US4729010A
Expired / Lapsed
US
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Integrated circuit package with low-thermal expansion lead pieces
Assignee: Hitachi Ltd
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Filing: 1986-07-30
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Granted: 1988-03-01
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Expires: 2006-07-30
Abstract
Abstract An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55 DEG C.
Inventors
- 👤 Masatoshi Tsuchiya
- 👤 Satoru Ogihara
- 👤 Hiromi Kagohara
- 👤 Kanji Otsuka
- 👤 Tomoji Oishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:36
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/40; H10W70/456; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W76/60; H10W90/00; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/734; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
149 words
In an integrated circuit package in which at least one semiconductor element mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a ceramic material having a coefficient of thermal expansion of from 35 to 40×10 -7 /°C. and a high thermal conductivity, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50×10 -7 /°C., said sealing glass has a coefficient of thermal expansion of from 30 to 55×10 -7 /°C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40×10 -7 /°C.
Claim 2
Dependent Claim
149 words
In an integrated circuit package in which at least one semiconductor element mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a ceramic material having a coefficient of thermal expansion of from 35 to 40×10 -7 /°C. and a high thermal conductivity, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50×10 -7 /°C., said sealing glass has a coefficient of thermal expansion of from 30 to 55×10 -7 /°C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40×10 -7 /°C.
Claim 3
Dependent Claim
34 words
An integrated circuit package according to claim 1, wherein said lead pieces are composed of an iron alloy which contains nickel and cobalt and has a martensite transformation temperature of lower than -55° C.
Claim 4
Dependent Claim
32 words
An integrated circuit package according to claim 1, wherein said sealing glass is a low-melting glass that permits the sealing operation to be effected at a temperature of lower than 470° C.
Claim 5
Dependent Claim
18 words
An integrated circuit package according to claim 1, wherein said lead pieces are composed of an Ni-Co-Fe alloy.
Claim 6
Dependent Claim
20 words
An integrated circuit package according to claim 1, wherein said substrate is composed of a sintered product of silicon carbide.
Claim 7
Dependent Claim
28 words
An integrated circuit package according to claim 1, wherein said cap is composed of any one of mullite ceramic, silicon carbide ceramic, zircon ceramic, or silicon nitride ceramic.
Claim 8
Dependent Claim
25 words
An integrated circuit package according to claim 1, wherein said glass is composed of any one of β-eucryptite, lead titanate-type glass or lead borate-type glass.
Claim 9
Dependent Claim
37 words
An integrated circuit package according to claim 2, wherein said iron alloy has a composition consisting of 29 to 31% by weight of nickel, 12.5 to 15.5% by weight of cobalt, and the remainder being substantially iron.
Claim 10
Dependent Claim
48 words
An integrated circuit package according to claim 5, wherein said sintered product has a composition which contains at least either one of beryllium or a beryllium compound in an amount of 0.05 to 5% by weight on the basis of beryllium, and the remainder being substantially silicon carbide.
Claim 11
Dependent Claim
27 words
An integrated circuit package according to claim 8, wherein said iron alloy is annealed at a temperature ranging from 100° to 600° C. to remove the stress.
Claim 12
Dependent Claim
135 words
In an integrated circuit package in which at least one semiconductor element is mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a sintered product of aluminum nitride, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50×10 -7 /°C., said sealing glass has a coefficient of thermal expansion of from 30 to 55×10 -7 /°C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40×10 -7 /°C.
Claim 13
Dependent Claim
135 words
In an integrated circuit package in which at least one semiconductor element is mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect said at least one semiconductor element and said ends of said lead pieces are accommodated in a cell that is air-tightly defined by said substrate, a cap and a sealing glass, the improvement wherein said insulating substrate is composed of a sintered product of aluminum nitride, said cap is composed of a ceramic material having a coefficient of thermal expansion of from 20 to 50×10 -7 /°C., said sealing glass has a coefficient of thermal expansion of from 30 to 55×10 -7 /°C., and said lead pieces are composed of an alloy having a coefficient of thermal expansion of smaller than 40×10 -7 /°C.
Claim 14
Dependent Claim
34 words
An integrated circuit package according to claim 11, wherein said lead pieces are composed of an iron alloy which contains nickel and cobalt and has a martensite transformation temperature of lower than -55° C.
Claim 15
Dependent Claim
32 words
An integrated circuit package according to claim 11, wherein said sealing glass is a low-melting glass that permits the sealing operation to be effected at a temperature of lower than 470° C.
Claim 16
Dependent Claim
18 words
An integrated circuit package according to claim 11, wherein said lead pieces are composed of an Ni-Co-Fe alloy.
Claim 17
Dependent Claim
28 words
An integrated circuit package according to claim 11, wherein said cap is composed of any one of mullite ceramic, silicon carbide ceramic, zircon ceramic or silicon nitride ceramic.
Claim 18
Dependent Claim
25 words
An integrated circuit package according to claim 11, wherein said glass is composed of any one of β-eucryptite, lead titanate-type glass or lead borate-type glass.
Claim 19
Dependent Claim
37 words
An integrated circuit package according to claim 12, wherein said iron alloy has a composition consisting of 29 to 31% by weight of nickel, 12.5 to 15.5% by weight of cobalt, and the remainder being substantially iron.
Claim 20
Dependent Claim
27 words
An integrated circuit package according to claim 17, wherein said iron alloy is annealed at a temperature ranging from 100° C. to 600° C. to remove stress.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-01 | 1991-08-31 | 1992-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-01 | 1995-08-31 | 1996-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-01 | 1999-08-31 | 2000-03-01 | $7700.00 | Window Closed / Lapsed |