of manufacturing an electrically erasable programmable read only memory including memory cells and peripheral circuits, each memory cell constituted by a single MISFET, said peripheral circuits comprised of MISFETs, comprising the steps of: providing a semiconductor substrate having a memory cell forming area and a peripheral circuit forming area; forming a first insulator film on a front surface of said memory cell forming area of said semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of the single MISFET of the memory cell, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET of said memory cell forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; forming a second gate insulator film on a front surface of said peripheral circuit forming area of said semiconductor substrate; forming a gate electrode on said second gate insulator film; ion-implanting an n-type impurity into a region of said memory cell forming area for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step for forming said n-type semiconductor region, oxidizing the semiconductor substrate surface and said third insulator film, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than the film thickness of another portion of said first gate insulator film; ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming first regions in said semiconductor substrate in self-alignment with said gate electrode; after said oxidizing step, forming an insulating film so as to cover said control and floating gate electrodes and said gate electrode by deposition; forming side wall spacers on side surfaces of said control and floating gate electrodes and on side surfaces of said gate electrode, by etching said insulating film in self-alignment with said control and floating gate electrodes and in self-alignment with said gate electrode; and ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming second regions in said semiconductor substrate, in self-alignment with said gate electrode and side wall spacers on the gate electrode, wherein said first and second regions serve as source and drain regions of said MISFETs of said peripheral circuits.

Claim 20

A method of manufacturing an electrically erasable programmable read only memory including memory cells and peripheral circuits, each memory cell constituted by a single MISFET, said peripheral circuits comprised of MISFETs, comprising the steps of: providing a semiconductor substrate having a memory cell forming area and a peripheral circuit forming area; forming a first insulator film on a front surface of said memory cell forming area of said semiconductor substrate; forming a first conductor film on said first insulator film; forming a second insulator film on said first conductor film; forming a second conductor film on said second insulator film; patterning said second conductor film, said second insulator film, and said first conductor film, whereby to form a floating gate electrode and a control gate electrode over said floating gate electrode of the single MISFET of the memory cell, wherein a part of said first insulator film under said floating gate electrode is left as a first gate insulator film of said single MISFET of said memory cell forming a third insulator film on parts of the semiconductor substrate surface corresponding to both ends of each of the floating gate electrode and the control gate electrode as viewed in a channel direction of said single MISFET; forming a second gate insulator film on a front surface of said peripheral circuit forming area of said semiconductor substrate; forming a gate electrode on said second gate insulator film; ion-implanting an n-type impurity into a region of said memory cell forming area for forming an n-type semiconductor region in said semiconductor substrate, through said third insulator film, in self-alignment with said control and floating gate electrodes, wherein said n-type semiconductor region extends at a position under said floating gate electrode, wherein a film thickness of said first gate insulator film is such that electrons stored in said floating gate electrode are emitted into said n-type semiconductor region by tunneling through said first gate insulator film; after said ion-implanting step for forming said n-type semiconductor region, oxidizing the semiconductor substrate surface and said third insulator film, wherein said oxidizing step is performed so as to thicken a film thickness of a portion of said first gate insulator film, corresponding to ends of said floating gate electrode, rather than the film thickness of another portion of said first gate insulator film; ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming first regions in said semiconductor substrate in self-alignment with said gate electrode; after said oxidizing step, forming an insulating film so as to cover said control and floating gate electrodes and said gate electrode by deposition; forming side wall spacers on side surfaces of said control and floating gate electrodes and on side surfaces of said gate electrode, by etching said insulating film in self-alignment with said control and floating gate electrodes and in self-alignment with said gate electrode; and ion-implanting an n-type impurity into regions of said peripheral circuit forming area for forming second regions in said semiconductor substrate, in self-alignment with said gate electrode and side wall spacers on the gate electrode, wherein said first and second regions serve as source and drain regions of said MISFETs of said peripheral circuits.