US6566748B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip-chip semiconductor device having an improved reliability
Assignee: Socionext Inc
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Filing: 2000-07-13
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Granted: 2003-05-20
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Expires: 2020-07-13
Abstract
Abstract A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exceeding about 100 W/(m·K).
Inventors
- 👤 Nobutaka Shimizu
- 👤 Kazuyuki Imamura
- 👤 Atsushi Kikuchi
- 👤 Masaharu Minamizawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:46
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W76/10; H10W76/17; H10W76/12; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
100 words
A semiconductor device, comprising: a package substrate; a semiconductor chip mounted on a top surface of said package substrate in a face-down state; a cap member provided on said top surface of said package substrate so as to cover said semiconductor chip, said cap member making a contact with said semiconductor chip and said top surface of said package substrate; and electrodes provided on a bottom surface of said package substrate, wherein said cap member, having a thermal conductivity not smaller than about 100 W/(m·K) and a Young modulus not exceeding about 20 GPa, is formed of a carbon/metal composite.
Claim 2
Dependent Claim
100 words
A semiconductor device, comprising: a package substrate; a semiconductor chip mounted on a top surface of said package substrate in a face-down state; a cap member provided on said top surface of said package substrate so as to cover said semiconductor chip, said cap member making a contact with said semiconductor chip and said top surface of said package substrate; and electrodes provided on a bottom surface of said package substrate, wherein said cap member, having a thermal conductivity not smaller than about 100 W/(m·K) and a Young modulus not exceeding about 20 GPa, is formed of a carbon/metal composite.
Claim 3
Dependent Claim
21 words
A semiconductor device as claimed in claim 1 , wherein the cap member has a Young modulus of about 12 GPa.
Claim 4
Dependent Claim
21 words
A semiconductor device as claimed in claim 1 , wherein said cap member has a thermal conductivity of about 200 W/(m·K).
Claim 5
Dependent Claim
25 words
A semiconductor device as claimed in claim 1 , wherein said cap member has a thermal expansion coefficient less than about 3×10 −5 /° C.
Claim 6
Dependent Claim
23 words
A semiconductor device as claimed in claim 4 , wherein said cap member is formed of a porous carbon material infiltrated with Al.
Claim 7
Dependent Claim
25 words
A semiconductor device as claimed in claim 4 , wherein said cap member is formed of a porous carbon material infiltrated with an Al—Si alloy.
Claim 8
Dependent Claim
48 words
A semiconductor device as claimed in claim 1 , wherein said cap member is an anisotropic material having a smaller Young modulus in a lateral direction parallel to a principal surface of said package substrate than a Young modulus in a thickness direction perpendicular to said lateral direction.
Claim 9
Dependent Claim
27 words
A semiconductor device as claimed in claim 7 , wherein said cap member includes pores extending generally in said thickness direction, and conductive plugs filling said pores.
Claim 10
Dependent Claim
26 words
A semiconductor device as claimed in claim 8 , wherein said cap member further includes a metal film covering an outer side of said cap member.
Claim 11
Dependent Claim
25 words
A semiconductor device as claimed in claim 1 , wherein said package substrate has a Young modulus between about 70 GPa and about 75 GPa.
Claim 12
Dependent Claim
18 words
A semiconductor device as claimed in claim 1 , wherein said package substrate is formed of a glass-epoxy.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-05-19 | 2006-11-18 | 2007-05-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-05-19 | 2010-11-18 | 2011-05-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-05-19 | 2014-11-18 | 2015-05-20 | $7700.00 | Window Closed / Lapsed |