Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies

Claim 2

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising: a bottom ground plane provided below said microwave substrate; a top ground plane located above said microwave substrate substantially parallel to said bottom ground plane; and a two-dimensional periodically arrayed matrix of conducting posts orthogonally arranged between said top and bottom ground planes for isolating microwave circuit components located between said posts on the microwave substrate, each end of the conducting posts forming said matrix being grounded to one of said top and bottom ground planes wherein each microwave circuit component to be isolated is spaced apart from and surrounded by a number of said conducting posts of said matrix of conducting posts to isolate the microwave circuit component.

Claim 3

A structure according to claim 1, further comprising: a housing metal base supporting the microstrip substrate; and a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover.

Claim 4

A structure according to claim 2, wherein the microstrip substrate is formed of Teflon™ fiberglass.

Claim 5

A structure according to claim 2, wherein said matrix of conducting posts are fixedly attached at one end to said housing cover, said housing cover having a metallized underside coupling with said plurality of conducting posts to form said top ground plane; wherein said plurality of conducting posts extend substantially vertically toward the microstrip substrate at their other ends; and capacitive air gaps formed between the other ends of the plurality of conducting posts and said microstrip substrate for tuning said plurality of conductive posts.

Claim 6

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: a plurality of holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix of conducting posts, said plurality of conducting posts being press fit at their one ends into said plurality of holes and extending toward said housing cover at their other ends; a conductive layer arranged against the other ends of said conducting posts, and a compression layer located against said conductive layer on one side and against said housing cover on its other side for keeping said conductive layer in contact with the other ends of said plurality of conductive posts thereby forming a ground connection at each end of said plurality of conductive posts.

Claim 7

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: a plurality of holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix of conducting posts, said plurality of conducting posts being press fit at their one ends into said plurality of holes and extending toward said housing cover at their other ends; a conductive layer arranged against the other ends of said conducting posts, and a compression layer located against said conductive layer on one side and against said housing cover on its other side for keeping said conductive layer in contact with the other ends of said plurality of conductive posts thereby forming a ground connection at each end of said plurality of conductive posts.

Claim 8

A structure according to claim 5, wherein the spaced apart microwave circuit components and transmission media are arranged on the microstrip substrate around said plurality of holes.

Claim 9

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said housing has a metal underside, the structure further comprising: a plurality of cover holes formed in said housing cover corresponding to the two dimensional matrix of conducting posts, said cover holes having metal side walls connected to said metal underside; a plurality of base holes formed through the microstrip substrate and housing metal base and aligned substantially vertically with said plurality of cover holes, said plurality of conducting posts being pressed into an interference fit with the side walls of the cover holes and base holes to provide grounding along the conducting posts circumference at both ends.

Claim 10

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said housing has a metal underside, the structure further comprising: a plurality of cover holes formed in said housing cover corresponding to the two dimensional matrix of conducting posts, said cover holes having metal side walls connected to said metal underside; a plurality of base holes formed through the microstrip substrate and housing metal base and aligned substantially vertically with said plurality of cover holes, said plurality of conducting posts being pressed into an interference fit with the side walls of the cover holes and base holes to provide grounding along the conducting posts circumference at both ends.

Claim 11

A structure according to claim 7, wherein said plurality of conducting posts are formed of roll posts.

Claim 12

A structure according to claim 7, wherein said plurality of cover and base holes are provided with tapered edges near said hole openings for aiding the alignment and insertion of the plurality of conducting posts.

Claim 13

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: said structure further comprising: a plurality of base holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix of conducting posts, said conducting posts being coupled at one end into said base holes and extending toward said housing cover at their other ends; a dielectric film arranged against the other ends of said plurality of conducting posts; a conductive layer stacked atop of said dielectric film; a compression layer arranged between said conductive layer and housing cover for holding the conductive layer and dielectric film against the other ends of said plurality of conducting posts, said conductive layer, dielectric film and conducting posts forming a series coupled inductance and capacitance for series resonance tuning of said conducting posts.

Claim 14

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: said structure further comprising: a plurality of base holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix of conducting posts, said conducting posts being coupled at one end into said base holes and extending toward said housing cover at their other ends; a dielectric film arranged against the other ends of said plurality of conducting posts; a conductive layer stacked atop of said dielectric film; a compression layer arranged between said conductive layer and housing cover for holding the conductive layer and dielectric film against the other ends of said plurality of conducting posts, said conductive layer, dielectric film and conducting posts forming a series coupled inductance and capacitance for series resonance tuning of said conducting posts.

Claim 15

A structure according to claim 10, wherein said dielectric film has a predetermined thickness and dielectric constant for accurate tuning of the plurality of conducting posts.

Claim 16

A structure according to claim 11, wherein said dielectric film is a dielectric film sheet bonded to said conductive layer.

Claim 17

A structure according to claim 11, wherein said dielectric film is deposited onto the other ends of said plurality of conducting posts.

Claim 18

A structure according to claim 11, wherein said plurality of conducting posts have a predetermined length and diameter selected for resonance near a desired frequency band for the structure.

Claim 19

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said housing cover has a metal underside, the structure further comprising: a plurality of cover holes formed in said housing cover corresponding to the two dimensional matrix of conducting posts and having cover hole diameters greater than those of said conducting posts, said plurality of cover holes having metallized side walls connected to said metal underside; a plurality of base holes formed in the microstrip substrate and housing metal base, said plurality of base holes being vertically aligned with said cover holes, the plurality of conductive posts forming an interference fit at one end with said plurality of base holes; and coaxial capacitive air gaps formed between the other ends of said plurality of conductive posts and said cover hole side walls for series tuning portions of the plurality of conductive posts within the air cavity.

Claim 20

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said housing cover has a metal underside, the structure further comprising: a plurality of cover holes formed in said housing cover corresponding to the two dimensional matrix of conducting posts and having cover hole diameters greater than those of said conducting posts, said plurality of cover holes having metallized side walls connected to said metal underside; a plurality of base holes formed in the microstrip substrate and housing metal base, said plurality of base holes being vertically aligned with said cover holes, the plurality of conductive posts forming an interference fit at one end with said plurality of base holes; and coaxial capacitive air gaps formed between the other ends of said plurality of conductive posts and said cover hole side walls for series tuning portions of the plurality of conductive posts within the air cavity.

Claim 21

A structure according to claim 15, wherein a selected number of said plurality of conducting posts are custom tuned via adjustment to the conducting posts length and its associated cover hole diameter.

Claim 22

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said plurality of conducting posts are fixedly attached at one end to said housing cover, said housing cover having a metallized underside coupling with said plurality of conductive posts to form a top ground connection; a plurality of base holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix configuration of the plurality of conducting posts and having base hole diameters greater than those of said conductive posts; and coaxial capacitive air gaps formed between the other ends of said plurality of conducting posts and the base hole side walls for series tuning said plurality of conducting posts.

Claim 23

A structure for isolating between spaced apart microwave circuit components and transmission media located on a top surface of a microstrip substrate, comprising a housing base supporting the microstrip substrate; a housing cover sealed to said housing metal base over the microstrip substrate and forming an air cavity between the top surface of the substrate and said housing cover; a plurality of conducting posts forming a periodic array arranged orthogonally to the plane of the microstrip substrate and extending between the microstrip substrate and said housing cover; wherein said periodic array of conducting posts are configured as a two-dimensional matrix, said structure further comprising: wherein said plurality of conducting posts are fixedly attached at one end to said housing cover, said housing cover having a metallized underside coupling with said plurality of conductive posts to form a top ground connection; a plurality of base holes formed in the microstrip substrate and housing metal base corresponding to said two-dimensional matrix configuration of the plurality of conducting posts and having base hole diameters greater than those of said conductive posts; and coaxial capacitive air gaps formed between the other ends of said plurality of conducting posts and the base hole side walls for series tuning said plurality of conducting posts.

Claim 24

A structure according to claim 17, wherein said plurality of conducting posts are integrally formed with said housing cover via metal fabrication techniques.

Claim 25

A structure according to claim 18, wherein said plurality of conducting posts are integrally formed with said housing cover via metal fabrication techniques.

Claim 26

A structure according to claim 19, wherein the spaced apart microwave circuit components and transmission media arranged on the microstrip substrate spaced from said plurality of conducting posts.

Claim 27

A structure for preventing in-band guided wave propagation, generated from spaced apart microwave circuit components and transmission media, within a dielectric substrate, comprising: a top surface metallization for the dielectric substrate; co-planar transmission lines formed on said top surface metallization for coupling the circuit components; a bottom surface metallization for the dielectric substrate; a periodic array of metal plated via holes formed in said dielectric substrate for providing top surface to bottom surface conduction paths to prevent in-band guided wave propagation within the dielectric substrate.

Claim 28

A structure for preventing in-band guided wave propagation, generated from spaced apart microwave circuit components and transmission media, within a dielectric substrate, comprising: a top surface metallization for the dielectric substrate; co-planar transmission lines formed on said top surface metallization for coupling the circuit components; a bottom surface metallization for the dielectric substrate; a periodic array of metal plated via holes formed in said dielectric substrate for providing top surface to bottom surface conduction paths to prevent in-band guided wave propagation within the dielectric substrate.

Claim 29

A structure according to claim 21, wherein said top and bottom metallizations are electroplated chromium/gold compositions.

Claim 30

A structure according to claim 21, wherein an annular air gap is fabricated between the top terminations of said periodic array of metal plated via holes and said top surface metallization to series resonance tune the metal plated via holes to provide increased high frequency isolation.

Claim 31

A waveguide mode band rejection filter structure for in-substrate and above-substrate isolation of spaced apart microwave circuit components and transmission media, comprising: a housing base; a dielectric substrate having top and bottom surface metallization supported on said housing base; a housing cover, having a metallized underside, sealed to said housing base over the dielectric substrate; an air cavity formed between the top surface metallization and the metallized underside of said housing cover; a plurality of conducting posts configured in a two dimensional periodic array, said plurality of conductive posts fixedly attached and electrically coupling at one end to the metallized underside of said housing cover; said plurality of conducting posts further extending substantially vertically toward the dielectric substrate; capacitive air gaps formed between the other ends of the plurality of conducting posts and the top surface metallization for tuning said plurality of conducting posts to reject above substrate waveguide mode propagation; and a periodic array of metal plated via holes formed in the dielectric substrate for providing top surface to bottom surface conduction paths to reject in-band guided wave propagation within the dielectric substrate.

Claim 32

A waveguide mode band rejection filter structure for in-substrate and above-substrate isolation of spaced apart microwave circuit components and transmission media, comprising: a housing base; a dielectric substrate having top and bottom surface metallization supported on said housing base; a housing cover, having a metallized underside, sealed to said housing base over the dielectric substrate; an air cavity formed between the top surface metallization and the metallized underside of said housing cover; a plurality of conducting posts configured in a two dimensional periodic array, said plurality of conductive posts fixedly attached and electrically coupling at one end to the metallized underside of said housing cover; said plurality of conducting posts further extending substantially vertically toward the dielectric substrate; capacitive air gaps formed between the other ends of the plurality of conducting posts and the top surface metallization for tuning said plurality of conducting posts to reject above substrate waveguide mode propagation; and a periodic array of metal plated via holes formed in the dielectric substrate for providing top surface to bottom surface conduction paths to reject in-band guided wave propagation within the dielectric substrate.

Claim 33

A filter structure according to claim 24, wherein the plurality of conducting posts and the periodic array of metal plated vias are offset from each other.