EP0232837A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Plastic molded chip carrier package and method of fabricating the same
Assignee: Panasonic Electric Works Co Ltd
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Filing: 1987-02-03
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Granted: —
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Expires: 2007-02-03
Abstract
Abstract A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member 10 molded of a plastic material to which are integrally embeded a plurality of I/O pins 20 and a conductor member 30 for interconnection between the terminals of the chip 5 and the corresponding I/O pins 20 to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs 12 which project in the same direction of the I/O pins 20 for abutment against a printed circuit board 1 for mounting the package in a spaced relation thereto with the I/O pins 20 plugged into metallized through holes 2 provided in the board 1. A method of fabricating the plastic chip carrier package is also disclosed to comprise the steps of placing a plurality of I/O pins 20 into corresponding vertical slots 52 formed in a molding die 51 with the top portion of the I/O pins 20 projecting above the molding die surface; supporting a conductor member 30 on the I/O pins 20 with the distal top ends of the I/O pins 20 extending into correspondingly through holes 33 formed in the conductor member 30, the conductor member 30 including a plurality of conductor lines 31 for electrical interconnection between the individual I/O pins 20 and the terminals of the chip 5 ; and filling a molten plastic material at least between the conductor member 30 and the molding die surface and solidifying the same so as to form thereat a plastic carrier member 10 to which the conductor member 30 is integrally embeded together with the top portions of the I/O pins 20.
Inventors
- 👤 Atsuomi Hirata
- 👤 Hirokuni Mamiya
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 12:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/131; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/20; H05K2201/2036; H10W70/65; H10W70/654; H10W70/655; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
80 words
A plastic molded chip carrier package comprising: a carrier member being made of a plastic material for mounting an integrated circuit chip at its central portion; a plurality of I/O pins having its top end portion integrally embeded into said carrier member and protruding outwardly from the carrier member; and a conductor member integrally embeded to said carrier member and having a plurality of conductor lines for electrical interconnection between the terminals of said chip and the corresponding I/O pins.
Claim 2
Dependent Claim
80 words
A plastic molded chip carrier package comprising: a carrier member being made of a plastic material for mounting an integrated circuit chip at its central portion; a plurality of I/O pins having its top end portion integrally embeded into said carrier member and protruding outwardly from the carrier member; and a conductor member integrally embeded to said carrier member and having a plurality of conductor lines for electrical interconnection between the terminals of said chip and the corresponding I/O pins.
Claim 3
Dependent Claim
69 words
A plastic molded chip carrier package as set forth in claim 1, wherein said carrier member is integrally formed with at least one pair of positioning studs which project from the carrier member for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.
Claim 4
Dependent Claim
65 words
A plastic molded chip carrier package as set forth in claim 2, further including a heat sink member having greater thermal conductivity than said carrier member and shaped to have a chip mounting surface and an opposed heat radiation surface, said heat sink member being integrally embeded centrally in the carrier member with its heat radiation surface exposed on the surface of the carrier member.
Claim 5
Dependent Claim
70 words
A plastic molded chip carrier package as set forth in claim 3, wherein said heat sink member is a flat shape member with its side wall being inclined inwardly from the chip mounting surface adjacent the conductor member to the heat radiation surface, said heat sink member being provided with an external flange extending sidewardly from the periphery of the heat radiation surface and being engaged in the carrier member.
Claim 6
Dependent Claim
31 words
A plastic molded chip carrier package as set forth in claim 3, wherein said heat sink member has its heat radiating surface projecting beyond the general surface of the carrier member.
Claim 7
Dependent Claim
117 words
A plastic molded chip carrier package as set forth in claim 2, wherein said conductor line has a through hole into which the corresponding I/O pin extends with its distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the conductor member in such a way as to form in the surface thereof a plurality of soldering pits which are in registration with the individual through hole locations and in which the distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with soldering material for permanent connection between the I/O pins and the corresponding conductor lines.
Claim 8
Dependent Claim
27 words
A plastic molded chip carrier package as set forth in claim 2, wherein the chip is integrally encapsulated together with the conductor member within said carrier member.
Claim 9
Dependent Claim
325 words
A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at its central portion, said carrier member being made of a plastic material into a flat configuration having a top surface and a bottom surface and having a center recess in which the chip is mounted; a plurality of I/O pins each having its top portion integrally embeded into the carrier member so as to protrude from the bottom surface thereof; a metallized layer being integrally embeded to the carrier member together with said I/O pins and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate for electrical interconnection of said I/O pins with corresponding terminals of the chip, said conductor lines having inner lead ends arranged on the inner peripherial edge portion around said center opening of the metallized layer; a heat sink member integrally embeded in the center portion of said carrier member with its bottom surface exposed to the bottom of the carrier member and with its top surface defining the bottom surface of said center recess for mounting thereon said chip; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized thmrough holes formed therein for positive positioning of said package on that support member; and said metallized layer being embeded within the carrier member in such a manner as to project into the center recess the inner peripheral edge portion including said inner lead ends of the conductor lines as well as the support that inner peripheral edge portion on the periphery of the top surface of said heat sink member for connection with the chip on the heat sink member.
Claim 10
Dependent Claim
325 words
A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at its central portion, said carrier member being made of a plastic material into a flat configuration having a top surface and a bottom surface and having a center recess in which the chip is mounted; a plurality of I/O pins each having its top portion integrally embeded into the carrier member so as to protrude from the bottom surface thereof; a metallized layer being integrally embeded to the carrier member together with said I/O pins and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate for electrical interconnection of said I/O pins with corresponding terminals of the chip, said conductor lines having inner lead ends arranged on the inner peripherial edge portion around said center opening of the metallized layer; a heat sink member integrally embeded in the center portion of said carrier member with its bottom surface exposed to the bottom of the carrier member and with its top surface defining the bottom surface of said center recess for mounting thereon said chip; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized thmrough holes formed therein for positive positioning of said package on that support member; and said metallized layer being embeded within the carrier member in such a manner as to project into the center recess the inner peripheral edge portion including said inner lead ends of the conductor lines as well as the support that inner peripheral edge portion on the periphery of the top surface of said heat sink member for connection with the chip on the heat sink member.
Claim 11
Dependent Claim
134 words
A plastic molded chip carrier package as set forth in claim 8, wherein said metallized layer has a plurality of through holes each of which corresponds to each of the conductor lines and into each of which the corresponding I/O pins extends with its distal top end projecting above the conductor lines; and wherein said carrier member is molded to accommodate therein the metallized layer in such as a way as to form in the surface thereof a plurality of soldering pits which are in registration with the individual through hole locations and in which the distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with a soldering material for permanent connection between the I/O pins and the corresponding conductor lines.
Claim 12
Dependent Claim
345 words
A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at its central portion, said carrier member being made of a plastic material into a flat configuration having a top surface and a bottom surface and having a center recess in which the chip is mounted; a plurality of I/O pins each having its top end portion integrally embeded into said carrier member to protrude from the bottom surface thereof; a plurality of metallized layers which are integrally embeded within the carrier members in stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between the terminals of the chip and the corresponding I/O pins, the conductor lines of each metallized layer having their inner lead ends arranged on the inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in the upper metallized layer than in the lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the chip at the staggered inner lead ends; a heat sink integrally embeded to the center portion of said carrier member with its bottom surface exposed to the bottom of the carrier member and with its top surface defining the bottom surface of said center recess for mounting thereon said chip; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.
Claim 13
Dependent Claim
345 words
A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at its central portion, said carrier member being made of a plastic material into a flat configuration having a top surface and a bottom surface and having a center recess in which the chip is mounted; a plurality of I/O pins each having its top end portion integrally embeded into said carrier member to protrude from the bottom surface thereof; a plurality of metallized layers which are integrally embeded within the carrier members in stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between the terminals of the chip and the corresponding I/O pins, the conductor lines of each metallized layer having their inner lead ends arranged on the inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in the upper metallized layer than in the lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the chip at the staggered inner lead ends; a heat sink integrally embeded to the center portion of said carrier member with its bottom surface exposed to the bottom of the carrier member and with its top surface defining the bottom surface of said center recess for mounting thereon said chip; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.
Claim 14
Dependent Claim
180 words
A molded plastic chip carrier package as set forth in claim 10, wherein each of said metallized layer has a plurality of through holes into which the corresponding I/O pins extend respectively with their distal top ends projecting above the conductor lines, the upper metallized layer having clearance holes which are in registration with the through holes in the lower metallized layer and into which extend the distal top ends of the I/O pins which are to be electrically connected to the conductor lines of the lower metallized layer; said carrier member being formed in its top surface at the through hole locations with soldering pits in which the distal top ends of the I/O pins are exposed together with the adjacent portions of the corresponding conductor lines while the conductor lines located around the clearance holes in the upper metallized layer being sealed behind the surrounding wall of the soldering pits; and said soldering pits being filled with a soldering material for providing permanent interconnection between the I/O pins and the corresponding conductor lines in the respective metallized layers.
Claim 15
Independent Claim
162 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material, said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in a molding die with the top portion of each I/O pin projecting above the molding surface of the molding die; supporting a conductor member on said I/O pins in spaced relation from the molding surface with the distal top ends of the I/O pins extending into corresponding through holes formed in the conductor member, said conductor member including a plurality of conductor lines for electrical interconnection between the individual I/O pins and the terminals of the chip to be mounted; and filling a molten plastic material at least between the conductor member and the molding surface and solidifying the same so as to form thereat a plastic carrier member to which the conductor member is integrally embeded together with the top portions of the I/O pins.
Claim 16
Independent Claim
162 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material, said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in a molding die with the top portion of each I/O pin projecting above the molding surface of the molding die; supporting a conductor member on said I/O pins in spaced relation from the molding surface with the distal top ends of the I/O pins extending into corresponding through holes formed in the conductor member, said conductor member including a plurality of conductor lines for electrical interconnection between the individual I/O pins and the terminals of the chip to be mounted; and filling a molten plastic material at least between the conductor member and the molding surface and solidifying the same so as to form thereat a plastic carrier member to which the conductor member is integrally embeded together with the top portions of the I/O pins.
Claim 17
Dependent Claim
93 words
A method of fabricating a plastic molded chip carrier package as set forth in claim 12, wherein said molding die is formed with at least one pair of top-open holes into which the plastic material is fed so as to form thereat correspondingly shaped positioning studs which integrally protrude from the bottom surface of the carrier member for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.
Claim 18
Independent Claim
358 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material by the utilization of separable upper and lower molding dice; said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in the lower molding die with the top portion of each I/O pin projecting above the molding surface of the lower molding die; supporting a metallized layer having a center opening on said I/O pins in a spaced relation from the molding surfaces of the upper and lower dice with the distal top ends of the I/O pins extending into corresponding through holes formed in the metallized layer, said metallized layer being composed of a substrate and a plurality of conductor lines formed thereon for electrical interconnection between the individual I/O pins and the terminals of the chip to be mounted, and said conductor lines having their inner lead ends arranged on the inner peripheral edge portion around said central opening; holding the inner peripheral edge portion of the metallized layer including said inner lead ends of the conductor lines between a heat sink member disposed on the lower molding die and a core projecting on the molding surface of the upper molding die, said core having a flat contacting end surface which is held in abutting engagement with the flat top surface of the heat sink member and being formed around the flat contacting end surface with a stepped groove in which the inner peripheral edge portion of the metallized layer extend so as to be held between the core and the heat sink member; and filling into the space formed between the upper and lower molding dice with a molten plastic material and solidifying the same so as to form thereat a plastic carrier member in which the metallized layer and the heat sink member are integrally embeded together with the top portions of the I/O pins, leaving in the carrier member a center recess by the removal of the core which recess having its bottom defined by the top surface of the heat sink member for mounting thereon said chip.
Claim 19
Independent Claim
358 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material by the utilization of separable upper and lower molding dice; said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in the lower molding die with the top portion of each I/O pin projecting above the molding surface of the lower molding die; supporting a metallized layer having a center opening on said I/O pins in a spaced relation from the molding surfaces of the upper and lower dice with the distal top ends of the I/O pins extending into corresponding through holes formed in the metallized layer, said metallized layer being composed of a substrate and a plurality of conductor lines formed thereon for electrical interconnection between the individual I/O pins and the terminals of the chip to be mounted, and said conductor lines having their inner lead ends arranged on the inner peripheral edge portion around said central opening; holding the inner peripheral edge portion of the metallized layer including said inner lead ends of the conductor lines between a heat sink member disposed on the lower molding die and a core projecting on the molding surface of the upper molding die, said core having a flat contacting end surface which is held in abutting engagement with the flat top surface of the heat sink member and being formed around the flat contacting end surface with a stepped groove in which the inner peripheral edge portion of the metallized layer extend so as to be held between the core and the heat sink member; and filling into the space formed between the upper and lower molding dice with a molten plastic material and solidifying the same so as to form thereat a plastic carrier member in which the metallized layer and the heat sink member are integrally embeded together with the top portions of the I/O pins, leaving in the carrier member a center recess by the removal of the core which recess having its bottom defined by the top surface of the heat sink member for mounting thereon said chip.
Claim 20
Dependent Claim
92 words
A method of fabricating a plastic molded chip carrier package set forth in claim 14, wherein said lower molding die is formed with at least one pair of top-open slots into which the plastic material is fed so as to form thereat correspondingly shaped positioning studs which protrude from the bottom surface of the carrier member for abutment against a support member on which the package is adapted to be mounted with its I/O pins plugged into metallized through holes formed therein for positive positioning of the package on the support member.
Claim 21
Dependent Claim
117 words
A method of fabricating a plastic molded chip carrier package as set forth in claim 14, wherein said upper molding die is formed at the individual through hole locations with posts which extend to the distal top ends of the individual I/O pins to cover the same together with the adjacent conductor line portions at the time of molding the carrier member so as to form thereat soldering pits after the removal of the posts in which soldering pits are exposed respectively the distal top ends of the I/O pins and the adjacent conductor line portions, said soldering pits being filled with a soldering material for permanent connection of the I/O pins and the corresponding conductor lines.
Claim 22
Dependent Claim
63 words
A method of fabricating a plastic molded chip carrier package as set forth in claim 14, wherein the lower molding die is formed in its molding surface with a concavity in which the bottom end of the heat sink member is seated so that the bottom surface of the heat sink projects on the general bottom surface of the resulting molded carrier member.
Claim 23
Independent Claim
197 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material by utilization of separable upper and lower molding dice, said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in the lower molding die with the top portion of each I/O pins projecting above the molding surface of the lower molding die; supporting on said I/O pins a metallized layer mounting thereon said chip in spaced relation from the molding surfaces of the upper and lower molding dice, said metallized layer being composed of a plurality of conductor lines formed on a substrate, each of said conductor lines being connected at its one end to each of the I/O pins and at the other end with each of the terminals of the chip mounted centrally of the metallized layer; and filling into the space formed between the upper and lower molding dice with a molten plastic material and solidifying the same so as to form thereat a plastic carrier member in which the metallized layer and the chip mounted thereon are integrally encapsulated together with the top portions of the I/O pins.
Claim 24
Independent Claim
197 words
A method of fabricating a plastic molded chip carrier package for an integrated circuit chip having terminals with a plastic material by utilization of separable upper and lower molding dice, said method comprising: placing a plurality of I/O pins into corresponding vertical slots formed in the lower molding die with the top portion of each I/O pins projecting above the molding surface of the lower molding die; supporting on said I/O pins a metallized layer mounting thereon said chip in spaced relation from the molding surfaces of the upper and lower molding dice, said metallized layer being composed of a plurality of conductor lines formed on a substrate, each of said conductor lines being connected at its one end to each of the I/O pins and at the other end with each of the terminals of the chip mounted centrally of the metallized layer; and filling into the space formed between the upper and lower molding dice with a molten plastic material and solidifying the same so as to form thereat a plastic carrier member in which the metallized layer and the chip mounted thereon are integrally encapsulated together with the top portions of the I/O pins.
References Cited (Backward Citations)
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