Terminal positioning method and construction

Claim 2

A construction for temporarily positioning a plurality of .[.socket.]. terminals on an electrical circuit board in a predetermined configuration prior to solder connection thereto, comprising a sheet of relatively thin, flexible, electrically insulative, resinous plastic material having a plurality of holes extending therethrough, said holes arranged in a planar configuration about said sheet to correspond with said predetermined positioning of said .[.socket.]. terminals in said circuit board, a plurality of .[.socket.]. terminals each having a pin adapted for insertion into an opening in said board at their lower end and an enlarged generally cylindrical head at their upper end, said enlarged head having upper and lower .Iadd.head .Iaddend.sections defined by an inwardly extending .[.perimetal.]. .Iadd.perimetrical .Iaddend.groove intermediate the height thereof and of a lateral extent less .Iadd.than that of .Iaddend.said upper and lower sections, said holes of a .[.perimetal.]. .Iadd.perimetrical .Iaddend.extent less than .Iadd.that of .Iaddend.said head sections but generally corresponding to or slightly greater than that of said groove, said terminals adapted for positioning upon said sheet with the heads thereof extending through said holes and the sheet extending into said grooves and wherein the leading edge of at least one of said upper and lower head sections is provided with a longitudinally oriented, sheet contacting surface to enable said terminals to be push positioned into said grooves.

Claim 3

The invention of claim 1 wherein the geometric configuration of said holes corresponds with that of said grooves.

Claim 4

The invention of claim 2, said holes being circular.

Claim 5

The invention of claim 1, said head section sheet contacting surface being a curcumferential .[.chamfer.]. .Iadd.chamfered surface. .Iaddend.

Claim 6

The invention of claim 4, said chamfered surface provided on the lower portion of said lower head section.

Claim 7

The invention of claim 4, said chamfered surface provided on the upper portion of said upper head section.

Claim 8

The invention of claim 4, said chamfered surface provided on both the lower portion of said lower head section and the upper portion of said upper head section.

Claim 9

The invention of claim 1, said head section sheet contacting surface being provided on the leading edges of both said upper and lower head sections.

Claim 10

The invention of claim 1, said groove being of substantially V-shaped configuration.

Claim 11

The invention of claim 1, said sheet including downwardly extending edge flanges having terminal edge surfaces adapted to contact the upper surface of said circuit board so as to hold portions of said socket terminal pins above said board during soldering of said pins thereto.

Claim 12

The invention of claim 1, said sheet being substantially clear Mylar.

Claim 15

The method of claim 12 wherein said .[.socket.]. .Iadd.terminals .Iaddend.are inserted into said holes head first.

Claim 16

The method of claim 12 wherein said .[.sockets.]. .Iadd.terminals .Iaddend.are inserted into said holes head last. .Iadd.15. The invention of claim 1 wherein the thickness of said sheet is less than the height of said groove. .Iaddend. .Iadd.16. The invention of claim 1 wherein said sheet is Kapton. .Iaddend. .Iadd.17. The method of claim 12 and further including the steps of, thereafter positioning said terminals while held by said sheet on said circuit board, and thereafter group soldering said terminals to said board while said sheet holds said terminals. .Iaddend. .Iadd.18. The method of claim 17 and further including the step of removing said sheet from said terminals after the terminals are soldered to said board by progressively pealing said sheet beginning at one end thereof, from said terminals. .Iaddend. .Iadd.19. A construction for temporarily positioning a plurality of terminals on an electrical circuit board in a predetermined configuration prior to solder connection thereto, comprising a sheet of relatively thin flexible material having a plurality of holes extending therethrough, said holes arranged in a planar configuration about said sheet to correspond with said predetermined positioning of said terminals in said circuit board, a plurality of terminals each having a pin adapted for insertion in said board at their lower end and an enlarged head at their upper end, said enlarged head having upper and lower head sections defined by an inwardly extending perimetrical groove intermediate the height thereof and of a lateral extent less than that of said upper and lower sections, said holes of a perimetrical extent less than that of said head sections but generally corresponding to or slightly greater than that of said groove, said terminals adapted for positioning upon said sheet with the heads thereof extending through said holes and the sheet extending into said grooves. .Iaddend. .Iadd.20. The method of group positioning a plurality of terminals on an electrical circuit board in a predetermined configuration prior to solder connections thereto, comprising forming a plurality of holes in a sheet of relatively thin flexible material in an array at least including said predetermined configuration, each of said terminals having a head of enlarged configuration and having an inwardly extending perimetrical groove intermediate the height thereof so as to define upper and lower sections of said head, said holes of a perimetrical extent less than that of said head sections but generally corresponding to or slightly smaller than that of said intermediate groove, supporting one surface of said sheet and thereafter inserting the heads of a plurality of terminals from the opposite surface of said sheet into said holes in said predetermined configuration to establish contact with peripheral edge portions of said sheet defining said holes so as to slightly deform said edge portions in the direction of head insertion until said sheet edge portions snap into said groove. .Iaddend.