US6933603B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-substrate layer semiconductor packages and method for making same
Assignee: Teledyne Defense Electronics LLC
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Filing: 2002-07-11
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Granted: 2005-08-23
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Expires: 2022-07-11
Abstract
Abstract A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the second substrate. The device also includes a circuit chip connected to the transmission line.
Inventors
- 👤 Tong Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:24
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/281; H10W42/287; H10W40/00; H10W40/10; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/731; H10W90/737
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
122 words
A device, comprising: a first substrate having a transmission line formed on a lower surface thereof; a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; and a circuit chip having an upper surface and a lower surface, wherein at least one terminal on the upper surface is connected to the transmission line, and where the lower surface includes a conductive signal ground portion; and a ground plate connected to a bottom surface of the second substrate and directly connected to the lower surface of the circuit chip such that the ground plate provides a signal ground for the circuit chip.
Claim 2
Independent Claim
122 words
A device, comprising: a first substrate having a transmission line formed on a lower surface thereof; a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; and a circuit chip having an upper surface and a lower surface, wherein at least one terminal on the upper surface is connected to the transmission line, and where the lower surface includes a conductive signal ground portion; and a ground plate connected to a bottom surface of the second substrate and directly connected to the lower surface of the circuit chip such that the ground plate provides a signal ground for the circuit chip.
Claim 3
Dependent Claim
20 words
The device of claim 1 , wherein the circuit chip is connected to the transmission line via a conductive bump.
Claim 4
Dependent Claim
16 words
The device of claim 1 , further comprising an isolation device located in the first substrate.
Claim 5
Dependent Claim
16 words
The device of claim 3 , wherein the isolation device includes a microwave frequency absorbing material.
Claim 6
Dependent Claim
15 words
The device of claim 1 , wherein the circuit chip includes a microwave circuit chip.
Claim 7
Dependent Claim
26 words
The microwave device of claim 5 , wherein at least one of the first substrate and the second substrate is constructed of a microwave laminate material.
Claim 8
Dependent Claim
15 words
The microwave device of claim 5 , wherein the ground plate is constructed of metal.
Claim 9
Dependent Claim
23 words
The microwave device of claim 5 , wherein the ground plate is connected to the circuit chip and the second substrate with epoxy.
Claim 10
Dependent Claim
26 words
The microwave device of claim 5 , wherein the conductive bump is constructed of material selected from the group consisting of gold and a conductive polymer.
Claim 11
Dependent Claim
27 words
The microwave device of claim 5 , wherein the transmission line is constructed of a material selected from the group consisting of gold, silver, aluminum and copper.
Claim 12
Dependent Claim
18 words
The microwave device of claim 5 , wherein the microwave circuit chip includes a monolithic microwave integrated circuit.
Claim 13
Dependent Claim
18 words
The microwave device of claim 5 , further comprising a microwave isolation device located in the first substrate.
Claim 14
Dependent Claim
33 words
The device of claim 5 , wherein the transmission line, the second substrate and the ground plate form a transmission medium having the same transmission field orientation as that of the circuit chip.
Claim 15
Independent Claim
130 words
A method of fabricating a device, comprising: forming a transmission line on a bottom surface of a first substrate; attaching a second substrate to the bottom surface of the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; attaching an upper surface of a circuit chip to the transmission line; and attaching a ground plate to a bottom surface of the second substrate and to a conductive signal ground portion of a lower surface of the circuit ship such that the ground plate is in direct contact with the conductive signal ground portion of the lower surface of the circuit chip such that the ground plate provides a signal ground for the circuit chip.
Claim 16
Independent Claim
130 words
A method of fabricating a device, comprising: forming a transmission line on a bottom surface of a first substrate; attaching a second substrate to the bottom surface of the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; attaching an upper surface of a circuit chip to the transmission line; and attaching a ground plate to a bottom surface of the second substrate and to a conductive signal ground portion of a lower surface of the circuit ship such that the ground plate is in direct contact with the conductive signal ground portion of the lower surface of the circuit chip such that the ground plate provides a signal ground for the circuit chip.
Claim 17
Dependent Claim
42 words
The method of claim 14 , wherein attaching a second substrate to the bottom surface of the first substrate and the transmission line includes attaching the second substrate to the bottom surface of the first substrate and the transmission line using epoxy.
Claim 18
Dependent Claim
32 words
The method of claim 14 , wherein attaching a circuit chip to the transmission line includes attaching a conductive bump to the circuit chip and attaching the bump to the transmission line.
Claim 19
Dependent Claim
25 words
The method of claim 14 , wherein attaching the bump to the transmission line includes attaching the bump to the transmission line using thermal compression.
Claim 20
Dependent Claim
27 words
The method of claim 14 , wherein attaching a ground plate to the second substrate includes attaching a ground plate to the second substrate using conductive epoxy.
Claim 21
Independent Claim
128 words
A device, comprising: a first substrate having a transmission line formed on a lower surface thereof; a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; and a circuit chip having an upper surface and a lower surface, wherein at least one terminal on the upper surface is connected to the transmission line, and where the lower surface includes a conductive signal ground portion; a ground plate connected to a bottom surface of the second substrate; an electrically conductive shim directly connected between the lower surface of the circuit chip and the ground plate such that the ground plate provides a signal ground for the circuit chip.
Claim 22
Independent Claim
128 words
A device, comprising: a first substrate having a transmission line formed on a lower surface thereof; a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; and a circuit chip having an upper surface and a lower surface, wherein at least one terminal on the upper surface is connected to the transmission line, and where the lower surface includes a conductive signal ground portion; a ground plate connected to a bottom surface of the second substrate; an electrically conductive shim directly connected between the lower surface of the circuit chip and the ground plate such that the ground plate provides a signal ground for the circuit chip.
Claim 23
Dependent Claim
15 words
The device of claim 19 , wherein the circuit chip includes a microwave circuit chip.
Claim 24
Dependent Claim
34 words
The device of claim 20 , wherein the transmission line, the second substrate and the ground plate form a transmission medium having the same transmission field orientation as that of the microwave circuit chip.
Claim 25
Dependent Claim
16 words
The device of claim 19 , further comprising an isolation device located in the first substrate.
Claim 26
Dependent Claim
16 words
The device of claim 22 , wherein the isolation device includes a microwave frequency absorbing material.
Claim 27
Independent Claim
135 words
A method of fabricating a device, comprising: forming a transmission line on a bottom surface of a first substrate; attaching a second substrate to the bottom surface of the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; attaching an electrically conductive shim to a lower surface of a circuit chip, wherein the lower surface includes a conductive signal ground portion; attaching conductive bumps to an upper surface of the circuit chip; attaching the upper surface of a circuit chip to the transmission line through the conductive bumps; attaching a ground plate to a bottom surface of the second substrate and to the electrically conductive shim such that the ground plate provides a signal ground for the circuit chip.
Claim 28
Independent Claim
135 words
A method of fabricating a device, comprising: forming a transmission line on a bottom surface of a first substrate; attaching a second substrate to the bottom surface of the first substrate and the transmission line such that the transmission line is substantially between the first substrate and a top surface of the second substrate; attaching an electrically conductive shim to a lower surface of a circuit chip, wherein the lower surface includes a conductive signal ground portion; attaching conductive bumps to an upper surface of the circuit chip; attaching the upper surface of a circuit chip to the transmission line through the conductive bumps; attaching a ground plate to a bottom surface of the second substrate and to the electrically conductive shim such that the ground plate provides a signal ground for the circuit chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-08-22 | 2009-02-21 | 2009-08-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-08-22 | 2013-02-21 | 2013-08-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-08-22 | 2017-02-21 | 2017-08-23 | $7700.00 | Window Closed / Lapsed |