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US7045887B2
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Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
Assignee: Stats Chippac Pte Ltd
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Filing: 2003-10-08
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Granted: 2006-05-16
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Expires: 2023-10-08
Abstract
Abstract A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:37
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W90/401; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5438; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
67 words
A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the substrate comprises a dielectric layer and a patterned metal layer wherein the second package is inverted, wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-up configuration.
Claim 2
Dependent Claim
67 words
A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the substrate comprises a dielectric layer and a patterned metal layer wherein the second package is inverted, wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-up configuration.
Claim 3
Dependent Claim
19 words
The multi-package module of claim 1 wherein the inverted second package is a wire bonded land grid array package.
Claim 4
Dependent Claim
26 words
The multi-package module of claim 2 wherein the die and wire bonds in the inverted second package are at least partially encapsulated with a molding material.
Claim 5
Dependent Claim
24 words
The multi-package module of claim 2 wherein the die and wire bonds in the inverted second package are fully encapsulated with a molding material.
Claim 6
Dependent Claim
16 words
The multi-package module of claim 2 wherein the second package substrate is a single-metal layer substrate.
Claim 7
Dependent Claim
19 words
The multi-package module of claim 2 wherein the second package substrate is a bump chip carrier type package substrate.
Claim 8
Dependent Claim
17 words
The multi-package module of claim 1 wherein the flip chip package is provided with an electrical shield.
Claim 9
Dependent Claim
18 words
The multi-package module of claim 7 wherein the electrical shield is configured to serve as a heat spreader.
Claim 10
Dependent Claim
34 words
The multi-package module of claim 7 wherein the flip chip package includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.
Claim 11
Dependent Claim
15 words
The multi-package module of claim 1 wherein the flip chip package includes an RF die.
Claim 12
Dependent Claim
16 words
The multi-package module of claim 1 wherein the first package is provided with an electrical shield.
Claim 13
Dependent Claim
16 words
The multi-package module of claim 1 wherein the inverted second package is a stacked die package.
Claim 14
Dependent Claim
19 words
The multi-package module of claim 12 wherein adjacent stacked die in the stacked die package are separated by spacers.
Claim 15
Dependent Claim
31 words
The multi-package module of claim 1 wherein the second package is stacked over the first package, and wherein the flip-chip die on the first package is provided with an electrical shield.
Claim 16
Dependent Claim
16 words
The multi-package module of claim 1 wherein the first package substrate includes an embedded ground plane.
Claim 17
Dependent Claim
17 words
The multi-package module of claim 15 , the ground plane being configured to serve for heat dissipation.
Claim 18
Dependent Claim
18 words
The multi-package module of claim 15 , the ground plane being configured to serve as an electrical shield.
Claim 19
Dependent Claim
22 words
The multi-package module of claim 1 wherein at least one of the first and the inverted second package is a stacked-die package.
Claim 20
Dependent Claim
15 words
The multi-package module of claim 1 wherein the inverted second package is a stacked-die package.
Claim 21
Dependent Claim
12 words
The multi-package module of claim 1 , further comprising a heat shield.
Claim 22
Dependent Claim
28 words
A mobile communications device comprising a multi-package module according to claim 1 , wherein the multi-package module is electrically connected to underlying circuitry in the mobile communications device.
Claim 23
Dependent Claim
24 words
A computer comprising a multi-package module according to claim 1 , wherein the multi-package module is electrically connected to underlying circuitry in the computer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2009-05-15 | 2009-11-14 | 2010-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-05-15 | 2013-11-14 | 2014-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-05-15 | 2017-11-14 | 2018-05-16 | $7700.00 | Window Closed / Lapsed |