US5144412A — Process for manufacturing plastic pin grid arrays…

Claim 1

Independent Claim 146 words

A pin grid array package for housing an integrated circuit, comprising: an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; a plurality of holes in said metal circuit pattern; a plurality of terminal pins each having a pin head disposed at one end, a shoulder and a groove between said shoulder and said pin head, said pinhead being slightly greater in diameter than said holes in said metal circuit pattern whereby said interconnect tape is mechanically locked into said groove; a terminal pin inserted through each of said holes whereby said terminal pin extends outward from both said first and second opposing surfaces of said interconnect tape; and a polymer resin encapsulating said pin head and said groove and at least a portion of said interconnect tape and said shoulder.

Claim 2

Dependent Claim 146 words

A pin grid array package for housing an integrated circuit, comprising: an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; a plurality of holes in said metal circuit pattern; a plurality of terminal pins each having a pin head disposed at one end, a shoulder and a groove between said shoulder and said pin head, said pinhead being slightly greater in diameter than said holes in said metal circuit pattern whereby said interconnect tape is mechanically locked into said groove; a terminal pin inserted through each of said holes whereby said terminal pin extends outward from both said first and second opposing surfaces of said interconnect tape; and a polymer resin encapsulating said pin head and said groove and at least a portion of said interconnect tape and said shoulder.

Claim 3

Dependent Claim 84 words

The pin grid array package of claim 1 including said interconnect tape having said second surface bonded to a flexible nonmetallic surface; said nonmetallic surface having a plurality of holes therein overlying said plurality of holes in said interconnect tape; and at least on aperture in said flexible nonmetallic substrate arranged such that a first portion of said leads extends to at least said aperture such that the ends of said first portion are adapted to be in contact with an integrated circuit chip.

Claim 4

Dependent Claim 36 words

The pin grid array package of claim 2 wherein said holes in said nonmetallic substrate are slightly smaller than said holes in said metal circuit pattern to decrease the chance for crimping the metal circuit pattern.

Claim 5

Dependent Claim 21 words

The pin grid array package of claim 2 wherein said plurality of terminal pins are solder bonded to said interconnect tape.

Claim 6

Dependent Claim 24 words

The pin grid array package of claim 4 wherein said polymer resin is selected from the group consisting of thermoset and thermoplastic polymer resins.

Claim 7

Dependent Claim 28 words

The package of claim 5 wherein said polymer resin is a thermoset polymer resin selected from the group consisting of epoxies, 1-2 polybutadianes, poly(bismaleimides), silicone and polyimide polymers.

Claim 8

Dependent Claim 31 words

The package of claim 5 wherein said polymer resin is a thermoplastic polymer resin selected from the group consisting of polyphenylsulfide, polysulfone, polyethersulfone, polyarylether, polyamide, polyether ketone, polyetherimide and fluoro polymers.

Claim 9

Dependent Claim 35 words

The package of claim 5 further including: said package having a recess extending partially therethrough: an integrated circuit device disposed in said recess and electrically connected to said leads; and means for sealing said recess.

Claim 10

Dependent Claim 74 words

The package of claim 8 further including: a centrally disposed integrated circuit device connect recess extending through the package; at least one aperture in said flexible nonmetallic substrate, said aperture arranged such that a first portion of said leads extend over said aperture in cantilever fashion; an integrated circuit device disposed in said recess; said first portion of said leads being electrically connected with said integrated circuit device; and means for sealing said recess.

Claim 11

Dependent Claim 21 words

The package of claim 9 further including an integrated circuit device electrically connected to said leads and encapsulated within said polymer.

Claim 12

Dependent Claim 122 words

A plastic pin grid array package for housing an electronic device, comprising: an interconnect tape having first and second opposing surfaces, said first surface defining a metal interconnect pattern containing a plurality of holes and a plurality of leads; a plurality of pins having a pin head and an insertion end, said pin head end soldered to said interconnect tape; a heat sink comprised of a collar and a base component, said base component defining a cavity and containing an interior surface for supporting said integrated circuit and an exterior surface; a means for electrically connecting said pin heads to said interconnect tape; and a means for affixing said heat sink to said second surface of said interconnect tape opposite said leads.

Claim 13

Dependent Claim 122 words

A plastic pin grid array package for housing an electronic device, comprising: an interconnect tape having first and second opposing surfaces, said first surface defining a metal interconnect pattern containing a plurality of holes and a plurality of leads; a plurality of pins having a pin head and an insertion end, said pin head end soldered to said interconnect tape; a heat sink comprised of a collar and a base component, said base component defining a cavity and containing an interior surface for supporting said integrated circuit and an exterior surface; a means for electrically connecting said pin heads to said interconnect tape; and a means for affixing said heat sink to said second surface of said interconnect tape opposite said leads.

Claim 14

Dependent Claim 28 words

The pin grid array package of claim 11 wherein the portion of said pin which contacts the solder is coated with a second metal to improve solder wetting.

Claim 15

Dependent Claim 23 words

The pin grid array package of claim 11 wherein said means for affixing said heat sink to said interconnect tape is adhesive bonding.

Claim 16

Dependent Claim 14 words

The pin grid array package of claim 13 wherein said adhesive is an epoxy.

Claim 17

Dependent Claim 21 words

The pin grid array package of claim 11 wherein said second side of said interconnect tape includes a metal seal ring.

Claim 18

Dependent Claim 30 words

The pin grid array package of claim 15 wherein said means for affixing said heat sink to said interconnect tape comprises soldering said heat sink collar to said seal ring.

Claim 19

Dependent Claim 21 words

The pin grid array package of claim 11 wherein said pin contains a collar defined by a first and second shoulder.

Claim 20

Dependent Claim 23 words

The pin grid array package of claim 17 wherein said first side of said interconnect tape is in contact with said first shoulder.

Claim 21

Dependent Claim 23 words

The pin grid array package of claim 17 wherein said second side of said interconnect tape is in contact with said first shoulder.

Claim 22

Dependent Claim 143 words

A pin grid array package for housing an integrated circuit, comprising: an interconnect tap having first and second opposing surfaces, said first surface defining a metal circuit pattern, said metal circuit pattern defining a plurality of holes and a plurality of leads; a plurality of pins defined by a pin head end and an insertion end, said pins soldered to said first surface of said interconnect tape. a heat sink comprised of a collar component and a base component, said base component defining a cavity for receiving an integrated circuit and comprised of an interior surface to support said integrated circuit and an exterior surface, said heat sink affixed to said second surface of said interconnect tape; and a polymer resin encapsulating said pin head end and solder and at least a portion of said interconnect tape, said heat sink and said pins.

Claim 23

Dependent Claim 143 words

A pin grid array package for housing an integrated circuit, comprising: an interconnect tap having first and second opposing surfaces, said first surface defining a metal circuit pattern, said metal circuit pattern defining a plurality of holes and a plurality of leads; a plurality of pins defined by a pin head end and an insertion end, said pins soldered to said first surface of said interconnect tape. a heat sink comprised of a collar component and a base component, said base component defining a cavity for receiving an integrated circuit and comprised of an interior surface to support said integrated circuit and an exterior surface, said heat sink affixed to said second surface of said interconnect tape; and a polymer resin encapsulating said pin head end and solder and at least a portion of said interconnect tape, said heat sink and said pins.

Claim 24

Dependent Claim 23 words

The polymer resin of claim 20 wherein said resin is either thermosetting or thermoplastic with a molding temperature greater than about 220° c.

Claim 25

Dependent Claim 22 words

The polymer resin of claim 21 wherein said resin has a molding temperature of between about 240° C. and about 400° C.

Claim 26

Dependent Claim 40 words

The plastic pin grid array package of claim 22 wherein said integrated circuit is attached to said interior base of said heat sink and electrically connected to said leads and a compliant polymer coats said interior base and integrated circuit.

Claim 27

Dependent Claim 15 words

The, plastic pin grid array package of claim 23 wherein said compliant polymer is silicone.

Claim 28

Dependent Claim 30 words

The plastic pin grid array package of claim 24 wherein said polymer resin encapsulates said interconnect tape, said heatsink except exterior base and said pins except for said insertion end.

Claim 29

Dependent Claim 42 words

The plastic pin grid array package of claim 22 wherein said polymer resin encapsulates said interconnect tape except for said leads, said heat sink except for said cavity and said interior and exterior bases, and said pins except for said insertion end.

Claim 30

Dependent Claim 28 words

The plastic pin grid array package of claim 26 wherein a lid component seals said cavity after said integrated circuit is attached and electrically connected to said leads.

Claim 31

Dependent Claim 28 words

The plastic pin grid array package of claim 27 wherein said exterior base of said heat sink is flush with the exterior surface of said molded polymer resin.

Claim 32

Dependent Claim 27 words

The plastic pin grid array package of claim 28 wherein said exterior surface of said heat sink extends slightly beyond the surface of said molded polymer resin.

Claim 33

Dependent Claim 37 words

The pin grid array package of claim 20 wherein said pins further include a collar component defined by first and second shoulders and said first surface of said interconnect tape is in contact with said first shoulder.

Claim 34

Dependent Claim 37 words

The pin grid array package of claim 20, wherein said pins further include a collar component defined by first and second shoulders and said second surface of said interconnect tape is in contact with said first shoulder.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1995-09-01	1996-03-02	1996-09-01	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1999-09-01	2000-03-02	2000-09-01	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2003-09-01	2004-03-02	2004-09-01	$7700.00	Window Closed / Lapsed

Process for manufacturing plastic pin grid arrays and the product produced thereby

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